公开(公告)号：US06396975B1

公开(公告)日：2002-05-28

申请号：US09489264

申请日：2000-01-21

Applicant: Robert L. Wood ,  Edward A. Hill ,  Ramaswamy Mahadevan

Inventor： Robert L. Wood ,  Edward A. Hill ,  Ramaswamy Mahadevan

IPC: G02B626

CPC classification number: G02B6/3572 ,  G02B6/3512 ,  G02B6/3546 ,  G02B6/3582 ,  G02B6/3584 ,  G02B26/085

Abstract: A microelectromechanical structure capable of switching optical signals from an input fiber to one of two or more output fibers. In one embodiment, the MEMS optical cross-connect switch comprises a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a rotational magnetic field source, such as a variably controlled magnetic field source. The rotational magnetic field source allows for reliable actuation of the pop-up mirror from a non-reflective state to a reflective state. Additionally the invention is embodied in a MEMS optical cross-connect switch having a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a positioning structure disposed in a fixed positional relationship relative to the first substrate. The positioning structure may comprise a positioning structure extending from a second microelectronic substrate that is in a fixed positional relationship relative to the first microelectronic substrate. The positioning structure serves to restrict further movement of the pop-up mirror when the pop-up mirror has been actuated into a reflective state.

Abstract translation: 一种能够将光信号从输入光纤切换到两个或更多个输出光纤之一的微机电结构。 在一个实施例中，MEMS光学交叉连接开关包括具有设置在基板的表面上的弹出反射镜的第一微电子基板和诸如可变控制的磁场源的旋转磁场源。 旋转磁场源允许将弹出反射镜从非反射状态可靠地致动到反射状态。 另外，本发明体现在具有第一微电子衬底的MEMS光学交叉连接开关中，第一微电子衬底具有设置在衬底的表面上的弹出反射镜和相对于第一衬底以固定位置关系设置的定位结构。 定位结构可以包括从相对于第一微电子衬底处于固定位置关系的第二微电子衬底延伸的定位结构。 当弹起反射镜已经被启动成反射状态时，定位结构用于限制弹出反射镜的进一步移动。

公开(公告)号：US06366186B1

公开(公告)日：2002-04-02

申请号：US09487976

申请日：2000-01-20

Applicant: Edward A. Hill ,  Ramaswamy Mahadevan

Inventor： Edward A. Hill ,  Ramaswamy Mahadevan

IPC: H01H5122

CPC classification number: H01H50/005 ,  H01H67/22 ,  H01H2001/0078 ,  H01H2036/0093

Abstract: A MEMS electrical cross-point switch is provided that includes a microelectronic substrate, a magnetic element attached to the microelectronic substrate that is free to move in a predetermined direction in response to a magnetic field and an electrical element connected to the magnetic element for movement therewith to selectively switch electric current. In one embodiment the magnetic element and the electrical element are connected via a tethering device that acts as a platform for the magnetic and electrical elements. The electrical cross-point switch may also comprise a clamping element that serves to lock the switch in an open or closed position to circumvent the magnetic actuation of the switch. In another embodiment, the invention provides for a MEMS electrical cross-point switching array that includes a microelectronic substrate, a magnetic field source in circuit with said microelectronic substrate, a plurality of first and second electrical lines disposed on the microelectronic substrate in an array formation, and a plurality of the in-plane MEMS electrical cross-point switches as described above disposed at the cross point of a first and second electrical line. In one embodiment the array is configured in a N×N or N×M array having a series of crossing first and second electrical load lines. In another configuration the array has a series of first electrical load lines that extend radially from a central point of reference and a series of second electrical load lines that extend outward, in spoke-like fashion, from the central point of reference.

