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    ENGINE COMPONENT WITH FILM COOLING
    121.
    发明申请
    ENGINE COMPONENT WITH FILM COOLING 审中-公开

    公开(公告)号：US20170145921A1

    公开(公告)日：2017-05-25

    申请号：US14950677

    申请日：2015-11-24

    Applicant: General Electric Company

    Inventor： Ronald Scott Bunker

    IPC: F02C7/141 ,  F01D5/18 ,  F23R3/00

    CPC classification number: F02C7/141 ,  F01D5/186 ,  F01D25/12 ,  F05D2260/202 ,  F05D2260/2212 ,  F23R3/005 ,  Y02T50/672 ,  Y02T50/676

    Abstract: An engine component for a gas turbine engine which generates a hot combustion gas flow adjacent a hot surface and provides a cooling fluid flow adjacent a cooling surface comprises a wall separating the hot combustion gas flow and the cooling fluid flow. At least one concavity is provided in the cooling surface and at least one film hole is provided in the cooling surface providing the cooling fluid flow to the hot surface. An inlet for the film hole is spaced from the at least one concavity, located upstream of the at least one concavity and in alignment with the at least one concavity relative to the cooling fluid flow.

    Components with micro cooled patterned coating layer and methods of manufacture
    122.
    发明授权
    Components with micro cooled patterned coating layer and methods of manufacture 有权
    具有微冷却图案化涂层的组件和制造方法

    公开(公告)号：US09562436B2

    公开(公告)日：2017-02-07

    申请号：US13663989

    申请日：2012-10-30

    Applicant: General Electric Company

    Inventor： Ronald Scott Bunker ,  Scott Andrew Weaver

    IPC: F01D5/14 ,  F01D5/18 ,  F01D5/28 ,  B05D1/02 ,  B05D1/32 ,  C23C4/18 ,  C23C14/58 ,  C23C14/04 ,  C23C24/04 ,  B05D3/06 ,  B05D7/00

    CPC classification number: F01D5/18 ,  B05D1/02 ,  B05D3/06 ,  B05D7/50 ,  C23C4/01 ,  C23C4/073 ,  C23C4/18 ,  C23C14/042 ,  C23C14/5886 ,  C23C24/04 ,  F01D5/286 ,  F01D5/288 ,  Y02T50/672 ,  Y02T50/676 ,  Y10T428/13

    Abstract: A manufacturing method includes providing a substrate with an outer surface and at least one interior space, selectively deposited a coating on a portion of the substrate to form a selectively deposited coating having one or more grooves formed therein. The method further includes processing at least a portion of the surface of the selectively deposited coating to plastically deform the selectively deposited coating in the vicinity of the top of a respective groove. An additional coating is applied over at least a portion of the surface of the selectively deposited coating. A component is disclosed and includes a substrate, a selectively deposited coating disposed on at least a portion of the substrate, and defining one or more grooves therein, and an additional coating disposed over the selectively deposited coating. The substrate, the selectively deposited coating and the additional coating defining one or more channels for cooling the component.

    Abstract translation: 一种制造方法包括提供具有外表面和至少一个内部空间的基底，在基底的一部分上选择性地沉积涂层以形成其中形成有一个或多个凹槽的选择性沉积的涂层。 该方法还包括处理选择性沉积涂层的表面的至少一部分，使相应凹槽顶部附近的选择性沉积涂层塑性变形。 在选择性沉积的涂层的至少一部分表面上施加另外的涂层。 公开了一种组件，并且包括基板，设置在基板的至少一部分上的选择性沉积的涂层，并且在其中限定一个或多个凹槽，以及设置在选择性沉积的涂层上的附加涂层。 衬底，选择性沉积的涂层和附加涂层限定用于冷却部件的一个或多个通道。

    Components with re-entrant shaped cooling channels and methods of manufacture
    124.
    发明授权
    Components with re-entrant shaped cooling channels and methods of manufacture 有权
    具有入口形状冷却通道的组件和制造方法

    公开(公告)号：US09249491B2

    公开(公告)日：2016-02-02

    申请号：US13669922

    申请日：2012-11-06

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Ronald Scott Bunker ,  Dennis Michael Gray

    IPC: B32B3/12 ,  C23C4/02 ,  B23P15/04 ,  B24C1/04 ,  C23C4/12 ,  F01D5/18 ,  C23C24/04

    CPC classification number: C23C4/02 ,  B23P15/04 ,  B23P2700/13 ,  B24C1/04 ,  C23C4/12 ,  C23C24/04 ,  F01D5/186 ,  F05D2230/90 ,  Y02T50/67 ,  Y02T50/672 ,  Y02T50/676 ,  Y10T29/49323 ,  Y10T29/4935

    Abstract: A method of fabricating a component is provided. The component includes a substrate that has at least one interior space. The method includes forming one or more grooves in the component. Each groove extends at least partially along an outer surface of the substrate and narrows at an opening thereof, such that each groove is re-entrant shaped. A cross-sectional area A of each groove is in a range of about 2 to about 3 times an area R=W*D, where W is the width of the opening and D is the depth of the re-entrant-shaped groove. Components with grooves formed in the substrate and components with grooves formed at least partially in a structural coating are also provided.

