公开(公告)号：US20200332431A1

公开(公告)日：2020-10-22

申请号：US16762587

申请日：2018-11-09

Applicant: NAMICS CORPORATION

Inventor： Makiko SATO ,  Osamu SUZUKI ,  Naoki OBATA ,  Yoshinobu KOKAJI

IPC: C25D7/06 ,  C23C18/18 ,  C25D5/34 ,  C23C22/52

Abstract: [Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.

公开(公告)号：US20240179848A1

公开(公告)日：2024-05-30

申请号：US18551955

申请日：2022-03-23

Applicant: NAMICS CORPORATION

Inventor： Naoki OBATA ,  Makiko SATO

IPC: H05K3/10 ,  C23C18/16 ,  C23C18/38 ,  C23C28/02 ,  C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  G03F7/00 ,  G03F7/16 ,  G03F7/26 ,  H05K3/18

CPC classification number: H05K3/108 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/38 ,  C23C28/023 ,  C25D3/38 ,  C25D5/022 ,  C25D7/123 ,  G03F7/0035 ,  G03F7/16 ,  G03F7/26 ,  H05K3/18 ,  H05K3/184 ,  H05K2203/072 ,  H05K2203/0723

Abstract: The present invention is directed to provide novel methods for manufacturing laminates. The method includes the steps of: bonding the insulating substrate layer and a copper component having protrusions on a surface thereof; transferring the protrusions to a surface of the insulating substrate layer by peeling off the copper component to form a seed layer; forming a resist on a predetermined area of a surface of the seed layer; plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper; removing the resist; and removing the seed layer that has been exposed by the removal of the resist.

公开(公告)号：US20240179849A1

公开(公告)日：2024-05-30

申请号：US18283537

申请日：2021-06-10

Applicant: NAMICS CORPORATION

Inventor： Naoki OBATA ,  Makiko SATO

IPC: H05K3/18 ,  G01N23/20058 ,  G01N23/20091 ,  G01N33/00 ,  H05K1/05 ,  H05K3/38

CPC classification number: H05K3/18 ,  G01N23/20058 ,  G01N23/20091 ,  G01N33/00 ,  H05K1/05 ,  H05K3/38 ,  G01N2033/0096 ,  H05K2203/06

Abstract: The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.

公开(公告)号：US20230142375A1

公开(公告)日：2023-05-11

申请号：US17771101

申请日：2020-10-22

Applicant: NAMICS CORPORATION

Inventor： Naoki OBATA ,  Yoshinobu KOKAJI ,  Makiko SATO

IPC: H05K3/38 ,  H05K1/09

CPC classification number: H05K3/385 ,  H05K3/384 ,  H05K1/09 ,  H05K3/389 ,  H05K2203/0315 ,  H05K2201/0355 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.