Abstract translation: 提供了一种MEMS电交叉点开关，其包括微电子衬底，附接到微电子衬底的磁性元件，其响应于磁场而在预定方向上自由移动，并且连接到磁性元件的电气元件用于与其一起运动 以选择性地切换电流。 在一个实施例中，磁性元件和电气元件通过用作磁性元件和电气元件的平台的束缚装置连接。 电交叉点开关还可以包括夹紧元件，其用于将开关锁定在打开或关闭位置，以绕开开关的磁致动。 在另一个实施例中，本发明提供了一种MEMS电交叉点开关阵列，其包括微电子衬底，与所述微电子衬底的电路中的磁场源，设置在微电子衬底上的阵列形成中的多个第一和第二电线 以及设置在第一和第二电线的交叉点处的多个如上所述的面内MEMS电气交叉点开关。 在一个实施例中，阵列被配置在具有一系列交叉的第一和第二电负载线的N×N或N×M阵列中。 在另一种配置中，阵列具有从中心参考点径向延伸的一系列第一电负载线，以及一系列第二电负载线，其以辐射状方式从中心参考点向外延伸。

公开(公告)号：US06333583B1

公开(公告)日：2001-12-25

申请号：US09537588

申请日：2000-03-28

Applicant: Ramaswamy Mahadevan ,  Edward A. Hill ,  Robert L. Wood ,  Allen Cowen

Inventor： Ramaswamy Mahadevan ,  Edward A. Hill ,  Robert L. Wood ,  Allen Cowen

IPC: H01N1000

CPC classification number: B81B3/0024 ,  B81B2201/031 ,  B81B2203/0109 ,  B81B2203/051 ,  F03G7/06 ,  H01H1/0036 ,  H01H61/02 ,  H01H2001/0068 ,  H01H2061/006

Abstract: Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.

Abstract translation: 改进的微机电结构包括微电子衬底上的间隔开的支撑件和在间隔开的支撑件之间延伸的梁，并且在施加热量时膨胀，从而导致梁在间隔开的支撑件之间的位移。 位于梁上的加热器对梁施加热量，并随着梁的移位而与梁一起移位。 因此，可以将热量直接施加到拱形梁上，从而减少加热器与拱形梁之间的热损失。 此外，加热器和拱形梁之间的空气间隙可能不需要被加热，从而允许改善的瞬态热响应。 此外，当拱形梁移位时移动加热器可以通过当拱形梁移位时减小加热器和拱形梁之间的间隔来进一步减少热损失和瞬态热响应。

公开(公告)号：US06400550B1

公开(公告)日：2002-06-04

申请号：US09860213

申请日：2001-05-18

Applicant: Robert L. Wood ,  Vivek Agrawal ,  Ramaswamy Mahadevan ,  Edward A. Hill

Inventor： Robert L. Wood ,  Vivek Agrawal ,  Ramaswamy Mahadevan ,  Edward A. Hill

IPC: H01G501

CPC classification number: H01G5/16 ,  B81B3/0056

Abstract: A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.

Abstract translation: 提供具有第一和第二电容器板，串联移动器和致动器的可变电容器。 第一和第二电容器板被定位成使得第一和第二电容器板以间隔开的关系彼此面对。 串联移动器被配置成响应于环境温度的变化串联地移动第一和第二电容器板，以保持电容器板之间的一致的间隔开的关系。 致动器然后被配置成响应于外部输入而改变第一和第二电容器板之间的间隔开的关系。 因此，可变电容器的电容可以通过增加和减小第一和第二电容器板之间的间隔开的关系来改变。

公开(公告)号：US06367252B1

公开(公告)日：2002-04-09

申请号：US09610047

申请日：2000-07-05

Applicant: Edward A. Hill ,  Vijayakumar Rudrappa Dhuler ,  Allen Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

Inventor： Edward A. Hill ,  Vijayakumar Rudrappa Dhuler ,  Allen Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

IPC: F01B2910

CPC classification number: B81B3/0051 ,  B81B2201/038 ,  B81B2203/0109 ,  B81B2203/056 ,  H01H1/0036 ,  H01H61/00 ,  H01H2061/006

Abstract: In embodiments of the present invention, a microelectromechanical actuator includes a beam having respective first and second ends attached to a substrate and a body disposed between the first and second ends having a sinuous shape. The body includes a portion operative to engage a object of actuation and apply a force thereto in a direction perpendicular to the beam responsive to at least one of a compressive force and a tensile force on the beam. The sinuous shape may be sinusoidal, e.g., a shape approximating a single period of a cosine curve or a single period of a sine curve. The beam may be thermally actuated or driven by another actuator. In other embodiments, a rotary actuator includes first and second beams, a respective one of which has first and second ends attached to a substrate and a body disposed between the first and second ends. Each body includes first and second oppositely inflected portions. The bodies of the first and second beams intersect one another at points at which the first and second oppositely inflected portions of the first and second bodies meet. The bodies of the first and second beams are operative to engage the object of actuation and rotate the object of actuation around the point of intersection responsive to at least one of compressive force and tensile force on the first and second beams. Related methods are also described.

