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    Axial compressor and method for controlling stage-to-stage leakage therein
    1.
    发明授权
    Axial compressor and method for controlling stage-to-stage leakage therein 有权
    轴流式压缩机及其阶段级泄漏控制方法

    公开(公告)号：US09470098B2

    公开(公告)日：2016-10-18

    申请号：US13834745

    申请日：2013-03-15

    Applicant: General Electric Company

    Inventor： Jeremy Peter Latimer ,  Eric Richard Bonini ,  John Duong

    IPC: F01D11/00 ,  F01D5/30 ,  F01D5/08

    CPC classification number: F01D5/3007 ,  F01D5/085

    Abstract: The present application and the resultant patent provide an axial compressor for a gas turbine engine. The compressor may include a rotor disk positioned along an axis of the compressor. The rotor disk may include a slot defined about a radially outer surface of the rotor disk, and the slot may include a slot planar surface facing away from the rotor disk. The compressor also may include a compressor blade coupled to the rotor disk via the slot. The compressor blade may include a platform positioned over the radially outer surface of the rotor disk, and the platform may include a platform sealing edge facing toward the rotor disk. The compressor further may include a gap defined between the platform sealing edge and the slot planar surface, wherein the gap is configured to control a flow of leakage air from a high-pressure side of the compressor blade to a low-pressure side of the compressor blade. The present application and the resultant patent further provide a related method of controlling stage-to-stage leakage in an axial compressor of a gas turbine engine.

    Abstract translation: 本申请和所得专利提供了一种用于燃气涡轮发动机的轴向压缩机。 压缩机可以包括沿着压缩机的轴线定位的转子盘。 转子盘可以包括围绕转子盘的径向外表面限定的槽，并且槽可以包括面向转子盘的槽平面。 压缩机还可以包括经由槽连接到转子盘的压缩机叶片。 压缩机叶片可以包括定位在转子盘的径向外表面上方的平台，并且平台可以包括面向转子盘的平台密封边缘。 压缩机还可以包括限定在平台密封边缘和槽平面之间的间隙，其中间隙构造​​成控制从压缩机叶片的高压侧到压缩机的低压侧的泄漏空气流 刀。 本申请和所得专利进一步提供了一种在燃气轮机的轴向压缩机中控制级间泄漏的相关方法。

    Components with cooling channels and methods of manufacture
    2.
    发明授权
    Components with cooling channels and methods of manufacture 有权

    公开(公告)号：US10822956B2

    公开(公告)日：2020-11-03

    申请号：US14858244

    申请日：2015-09-18

    Applicant: General Electric Company

    Inventor： Ronald Scott Bunker ,  Eric Richard Bonini

    IPC: F01D5/08 ,  F01D5/18 ,  B23K26/388 ,  B23K26/38 ,  B23K26/384 ,  B23K26/382 ,  F01D9/04 ,  F01D25/28 ,  F01D25/30

    Abstract: A component is provided and includes a substrate comprising an outer and an inner surface, where the inner surface defines at least one hollow, interior space. The component defines one or more grooves, where each groove extends at least partially along the outer surface of the substrate and has a base and a top. The base is wider than the top, such that each groove comprises a re-entrant shaped groove. One or more access holes are formed through the base of a respective groove, to connect the groove in fluid communication with the respective hollow interior space. Each access hole has an exit diameter D that exceeds the opening width d of the top of the respective groove. The diameter D is an effective diameter based on the area enclosed. The component further includes at least one coating disposed over at least a portion of the surface of the substrate, wherein the groove(s) and the coating together define one or more re-entrant shaped channels for cooling the component. A method for manufacturing the component is also provided. A method for manufacturing a component is also provided, where the groove and the access hole(s) are machined as a single continuous process, such that the groove and the access hole(s) form a continuous cooling passage.

    COMPONENTS WITH COOLING CHANNELS AND METHODS OF MANUFACTURE
    6.
    发明申请
    COMPONENTS WITH COOLING CHANNELS AND METHODS OF MANUFACTURE 审中-公开

    公开(公告)号：US20160010464A1

    公开(公告)日：2016-01-14

    申请号：US14858244

    申请日：2015-09-18

    Applicant: General Electric Company

    Inventor： Ronald Scott Bunker ,  Eric Richard Bonini

    IPC: F01D5/18 ,  F01D25/28 ,  F01D25/30 ,  F01D9/04

    Abstract: A component is provided and includes a substrate comprising an outer and an inner surface, where the inner surface defines at least one hollow, interior space. The component defines one or more grooves, where each groove extends at least partially along the outer surface of the substrate and has a base and a top. The base is wider than the top, such that each groove comprises a re-entrant shaped groove. One or more access holes are formed through the base of a respective groove, to connect the groove in fluid communication with the respective hollow interior space. Each access hole has an exit diameter D that exceeds the opening width d of the top of the respective groove. The diameter D is an effective diameter based on the area enclosed. The component further includes at least one coating disposed over at least a portion of the surface of the substrate, wherein the groove(s) and the coating together define one or more re-entrant shaped channels for cooling the component. A method for manufacturing the component is also provided. A method for manufacturing a component is also provided, where the groove and the access hole(s) are machined as a single continuous process, such that the groove and the access hole(s) form a continuous cooling passage.

