公开(公告)号：US5352325A

公开(公告)日：1994-10-04

申请号：US98637

申请日：1993-07-28

Applicant: Yoji Kato

Inventor： Yoji Kato

IPC: H05K3/00 ,  H05K3/06 ,  H05K3/42 ,  B44C1/22 ,  B23F1/00 ,  B29C37/00

CPC classification number: H05K3/002 ,  H05K2201/09509 ,  H05K2201/09836 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0554 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/1184 ,  H05K3/427

Abstract: The present invention is a method of forming micro through holes in printed wiring board substrate materials by means of chemical etching.In a typical printed wiring board substrate material consisting of a resinous dielectric base material, (which may or may not incorporate glass fibers), clad on both sides by a conductive layer, after the dielectric material in specific locations where through holes are to be formed is exposed by typical processes in which the conductor layer is selectively removed by etching, said exposed dielectric material is first softened, then removed by chemical etching involving several steps and procedures as well as a variety of chemical solutions, under vibratory agitation, forming through holes in said locations of 100 microns diameter or less.Employing the method of the present invention it is possible to determine the position, size and shape of the through hole required and also by means of plating to connect the conductive layers through the dielectric forming micro plated through holes in printed wiring boards.

Abstract translation: 本发明是通过化学蚀刻在印刷线路板基板材料中形成微通孔的方法。 在由树脂电介质基材（其可以或可以不包括玻璃纤维）组成的典型的印刷线路板基板材料中，在导电层的两侧上包覆在介电材料在要形成通孔的特定位置之后 通过通过蚀刻选择性地去除导体层的典型工艺暴露，首先软化所述暴露的电介质材料，然后通过涉及几个步骤和程序的化学蚀刻以及各种化学溶液在振动搅拌下除去，形成通孔 在直径为100微米或更小的所述位置。 采用本发明的方法，可以确定所需通孔的位置，尺寸和形状，并且还可以通过电镀来连接通过印刷电路板中的电介质形成微电镀通孔的导电层。

公开(公告)号：US5213840A

公开(公告)日：1993-05-25

申请号：US713638

申请日：1991-06-10

Applicant: Richard C. Retallick ,  Raymond A. Letize ,  Peter E. Kukanskis

Inventor： Richard C. Retallick ,  Raymond A. Letize ,  Peter E. Kukanskis

IPC: C23C18/22 ,  H05K3/00 ,  H05K3/38

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2201/0154 ,  H05K2203/0796

Abstract: The adhesion between surfaces of polyimide, particularly the through hole surfaces of polyimide-based multilayer laminates used in the fabrication of multilayer printed circuits, is improved by pretreatment of the surfaces with an essentially non-alkaline aqueous permanganate solution.

Abstract translation: 通过用基本上非碱性的高锰酸盐溶液预处理表面，改进了用于制造多层印刷电路的聚酰亚胺表面，特别是聚酰亚胺基多层叠层的通孔表面之间的粘附。

公开(公告)号：US5158645A

公开(公告)日：1992-10-27

申请号：US754106

申请日：1991-09-03

Applicant: Kathleen L. Covert ,  Charles C. Emmons ,  Elizabeth Foster ,  Richard W. Malek ,  Voya R. Markovich ,  Stephen L. Tisdale ,  Charyl L. Tytran

Inventor： Kathleen L. Covert ,  Charles C. Emmons ,  Elizabeth Foster ,  Richard W. Malek ,  Voya R. Markovich ,  Stephen L. Tisdale ,  Charyl L. Tytran

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

CPC classification number: H05K3/427 ,  H05K3/0047 ,  H05K3/426 ,  H05K2203/0796 ,  H05K2203/1388 ,  H05K2203/1407 ,  H05K3/0055 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184 ,  H05K3/389

Abstract: A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.