Abstract translation: 在本发明的实施例中，微机电致动器包括具有附接到基板的相应的第一端和第二端的梁，以及设置在具有弯曲形状的第一端和第二端之间的主体。 主体包括可操作地接合致动对象的部分，该部分响应于梁上的压缩力和拉力中的至少一个，沿垂直于梁的方向施加力。 弯曲形状可以是正弦的，例如，近似于余弦曲线的单个周期或正弦曲线的单个周期的形状。 梁可以由另一致动器热致动或驱动。 在其他实施例中，旋转致动器包括第一和第二梁，其中相应的一个具有附接到基板的第一和第二端以及设置在第一和第二端之间的主体。 每个主体包括第一和第二相对弯曲的部分。 第一和第二梁的主体在第一和第二主体的第一和第二相对弯曲部分相交的点处彼此相交。 第一和第二梁的主体可操作以接合致动对象，并且响应于第一和第二梁上的压缩力和拉力中的至少一个而使作动点周围的相对点旋转。 还描述了相关方法。

公开(公告)号：US06496351B2

公开(公告)日：2002-12-17

申请号：US09822128

申请日：2001-03-30

Applicant: Edward A. Hill ,  Ramaswamy Mahadevan

Inventor： Edward A. Hill ,  Ramaswamy Mahadevan

IPC: H01G501

CPC classification number: H01H1/0036 ,  B81B3/001 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/0307 ,  F03G7/06 ,  H01G5/16 ,  H01G5/18 ,  H01H59/0009 ,  H01H61/02 ,  H01H2059/0063 ,  H01H2059/0072 ,  H01H2059/0081 ,  H01H2061/006

Abstract: MEMS devices include a substrate, an anchor attached to the substrate, and a multilayer member attached to the anchor and spaced apart from the substrate. The multilayer member can have a first portion that is remote from the anchor and that curls away from the substrate and a second portion that is adjacent the anchor that contacts the substrate. Related methods are also disclosed.

公开(公告)号：US06360539B1

公开(公告)日：2002-03-26

申请号：US09542672

申请日：2000-04-05

Applicant: Edward A. Hill ,  Vijayakumar R. Dhuler ,  Allen B. Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

Inventor： Edward A. Hill ,  Vijayakumar R. Dhuler ,  Allen B. Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

IPC: F01B2910

CPC classification number: H01H1/0036 ,  H01H61/02 ,  H01H2061/006

Abstract: Microelectromechanical actuators include a substrate, spaced apart supports on the substrate and a thermal arched beam that extends between the spaced apart supports and that further arches upon heating thereof, for movement along the substrate. One or more driven arched beams are coupled to the thermal arched beam. The end portions of the driven arched beams move relative to one another to change the arching of the driven arched beams in response to the further arching of the thermal arched beam, for movement of the driven arched beams. A driven arched beam also includes an actuated element at an intermediate portion thereof between the end portions, wherein a respective actuated element is mechanically coupled to the associated driven arched beam for movement therewith, and is mechanically decoupled from the remaining driven arched beams for movement independent thereof.

Abstract translation: 微机电致动器包括衬底，衬底上的间隔开的支撑件和在间隔开的支撑件之间延伸的热拱形梁，并且在其加热时进一步拱形地沿着衬底运动。 一个或多个被驱动的弓形梁联接到热拱形梁。 被驱动的拱形梁的端部相对于彼此移动，以响应于热拱形梁的进一步拱形来改变被驱动的弓形梁的拱形，以便驱动的拱形梁的运动。 被驱动的弓形梁还包括在其端部之间的中间部分处的致动元件，其中相应的致动元件机械地联接到相关联的被驱动的弓形梁以与其一起运动，并且与剩余的被驱动的弓形梁机械地分离以便独立运动 其中。

