公开(公告)号：US20120304889A1

公开(公告)日：2012-12-06

申请号：US13464605

申请日：2012-05-04

申请人： Richard D. MCCULLOUGH ,  John BELOT ,  Rebecca POTASH

发明人： Richard D. MCCULLOUGH ,  John BELOT ,  Rebecca POTASH

IPC分类号： C09D11/02 ,  B05D3/00 ,  B05D1/42 ,  B05D3/10 ,  B05D3/02 ,  B05D3/06

CPC分类号： C09D11/52 ,  B01J23/52 ,  B01J37/0219 ,  B01J37/086 ,  B41F17/00 ,  B41J2/01 ,  C09D11/322 ,  C09D11/36 ,  H01B1/02 ,  H05K1/092 ,  H05K3/105 ,  H05K3/1283 ,  H05K2203/1476

摘要： Low temperature processes for converting mixtures of metal inks into alloys. The alloys can be dealloyed by etching. A method comprising: depositing at least one precursor composition on at least one substrate to form at least one deposited structure, wherein the precursor composition comprises at least two metal complexes, including at least one first metal complex comprising at least one first metal and at least one second metal complex different from the first metal complex and comprising at least one second metal different from the first metal, treating the deposited structure so that the first metal and the second metal form elemental forms of the first metal and the second metal in a treated structure. Further, one can remove at least some of the first metal to leave a nanoporous material comprising at least the second metal. Precursor compositions can be formulated to be homogeneous compositions.

摘要翻译： 将金属油墨混合物转化成合金的低温工艺。 合金可以通过蚀刻来脱模。 一种方法，包括：在至少一个底物上沉积至少一种前体组合物以形成至少一种沉积结构，其中所述前体组合物包含至少两种金属络合物，包括至少一种包含至少一种第一金属和至少一种第一金属的第一金属络合物 与第一金属络合物不同的第二金属络合物，并且包含不同于第一金属的至少一种第二金属，处理沉积结构，使得第一金属和第二金属在处理过的第一金属和第二金属中形成元素形式的第一金属和第二金属 结构体。 此外，可以去除至少一些第一金属以留下至少包含第二金属的纳米多孔材料。 前体组合物可以配制成均匀的组合物。

公开(公告)号：US08323878B2

公开(公告)日：2012-12-04

申请号：US12814783

申请日：2010-06-14

申请人： Kenji Yanagisawa

发明人： Kenji Yanagisawa

IPC分类号： G02B6/10

CPC分类号： G02B6/43 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/113 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/421 ,  H05K3/4647 ,  H05K2201/0195 ,  H05K2201/09563 ,  H05K2203/0733 ,  H05K2203/1476

摘要： A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion.

摘要翻译： 在层叠在配线基板上的第一包层中形成通孔。 导电材料填充在通孔中，以形成从第一包层的表面突出的具有蘑菇状形状的第一导体部分（导电通路的一部分）。 然后，形成第二包层以覆盖第一导体部分，第一包层和芯层，并且在第二包层中形成通孔。 导电材料填充在通孔中，以形成连接到第一导体部分的第二导体部分（导电通孔的剩余部分）。

公开(公告)号：US08304015B2

公开(公告)日：2012-11-06

申请号：US12057079

申请日：2008-03-27

申请人： Junichi Yoshida ,  Seiichi Inoue ,  Jun Yamanobe ,  Manabu Katsumura

发明人： Junichi Yoshida ,  Seiichi Inoue ,  Jun Yamanobe ,  Manabu Katsumura

IPC分类号： B28B19/00 ,  B29B15/10 ,  C23C18/00 ,  C23C20/00 ,  C23C24/00 ,  C23C26/00 ,  C23C28/00 ,  C23C30/00 ,  H01C17/06 ,  H05K3/00