Abstract translation: 在微电子电路封装的表面特征之上施加Cu的可剥离薄膜，以在机械加工（例如钻孔，面板）中保护特征。 然后将薄膜从面板剥离。 在电路之前或之后，薄膜可以从面板剥离。

公开(公告)号：US5106473A

公开(公告)日：1992-04-21

申请号：US695473

申请日：1991-05-03

Applicant: Keith J. Whitlaw ,  Mark Goodenough

Inventor： Keith J. Whitlaw ,  Mark Goodenough

IPC: C25D5/56 ,  H05K3/42

CPC classification number: H05K3/424 ,  C25D5/56 ,  H05K2201/0329 ,  H05K2203/0783 ,  H05K2203/0796 ,  H05K2203/122 ,  H05K3/427

Abstract: A process is provided for metallizing the hole-wall surface of a through-hole provided in a printed circuit board precursor. In an initial step, the hole-wall surface is pre-treated with an oxidizing agent which micro-roughens it. An electro-conductive polymer film is then formed on the micro-roughened surface by oxidatively polymerizing in situ an acidic solution of an organic monomer with an oxidizing agent previously adsorbed on the board. The polymer film includes dopant anions which are acquired from the monomer solution. Finally, a metal layer is electroplated on the electro-conductive polymer film.

公开(公告)号：US5104687A

公开(公告)日：1992-04-14

申请号：US541500

申请日：1990-06-21

Applicant: Francesco Tomaiuolo ,  Enrico Cassia

Inventor： Francesco Tomaiuolo ,  Enrico Cassia

IPC: A23D7/01 ,  H05K3/00 ,  H05K3/18 ,  H05K3/26 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/422 ,  A23D7/013 ,  H05K3/0055 ,  H05K2203/0796 ,  H05K2203/122 ,  H05K3/383 ,  H05K3/427

Abstract: A process for manufacturing printed circuits provided with through holes, which comprises a cleaning pretreatment including a possible treatment by an organic solvent, a treatment in an alcaline solution of permanganate and a treatment for permanganate reduction, and a subsequent metallization treatment including a treatment for conditioning the walls of the through holes, a treatment for mordanting the copper surfaces, a precatalysis treatment, a catalysis treatment and a metallization treatment by a chemical copper both, wherein three treatments, namely reducing the permanganate, conditioning the walls of the through holes and mordanting the copper surfaces, are performed in a single step. The treatment for conditioning the walls of the through holes is performed by means of non-surfactant, water soluble polymers belonging to the group of the cationic polyelectrolytes. The composition for carrying out three treatments in a single step comprises an acid, hydrogen peroxide, a stabilizer for the hydrogen peroxide and a non-surfactant conditioner belonging to the group of the cationic polyelectrolytes.

Abstract translation: 一种制造具有通孔的印刷电路的方法，其包括清洁预处理，其包括可能的有机溶剂处理，在高锰酸盐的碱性溶液中的处理和用于高锰酸盐还原的处理，以及随后的金属化处理，包括调理处理 通孔的壁，用于对铜表面进行媒染的处理，预催化处理，催化处理和通过化学铜两者的金属化处理，其中三种处理，即还原高锰酸盐，调节通孔的壁和媒染 铜表面在一个步骤中进行。 用于调节通孔壁的处理通过非表面活性剂，属于阳离子聚电解质组的水溶性聚合物进行。 用于在单一步骤中进行三次处理的组合物包含酸，过氧化氢，用于过氧化氢的稳定剂和属于阳离子聚电解质组的非表面活性剂调节剂。

公开(公告)号：US5081068A

公开(公告)日：1992-01-14

申请号：US546446

申请日：1990-07-03

Applicant: Shinji Endo ,  Toshiaki Ohmori ,  Takaaki Fukumoto ,  Keisuke Namba

Inventor： Shinji Endo ,  Toshiaki Ohmori ,  Takaaki Fukumoto ,  Keisuke Namba

IPC: B08B7/00 ,  B24C1/00 ,  B24C11/00 ,  H01L21/00 ,  H01L21/302 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3065 ,  H05K3/26

CPC classification number: H01L21/02043 ,  B08B7/0092 ,  B24C1/003 ,  B24C11/00 ,  H01L21/6715 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0796 ,  H05K2203/083 ,  H05K2203/1509

Abstract: The method of treating a surface of a substrate (12) comprises the steps of physically treating the surface by jetting hydrogen peroxide containing ice particles (28) onto the substrate surface, and chemically treating the substrate surface with hydrogen peroxide solution obtained by melting the hydrogen peroxide containing ice particles (28).