    Abstract translation: 提供了一种制造组件的方法。 该组件包括具有至少一个内部空间的基板。 该方法包括在该部件中形成一个或多个凹槽。 每个凹槽至少部分地沿着衬底的外表面延伸并在其开口处变窄，使得每个凹槽是重新成形的。 每个凹槽的横截面面积A在面积R = W * D的约2至约3倍的范围内，其中W是开口的宽度，D是凹入槽的深度。 还提供了具有形成在基底中的凹槽的部件和至少部分地形成在结构涂层中的具有凹槽的部件。

    Methods of forming cooling channels using backstrike protection
    125.
    发明授权
    Methods of forming cooling channels using backstrike protection 有权
    使用反冲击保护形成冷却通道的方法

    公开(公告)号：US09242294B2

    公开(公告)日：2016-01-26

    申请号：US13628204

    申请日：2012-09-27

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Eric Richard Bonini ,  Ronald Scott Bunker

    IPC: B22D25/02 ,  F01D5/18

    CPC classification number: B22D25/02 ,  B22C9/10 ,  B22D29/001 ,  B23H9/10 ,  B23P15/04 ,  B24C1/006 ,  B24C1/045 ,  B24C3/32 ,  F01D5/186 ,  F01D5/187 ,  F05D2230/11 ,  F05D2230/12 ,  F05D2230/13 ,  F05D2230/21 ,  F05D2260/202 ,  Y10T29/49352 ,  Y10T29/49815

    Abstract: A method of forming cooling channels in a component is provided. The component has a substrate having outer and inner surfaces. The inner surface defines at least one interior space, and a core is disposed within each interior space. The method includes forming at least one access hole in the substrate, while the core is disposed within the respective interior space, removing the core from the respective interior space, and forming at least one groove in the outer substrate surface (before or after the core is removed). Each access hole connects the groove in fluid communication with the respective interior space. The method further includes disposing a coating over at least a portion of the outer substrate surface, where the coating includes at least a structural coating that extends over the groove(s), such that the groove(s) and the structural coating together define one or more channels configured to convey a coolant from the respective interior space(s) for cooling the component.

    Abstract translation: 提供了一种在部件中形成冷却通道的方法。 该组件具有具有外表面和内表面的基底。 内表面限定至少一个内部空间，并且芯设置在每个内部空间内。 所述方法包括在所述基板中形成至少一个进入孔，同时所述芯设置在相应的内部空间内，从相应的内部空间移除所述芯，并在所述外部基板表面（在所述芯部之前或之后）形成至少一个凹槽 被删除）。 每个进入孔将凹槽与相应的内部空间流体连通。 该方法还包括在外基材表面的至少一部分上设置涂层，其中涂层至少包括在凹槽上延伸的结构涂层，使得凹槽和结构涂层一起限定一个 或多个通道，其构造成从相应的内部空间传送冷却剂以冷却部件。

    METHODS OF FORMING COOLING CHANNELS USING BACKSTRIKE PROTECTION
    127.
    发明申请
    METHODS OF FORMING COOLING CHANNELS USING BACKSTRIKE PROTECTION 有权
    使用背景保护形成冷却通道的方法

    公开(公告)号：US20150367460A1

    公开(公告)日：2015-12-24

    申请号：US13628204

    申请日：2012-09-27

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Eric Richard Bonini ,  Ronald Scott Bunker

    IPC: B23P15/26

    CPC classification number: B22D25/02 ,  B22C9/10 ,  B22D29/001 ,  B23H9/10 ,  B23P15/04 ,  B24C1/006 ,  B24C1/045 ,  B24C3/32 ,  F01D5/186 ,  F01D5/187 ,  F05D2230/11 ,  F05D2230/12 ,  F05D2230/13 ,  F05D2230/21 ,  F05D2260/202 ,  Y10T29/49352 ,  Y10T29/49815

    Abstract: A method of forming cooling channels in a component is provided. The component has a substrate having outer and inner surfaces. The inner surface defines at least one interior space, and a core is disposed within each interior space. The method includes forming at least one access hole in the substrate, while the core is disposed within the respective interior space, removing the core from the respective interior space, and forming at least one groove in the outer substrate surface (before or after the core is removed). Each access hole connects the groove in fluid communication with the respective interior space. The method further includes disposing a coating over at least a portion of the outer substrate surface, where the coating includes at least a structural coating that extends over the groove(s), such that the groove(s) and the structural coating together define one or more channels configured to convey a coolant from the respective interior space(s) for cooling the component.