CPC分类号： H05K3/061 ,  H05K3/0079 ,  H05K2201/0129 ,  H05K2203/013 ,  H05K2203/058 ,  H05K2203/0783 ,  H05K2203/1476

摘要： A method forms a resin film on a substrate by depositing droplets of resin liquid by an inkjet method. The method includes: a first resin liquid arrangement step of arranging a plurality of droplets of a first resin liquid separately from each other on a substrate in such a manner that the droplets do not make contact with each other; a first resin liquid curing step of curing at least a surface of each of the droplets of the first resin liquid arranged on the substrate; a second resin liquid arrangement step of arranging a plurality of droplets of a second resin liquid at substantially central positions between the droplets of the first resin liquid on the substrate, after the at least the surface of each of the droplets of the first resin liquid is cured; and a second resin liquid curing step of curing the droplets of the second resin liquid arranged on the substrate.

摘要翻译： 一种方法是通过用喷墨方法沉积树脂液滴来在基片上形成树脂膜。 该方法包括：第一树脂液体排列步骤，以使液滴不彼此接触的方式在基板上彼此分离地排列第一树脂液体的多个液滴; 第一树脂液体固化步骤，固化布置在基板上的第一树脂液体的每个液滴的至少一个表面; 第二树脂液体配置步骤，在第一树脂液体的每个液滴的至少表面至少是第一树脂液体的至少表面之后，将第二树脂液体的多个液滴布置在基板上的第一树脂液体的液滴之间的大致中心位置处 治愈 以及第二树脂液体固化步骤，其固化布置在所述基板上的所述第二树脂液体的液滴。

公开(公告)号：US08281978B2

公开(公告)日：2012-10-09

申请号：US12744540

申请日：2007-12-20

申请人： Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： B23K31/02

CPC分类号： H05K3/3463 ,  B23K35/02 ,  B23K35/262 ,  C21D9/50 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  C22C30/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P10/212 ,  Y10T428/31678 ,  H01L2924/014 ,  H01L2224/81805 ,  H01L2224/0401

摘要： Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.

摘要翻译： 本文公开了使用高温无铅焊料合金制造的电子设备，其使得可以形成没有强度变化的焊接接头，并且在强度和可焊性之间具有优异的平衡。 无铅焊料合金是由元素A和元素B制成的合金，其组成由AmBn构成稳定相，元素B在室温下处于平衡状态。 当无铅焊料合金通过淬火固化时，元件A溶解在元件B的室温稳定相中，从而形成过饱和固溶体，当熔化熔化然后固化时，合金回到 其平衡状态并且具有由稳定相AmBn和元素B组成的组成，因此即使在再加热到焊接温度时也由于存在稳定相AmBn而保持强度。

公开(公告)号：US20120248616A1

公开(公告)日：2012-10-04

申请号：US13361344

申请日：2012-01-30

申请人： Masayuki KITAJIMA ,  Takatoyo Yamakami ,  Takashi Kubota ,  Kuniko Ishikawa

发明人： Masayuki KITAJIMA ,  Takatoyo Yamakami ,  Takashi Kubota ,  Kuniko Ishikawa

IPC分类号： H01L23/48 ,  B23K35/24

CPC分类号： H05K3/3442 ,  B23K1/0016 ,  B23K1/206 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0255 ,  B23K35/262 ,  B23K35/302 ,  B23K35/3613 ,  B23K2101/42 ,  C22C13/00 ,  H01L2924/0002 ,  H05K3/284 ,  H05K3/3484 ,  H05K2201/0323 ,  H05K2201/10977 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00

摘要： To provide an electronic component, containing: a wiring board containing electrode pads; a component including a plurality of electrodes, the component being mounted on the wiring board; a sealing resin covering the component; and a plurality of terminals configured to connect a wiring provided within the wiring board to an external substrate, wherein the plurality of electrodes and the electrode pads are connected with solder, and wherein a first resin layer and a second resin layer are provided between the solder and the sealing resin in this order from the side of the solder, where the first resin layer has a first Young's modulus and the second resin layer has a second Young's modulus larger than the first Young's modulus.