    Methods of forming cooling channels using backstrike protection
    8.
    发明授权
    Methods of forming cooling channels using backstrike protection 有权
    使用反冲击保护形成冷却通道的方法

    公开(公告)号：US09242294B2

    公开(公告)日：2016-01-26

    申请号：US13628204

    申请日：2012-09-27

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Eric Richard Bonini ,  Ronald Scott Bunker

    IPC: B22D25/02 ,  F01D5/18

    CPC classification number: B22D25/02 ,  B22C9/10 ,  B22D29/001 ,  B23H9/10 ,  B23P15/04 ,  B24C1/006 ,  B24C1/045 ,  B24C3/32 ,  F01D5/186 ,  F01D5/187 ,  F05D2230/11 ,  F05D2230/12 ,  F05D2230/13 ,  F05D2230/21 ,  F05D2260/202 ,  Y10T29/49352 ,  Y10T29/49815

    Abstract: A method of forming cooling channels in a component is provided. The component has a substrate having outer and inner surfaces. The inner surface defines at least one interior space, and a core is disposed within each interior space. The method includes forming at least one access hole in the substrate, while the core is disposed within the respective interior space, removing the core from the respective interior space, and forming at least one groove in the outer substrate surface (before or after the core is removed). Each access hole connects the groove in fluid communication with the respective interior space. The method further includes disposing a coating over at least a portion of the outer substrate surface, where the coating includes at least a structural coating that extends over the groove(s), such that the groove(s) and the structural coating together define one or more channels configured to convey a coolant from the respective interior space(s) for cooling the component.

    Abstract translation: 提供了一种在部件中形成冷却通道的方法。 该组件具有具有外表面和内表面的基底。 内表面限定至少一个内部空间，并且芯设置在每个内部空间内。 所述方法包括在所述基板中形成至少一个进入孔，同时所述芯设置在相应的内部空间内，从相应的内部空间移除所述芯，并在所述外部基板表面（在所述芯部之前或之后）形成至少一个凹槽 被删除）。 每个进入孔将凹槽与相应的内部空间流体连通。 该方法还包括在外基材表面的至少一部分上设置涂层，其中涂层至少包括在凹槽上延伸的结构涂层，使得凹槽和结构涂层一起限定一个 或多个通道，其构造成从相应的内部空间传送冷却剂以冷却部件。

    METHODS OF FORMING COOLING CHANNELS USING BACKSTRIKE PROTECTION
    10.
    发明申请
    METHODS OF FORMING COOLING CHANNELS USING BACKSTRIKE PROTECTION 有权
    使用背景保护形成冷却通道的方法

    公开(公告)号：US20150367460A1

    公开(公告)日：2015-12-24

    申请号：US13628204

    申请日：2012-09-27

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Eric Richard Bonini ,  Ronald Scott Bunker

    IPC: B23P15/26

    CPC classification number: B22D25/02 ,  B22C9/10 ,  B22D29/001 ,  B23H9/10 ,  B23P15/04 ,  B24C1/006 ,  B24C1/045 ,  B24C3/32 ,  F01D5/186 ,  F01D5/187 ,  F05D2230/11 ,  F05D2230/12 ,  F05D2230/13 ,  F05D2230/21 ,  F05D2260/202 ,  Y10T29/49352 ,  Y10T29/49815

    Abstract: A method of forming cooling channels in a component is provided. The component has a substrate having outer and inner surfaces. The inner surface defines at least one interior space, and a core is disposed within each interior space. The method includes forming at least one access hole in the substrate, while the core is disposed within the respective interior space, removing the core from the respective interior space, and forming at least one groove in the outer substrate surface (before or after the core is removed). Each access hole connects the groove in fluid communication with the respective interior space. The method further includes disposing a coating over at least a portion of the outer substrate surface, where the coating includes at least a structural coating that extends over the groove(s), such that the groove(s) and the structural coating together define one or more channels configured to convey a coolant from the respective interior space(s) for cooling the component.

    Abstract translation: 提供了一种在部件中形成冷却通道的方法。 该组件具有具有外表面和内表面的基底。 内表面限定至少一个内部空间，并且芯设置在每个内部空间内。 所述方法包括在所述基板中形成至少一个进入孔，同时所述芯设置在相应的内部空间内，从相应的内部空间移除所述芯，并在所述外部基板表面（在所述芯部之前或之后）形成至少一个凹槽 被删除）。 每个进入孔将凹槽与相应的内部空间流体连通。 该方法还包括在外基材表面的至少一部分上设置涂层，其中涂层至少包括在凹槽上延伸的结构涂层，使得凹槽和结构涂层一起限定一个 或多个通道，其构造成从相应的内部空间传送冷却剂以冷却部件。

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