公开(公告)号：US20180005864A1

公开(公告)日：2018-01-04

申请号：US15698991

申请日：2017-09-08

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Stephan Heimgartner ,  John A. Vidallon

IPC: H01L21/683 ,  B32B37/18 ,  B32B37/12 ,  B32B38/18

CPC classification number: H01L21/6838 ,  B32B37/12 ,  B32B37/18 ,  B32B38/1858 ,  B32B2457/00 ,  B32B2551/00

Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

公开(公告)号：US20170287963A1

公开(公告)日：2017-10-05

申请号：US15622813

申请日：2017-06-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jens Geiger ,  Peter Roentgen ,  Vincenzo Condorelli

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14685

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

公开(公告)号：US20170221961A1

公开(公告)日：2017-08-03

申请号：US15487132

申请日：2017-04-13

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Alexander Bietsch ,  Hartmut Rudmann ,  Markus Rossi ,  Simon Gubser

IPC: H01L27/146 ,  G02B13/00

CPC classification number: H01L27/14687 ,  G01J3/0208 ,  G01J3/0256 ,  G02B13/0085 ,  G02B21/367 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/0547 ,  H01L2924/0002 ,  Y02E10/52 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  H01L2924/00

Abstract: A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.

公开(公告)号：US09711552B2

公开(公告)日：2017-07-18

申请号：US14823174

申请日：2015-08-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jens Geiger ,  Peter Roentgen ,  Vincenzo Condorelli

IPC: H01L33/00 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14685

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

公开(公告)号：US20170194303A1

公开(公告)日：2017-07-06

申请号：US15460746

申请日：2017-03-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H01L25/16 ,  B29D11/00 ,  H01L33/58 ,  H01L31/167 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L25/165 ,  B29D11/00307 ,  B29D11/00375 ,  H01L25/167 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L31/18 ,  H01L31/1876 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Fabricating an optics wafer includes providing a wafer comprising a core region composed of a glass-reinforced epoxy, the wafer further comprising a first resin layer on a top surface of the core region and a second resin layer on a bottom surface of the core region. The core region and first and second resin layers are substantially non-transparent for a specific range of the electromagnetic spectrum. The wafer further includes vertical transparent regions that extend through the core region and the first and second resin layers and are composed of a material that is substantially transparent for the specific range of the electromagnetic spectrum. The wafer is thinned, for example by polishing, from its top surface and its bottom surface so that a resulting thickness is within a predetermined range without causing glass fibers of the core region to become exposed. Respective optical structures are provided on one or more exposed surfaces of at least some of the transparent regions.

公开(公告)号：US20170141241A1

公开(公告)日：2017-05-18

申请号：US15353397

申请日：2016-11-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/0216 ,  G01J1/02 ,  H01L31/12

CPC classification number: G01J1/0295 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US09608142B2

公开(公告)日：2017-03-28

申请号：US15041216

申请日：2016-02-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Tobias Senn ,  Hartmut Rudmann

IPC: H01L21/00 ,  H01L33/00 ,  H01L31/0232 ,  G02B7/00 ,  H01L33/58 ,  H01L31/18

CPC classification number: H01L31/02325 ,  G02B7/003 ,  H01L31/18 ,  H01L33/005 ,  H01L33/58 ,  H02S40/44 ,  Y02P70/521

Abstract: Optoelectronic modules for light emitting and/or light sensing include optical assemblies and active optoelectronic components. An optical assembly and a corresponding optoelectronic component can be aligned. The optoelectronic modules can include multiple optical assemblies and active optoelectronic components. Multiple optical assemblies and corresponding active optoelectronic components can be aligned independently of each other in various implementations of optoelectronic modules that include alignment features and optical assembly barrels.

公开(公告)号：US20160218239A1

公开(公告)日：2016-07-28

申请号：US14917104

申请日：2014-08-20

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L31/18 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/58 ,  H01S5/183 ,  H01L27/146 ,  H01L51/56 ,  H01L51/52 ,  H01S5/00 ,  H01S5/02 ,  H01L33/56 ,  H01L31/0232

CPC classification number: H01L33/56 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L51/5237 ,  H01L51/5275 ,  H01L51/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01S5/005 ,  H01S5/02 ,  H01S5/183 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Abstract translation: 描述了各种光电模块并且包括一个或多个光电子器件。 每个光电子模块包括一个或多个光电器件。 侧壁横向围绕每个光电子器件，并且可以与光电子器件的侧面直接接触，或者在一些情况下与围绕光电子器件的包覆模制体一起直接接触。 侧壁可以由例如对由光电子器件发射或由光电子器件发射的光不透明的真空注入材料构成。 该模块还包括无源光学元件。 根据实施方案，无源光学元件可以在模块的盖上，直接位于光电子器件的顶表面上，或在围绕光电器件的包覆模制上。 还描述了制造这种模块的方法，并且可以有助于使用晶片级工艺来制造模块。

公开(公告)号：US20160170166A1

公开(公告)日：2016-06-16

申请号：US14970795

申请日：2015-12-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Markus Rossi ,  Hartmut Rudmann ,  Ohad Meitav ,  Moshe Doron ,  Kai Engelhardt

IPC: G02B7/00 ,  G02B7/02

CPC classification number: G02B7/003 ,  G02B7/021 ,  G02B7/022

Abstract: Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.

Abstract translation: 光学组件包括一组光学元件，每个光学元件具有一个或多个对准特征。 每个对准特征沿着一个光学元件的表面跟踪相应的曲线。 一个光学元件的对准特征适合于另一个的对准特征。 在一些情况下，对准特征可以帮助建立光学元件的更精确的侧向对准。

公开(公告)号：US20160031169A1

公开(公告)日：2016-02-04

申请号：US14882905

申请日：2015-10-14

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Susanne Westenhöfer ,  Bojan Tesanovic

IPC: B29D11/00 ,  G02B13/00

CPC classification number: G02B3/0031 ,  B29D11/00307 ,  B29D11/00375 ,  B29D11/0074 ,  B29D11/00932 ,  B29K2063/00 ,  B29L2011/00 ,  G02B3/00 ,  G02B5/20 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).