Abstract translation: 处理基材（12）的表面的方法包括通过将含有过氧化氢的冰颗粒（28）喷射到基材表面上来物理处理表面的步骤，以及通过将氢气熔化获得的过氧化氢溶液化学处理基材表面 含有过氧化物的冰粒（28）。

公开(公告)号：US4859300A

公开(公告)日：1989-08-22

申请号：US296361

申请日：1989-01-09

Applicant: Thomas E. Sullivan ,  Juan Haydu

Inventor： Thomas E. Sullivan ,  Juan Haydu

IPC: C23C18/16 ,  H05K3/00

CPC classification number: C23C18/1617 ,  H05K3/0055 ,  H05K2203/0796

Abstract: The permanganate process for treating plastics, e.g., printed circuit boards, to enhance the adhesion of metal plating to the plastic is improved by employing electrolysis to either maintain a certain permanganate level in the operating bath or to regenerate a spent or used bath.

Abstract translation: 通过使用电解来维持操作浴中的某种高锰酸盐水平或再生废水或使用的浴，改善了处理塑料（例如印刷电路板）以增强金属镀层对塑料的粘附性的高锰酸盐方法。

公开(公告)号：US4751106A

公开(公告)日：1988-06-14

申请号：US911453

申请日：1986-09-25

Applicant: Gary M. Wilkinson ,  Cheryl A. Deckert ,  Jeffrey J. Doubrava

Inventor： Gary M. Wilkinson ,  Cheryl A. Deckert ,  Jeffrey J. Doubrava

IPC: C23C18/16 ,  C23C18/18 ,  C23C18/24 ,  C23C18/26 ,  C23C18/28 ,  C23C18/30 ,  C23C18/31 ,  C23C18/40 ,  H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  B05D5/12

CPC classification number: H05K3/422 ,  C23C18/28 ,  H05K3/42 ,  H05K2203/0796 ,  H05K2203/122 ,  H05K3/0055 ,  H05K3/383 ,  H05K3/427

Abstract: A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows:1. condition with an oxidant solution;2(A). contact with a copper etchant that etches copper and neutralizes oxidant residues on the surface to be plated; and2(B). contact with a conditioner that conditions the board surface for enhanced catalyst adsorption; or2(A). contact with a neutralizer for oxidant residues that neutralizes said residues and conditions the board surface for enhanced catalyst adsorption; and2(B). contact with a copper etchant; and3. catalyze the board; and4. plate electroless metal onto catalyzed surfaces from a plating solution containing a source of halide ions in a concentration of at least 0.1 moles per liter of solution.The process is characterized by the absence of a step of acceleration and contains fewer processing steps than prior art processes.

Abstract translation: 一种用于形成电镀通孔印刷电路板的方法，包括如下处理电路板基材：1.用氧化剂溶液的状态; 2（A）。 与腐蚀铜并消除待镀表面上的氧化剂残留物的铜蚀刻剂接触; 和2（B）。 与调节板表面的调理剂接触以增强催化剂吸附; 或2（A）。 与用于中和所述残留物的氧化剂残余物的中和剂接触，并且调节板表面以增强催化剂吸附; 和2（B）。 与铜蚀刻剂接触; 和3.催化董事会; 和4.从含有浓度为每升溶液至少0.1摩尔的卤离子源的电镀溶液将催化表面上的无电镀金属镀到板上。 该方法的特征在于不存在加速步骤，并且比现有技术方法包含较少的加工步骤。

公开(公告)号：US4592852A

公开(公告)日：1986-06-03

申请号：US618281

申请日：1984-06-07

Applicant: Constantine I. Courduvelis ,  Anthony R. Del Gobbo

Inventor： Constantine I. Courduvelis ,  Anthony R. Del Gobbo

IPC: H05K3/18 ,  C23C18/22 ,  H05K3/00 ,  H05K3/38 ,  C23F1/32

CPC classification number: H05K3/381 ,  C23C18/22 ,  H05K3/0055 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K3/181

Abstract: An improved alkaline permanganate composition for etching printed circuit boards is provided by incorporating a secondary oxidant in the solution capable of oxidizing manganate ion to permanganate ion.

Abstract translation: 通过在能够将锰酸盐离子氧化为高锰酸盐离子的溶液中掺入二次氧化剂，提供了用于蚀刻印刷电路板的改进的碱金属高锰酸盐组合物。

公开(公告)号：US20230142375A1

公开(公告)日：2023-05-11

申请号：US17771101

申请日：2020-10-22

Applicant: NAMICS CORPORATION

Inventor： Naoki OBATA ,  Yoshinobu KOKAJI ,  Makiko SATO

IPC: H05K3/38 ,  H05K1/09

CPC classification number: H05K3/385 ,  H05K3/384 ,  H05K1/09 ,  H05K3/389 ,  H05K2203/0315 ,  H05K2201/0355 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.