摘要翻译： 提供一种电子部件，其包含：包含电极焊盘的布线板; 包括多个电极的部件，所述部件安装在所述布线板上; 覆盖该部件的密封树脂; 以及多个端子，其被配置为将布线板内设置的布线与外部基板连接，其中所述多个电极和所述电极焊盘与焊料连接，并且其中在所述焊料之间设置有第一树脂层和第二树脂层 和密封树脂，其中第一树脂层具有第一杨氏模量，第二树脂层的第二杨氏模量大于第一杨氏模量。

公开(公告)号：US20120228778A1

公开(公告)日：2012-09-13

申请号：US13042186

申请日：2011-03-07

申请人： Valentin Kosenko ,  Sergey Savastiouk

发明人： Valentin Kosenko ,  Sergey Savastiouk

IPC分类号： H01L23/48 ,  H01L21/441

CPC分类号： H01L23/49827 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49822 ,  H01L24/05 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/0195 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K2203/1476 ,  H01L2924/00

摘要： A through via (144) contains a conductor (244, 276) passing through a substrate (140) for connection to an integrated circuit element. The through via consists of two segments (144.1, 144.2) formed from respective different sides (140.1, 140.2) of the substrate and meeting inside the substrate. Each segment is shorter than the entire via, so via formation is facilitated. The second segment is etched after deposition of an etch stop layer (214) into the first segment. Due to the etch stop layer, the first segment's depth does not have to be rigidly controlled. The conductor is formed by separate depositions of conductive material into the via from each side of the substrate. From each side, the conductor is deposited to a shallower depth than the via depth, so the deposition is facilitated. Other embodiments are also provided.

摘要翻译： 通孔（144）包含通过用于连接到集成电路元件的衬底（140）的导体（244,276）。 通孔包括由衬底的各个不同侧面（140.1,140.2）形成的两个段（144.1,144.2），并且在衬底内部会合。 每个段都比整个通孔短，因此通过形成便利。 在将蚀刻停止层（214）沉积到第一段中之后蚀刻第二段。 由于蚀刻停止层，第一段的深度不必严格控制。 导体由导电材料从衬底的每一侧分离成通孔而形成。 从每一侧，导体被沉积到比通孔深度更浅的深度，因此便于沉积。 还提供了其他实施例。

公开(公告)号：US08264847B2

公开(公告)日：2012-09-11

申请号：US12848000

申请日：2010-07-30

申请人： Jin-Hong An ,  Jae-Soon Kim

发明人： Jin-Hong An ,  Jae-Soon Kim

IPC分类号： H05K7/02 ,  H05K3/28

CPC分类号： H05K3/284 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/288 ,  H05K2201/0187 ,  H05K2201/0397 ,  H05K2203/1316 ,  H05K2203/1476 ,  H05K2203/162

摘要： An electronic circuit module and a method of manufacturing the electronic circuit module are disclosed. In one embodiment, the electronic circuit module includes i) a substrate on which a circuit is formed, ii) a plurality of electrical devices electrically connected to the circuit and iii) a first molding unit coated on the substrate to cover at least the electrical devices. The module further includes i) a test terminal unit comprising a plurality of test wires and configured to inspect the circuit, wherein each of the test wires comprises a first end electrically connected to the circuit and a second end exposed from the first molding unit, and wherein the second ends of the test wires form an inspection unit and are adjacent to each other on the substrate and ii) a second molding unit coated on the substrate to cover the second ends of the test wires.