    Abstract translation: 提供了一种在部件中形成冷却通道的方法。 该组件具有具有外表面和内表面的基底。 内表面限定至少一个内部空间，并且芯设置在每个内部空间内。 所述方法包括在所述基板中形成至少一个进入孔，同时所述芯设置在相应的内部空间内，从相应的内部空间移除所述芯，并在所述外部基板表面（在所述芯部之前或之后）形成至少一个凹槽 被删除）。 每个进入孔将凹槽与相应的内部空间流体连通。 该方法还包括在外基材表面的至少一部分上设置涂层，其中涂层至少包括在凹槽上延伸的结构涂层，使得凹槽和结构涂层一起限定一个 或多个通道，其构造成从相应的内部空间传送冷却剂以冷却部件。

    Micro-channel coating deposition system and method for using the same
    128.
    发明授权
    Micro-channel coating deposition system and method for using the same 有权
    微通道涂层沉积系统及其使用方法

    公开(公告)号：US08974859B2

    公开(公告)日：2015-03-10

    申请号：US13627158

    申请日：2012-09-26

    Applicant: General Electric Company

    Inventor： Ronald Scott Bunker

    IPC: C23C4/12 ,  C23C4/00 ,  B05D7/22 ,  B05D3/00 ,  F01D5/18 ,  F01D5/28

    CPC classification number: C23C4/005 ,  B05D3/00 ,  B05D3/042 ,  B05D7/22 ,  C23C4/01 ,  C23C4/073 ,  C23C4/11 ,  C23C4/129 ,  F01D5/18 ,  F01D5/187 ,  F01D5/28 ,  F01D5/288 ,  F05D2230/31 ,  F05D2260/204 ,  Y02T50/672 ,  Y02T50/676

    Abstract: Methods of pressure coating a target surface of an article comprising one or more grooves formed in an outer surface of an article include fluidly connecting a pressure masker comprising a pressurized masking fluid to one or more coolant supply holes on a first side of the article. The one or more coolant supply holes in fluidic communication with the one or more grooves. Passing the pressurized masking fluid through the one or more grooves from the first side to a second side comprising the target surface at a pressure less than the coating pressure of the coating material, and, coating the target surface with the coating material to allow the coating material to bridge over the one or more grooves and form one or more micro-channels. The pressurized masking fluid passing through the one or more grooves prevents the coating material from permanently altering a cross sectional area of the one or more grooves along its length.

    Abstract translation: 包括形成在制品的外表面中的一个或多个凹槽的制品的目标表面的压力涂覆方法包括将包括加压掩模流体的压力掩模流体连接到制品第一侧上的一个或多个冷却剂供应孔。 所述一个或多个冷却剂供应孔与所述一个或多个凹槽流体连通。 将加压掩模流体通过一个或多个凹槽从包含目标表面的第一侧到第二侧，压力小于涂覆材料的涂覆压力，并用涂覆材料涂覆目标表面以允许涂层 材料跨越所述一个或多个凹槽并形成一个或多个微通道。 通过一个或多个凹槽的加压掩模流体防止涂层材料沿其长度永久地改变一个或多个凹槽的横截面面积。

    METHOD AND SYSTEM FOR GAS TEMPERATURE MEASUREMENT
    129.
    发明申请
    METHOD AND SYSTEM FOR GAS TEMPERATURE MEASUREMENT 有权
    气温测量方法与系统

    公开(公告)号：US20150049786A1

    公开(公告)日：2015-02-19

    申请号：US13969186

    申请日：2013-08-16

    Applicant: General Electric Company

    Inventor： Guanghua Wang ,  Nirm Velumylum Nirmalan ,  Ronald Scott Bunker ,  Todd Garrett Wetzel ,  Robert Michael Zacharias ,  Shawn David Wehe ,  Robert David Briggs

    IPC: G01K13/02 ,  G01J5/10 ,  G01M15/14

    CPC classification number: G01J5/10 ,  G01J5/0014 ,  G01J5/0887 ,  G01J5/60 ,  G01M15/14

    Abstract: A temperature measurement system includes a plurality of filaments. The plurality of filaments are configured to emit thermal radiation in a relatively broad and substantially continuous wavelength band at least partially representative of a temperature of the plurality of filaments. A first and second portion of the filaments has a differing first and a second diameter and/or emissivity, respectively. The system also includes a detector array configured to generate electrical signals at least partially representative of the thermal radiation received from the filaments. The system further includes a controller communicatively coupled to the detector array configured to transform the first electrical signals to a first temperature indication at least partially as a function of the first diameter and/or first emissivity and transform the second electrical signals to a second temperature indication at least partially as a function of the second diameter and/or emissivity.

    Abstract translation: 温度测量系统包括多个细丝。 多根细丝构造成发射至少部分代表多个细丝的温度的相对宽且基本上连续的波长带中的热辐射。 长丝的第一和第二部分分别具有不同的第一和第二直径和/或发射率。 该系统还包括检测器阵列，该检测器阵列被配置为产生至少部分代表从灯丝接收的热辐射的电信号。 所述系统还包括通信地耦合到所述检测器阵列的控制器，所述检测器阵列被配置为至少部分地将所述第一电信号转换为第一温度指示作为所述第一直径和/或第一发射率的函数，并将所述第二电信号转换为第二温度指示 至少部分地作为第二直径和/或发射率的函数。

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