公开(公告)号：US06275320B1

公开(公告)日：2001-08-14

申请号：US09405789

申请日：1999-09-27

Applicant: Vijayakumar R. Dhuler ,  Edward A. Hill ,  Ramaswamy Mahadevan ,  Mark David Walters ,  Robert L. Wood

Inventor： Vijayakumar R. Dhuler ,  Edward A. Hill ,  Ramaswamy Mahadevan ,  Mark David Walters ,  Robert L. Wood

IPC: G02B2600

CPC classification number: G02B26/0841 ,  B81B3/0054 ,  B81B2201/038 ,  B81B2201/047 ,  G02B6/266

Abstract: A MEMS (Micro Electro Mechanical System) variable optical attenuator is provided that is capable of optical attenuation over a full range of optical power. The MEMS variable optical attenuator comprises a microelectronic substrate, a MEMS actuator and an optical shutter. The MEMS variable optical attenuator may also comprise a clamping element capable of locking the optical shutter at a desired attenuation position. The variable light attenuator is capable of attenuating optical beams that have their optical axis running parallel and perpendicular to the substrate. Additionally, the MEMS actuator of the present invention may comprise an array of MEMS actuators capable of supplying the optical shutter with greater displacement distances and, thus a fuller range of optical attenuation. In one embodiment of the invention, the MEMS actuator comprises a thermal arched beam actuator. Additionally, the variable optical attenuator of the present invention may be embodied in a thermal bimorph cantilever structure. This alternate embodiment includes a microelectronic substrate and a thermal bimorph cantilever structure having at least two materials of different thermal coefficient of expansion. The thermal bimorph is responsive to thermal activation and moves in the direction of the material having the lower thermal coefficient expansion. Upon activation, the thermal bimorph intercepts the path of the optical beam and provides for the desired level of optical attenuation. The invention also provides for a method of optical attenuation and a method for fabricating an optical attenuator in accordance with the described structures.

Abstract translation: 提供了一种能够在全光范围内进行光衰减的MEMS（微机电系统）可变光衰减器。 MEMS可变光衰减器包括微电子衬底，MEMS致动器和光学快门。 MEMS可变光衰减器还可以包括能够将光学快门锁定在期望的衰减位置的夹紧元件。 可变光衰减器能够衰减其光轴平行且垂直于衬底的光束。 另外，本发明的MEMS致动器可以包括MEMS致动器的阵列，其能够向光学快门提供更大的位移距离，并且因此具有更宽的光学衰减范围。 在本发明的一个实施例中，MEMS致动器包括热拱形梁致动器。 另外，本发明的可变光衰减器可以以热双压电晶片悬臂结构体现。 该替代实施例包括具有不同热膨胀系数的至少两种材料的微电子衬底和热双压电晶片悬臂结构。 热双压电晶体响应于热激活并沿具有较低热系数膨胀的材料的方向移动。 在激活时，热双压电晶片截取光束的路径并提供所需的光衰减水平。 本发明还提供了一种光衰减的方法以及根据所述结构制造光衰减器的方法。

公开(公告)号：US09601677B2

公开(公告)日：2017-03-21

申请号：US13048191

申请日：2011-03-15

Applicant: Edward P. Siivola ,  Ramaswamy Mahadevan

Inventor： Edward P. Siivola ,  Ramaswamy Mahadevan

IPC: H01L35/32

CPC classification number: H01L35/32

Abstract: A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.

公开(公告)号：US20110220162A1

公开(公告)日：2011-09-15

申请号：US13048191

申请日：2011-03-15

Applicant: Edward P. Siivola ,  Ramaswamy Mahadevan

Inventor： Edward P. Siivola ,  Ramaswamy Mahadevan

IPC: H01L35/28

CPC classification number: H01L35/32

Abstract: A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.

Abstract translation: 热电结构可以包括导热基板和布置在导热基板的表面上的多个热电元件。 此外，每个热电元件可以相对于导热基板的表面是不平行的和非正交的。 例如，每个热电元件可以是平面热电元件，并且每个热电元件的平面可以相对于导热基板的表面倾斜地取向。