摘要翻译： 公开了一种电子电路模块及其制造方法。 在一个实施例中，电子电路模块包括i）其上形成电路的基板，ii）电连接到电路的多个电气装置，以及iii）涂覆在基板上的至少覆盖电气装置的第一模制单元 。 该模块还包括i）测试终端单元，包括多个测试线并被配置为检查电路，其中每个测试线包括电连接到该电路的第一端和从第一模制单元暴露的第二端，以及 其中所述测试线的第二端形成检查单元并且在所述基底上彼此相邻，以及ii）涂覆在所述基底上以覆盖所述测试线的第二端的第二模制单元。

公开(公告)号：US20120199388A1

公开(公告)日：2012-08-09

申请号：US13449847

申请日：2012-04-18

申请人： Joon-Sung KIM ,  Je-Gwang YOO ,  Chang-Sup RYU

发明人： Joon-Sung KIM ,  Je-Gwang YOO ,  Chang-Sup RYU

IPC分类号： H05K1/11 ,  H05K1/00

CPC分类号： H05K3/007 ,  H05K1/0265 ,  H05K3/06 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09736 ,  H05K2203/0156 ,  H05K2203/1394 ,  H05K2203/1476 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board including: an insulation layer; a first circuit pattern formed over one surface of the insulation layer, the first circuit pattern having a side thereof slanted with respect to the insulation layer; and a second circuit pattern formed over the other surface of the insulation layer, the second circuit pattern having a side thereof slanted with respect to the insulation layer, wherein the side of the second circuit pattern is less slanted than the side of the first circuit pattern.

摘要翻译： 一种印刷电路板，包括：绝缘层; 在所述绝缘层的一个表面上形成的第一电路图案，所述第一电路图案具有相对于所述绝缘层倾斜的一侧; 以及形成在所述绝缘层的另一个表面上的第二电路图案，所述第二电路图案具有相对于所述绝缘层倾斜的一侧，其中所述第二电路图案的一侧比所述第一电路图案的侧面倾斜 。

公开(公告)号：US20120186866A1

公开(公告)日：2012-07-26

申请号：US13307480

申请日：2011-11-30

申请人： Yukinobu MIKADO ,  Shunsuke Sakai ,  Mitsuhiro Tomikawa

发明人： Yukinobu MIKADO ,  Shunsuke Sakai ,  Mitsuhiro Tomikawa

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K1/185 ,  H05K3/0038 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/4913

摘要： A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface.

摘要翻译： 布线基板包括具有开口部分和与开口部分相邻的通孔的核心基板，位于开口部分中的电容器，以及形成在芯基板的通孔中的通孔导体， 通孔。 芯基板具有在第一表面的相对侧的第一表面和第二表面，芯基板的开口部分从第一表面穿透到第二表面，通孔导体具有第一导电部分和第二导电部分 导电部分连接到芯基板中的第一导电部分，通孔导体的第一导电部分从第一表面朝向第二表面变窄，并且通孔导体的第二导电部分从第二导体部分变窄 表面朝向第一表面。

公开(公告)号：US20120177814A1

公开(公告)日：2012-07-12

申请号：US13316591

申请日：2011-12-12

申请人： Muhammad Iraqi ,  Noam Rozenstein ,  Eva Igner ,  Michael Litvin ,  Yaron Mazor

发明人： Muhammad Iraqi ,  Noam Rozenstein ,  Eva Igner ,  Michael Litvin ,  Yaron Mazor

IPC分类号： H05K3/00 ,  B05C9/12 ,  B23K3/00 ,  B23K31/02

CPC分类号： H05K3/3452 ,  H05K2203/1476

摘要： A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating material to be applied on an electrical circuit that comprises at least one three dimensional structure to be coated by the coating material; wherein the multiple iteration printing scheme is responsive to a shape and size of the at least one three dimensional structure; and performing multiple printing iterations of the coating material, according to the multiple iteration printing scheme; wherein at least one printing iteration is followed by at least partially curing the coating material printed during the at least one printing iteration.

摘要翻译： 一种系统和方法，所述方法包括确定或接收指示要施加到电路上的涂层材料的多次打印迭代的多重迭代打印方案，所述电路包括要被所述涂层材料涂覆的至少一个三维结构; 其中所述多次迭代打印方案响应于所述至少一个三维结构的形状和尺寸; 并根据多重迭代打印方案进行涂料的多次印刷迭代; 其中至少一次打印迭代之后是至少部分地固化在所述至少一次打印迭代期间印刷的涂料。