公开(公告)号：US20040052050A1

公开(公告)日：2004-03-18

申请号：US10246225

申请日：2002-09-18

发明人： Paul A. Koning ,  Fay Hua

IPC分类号： H05K007/20

CPC分类号： B23K35/26 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/3613 ,  B23K2101/40 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/125 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/1419 ,  Y10T428/1452 ,  Y10T428/2982 ,  H01L2924/00

摘要： A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the filler diffuses into the solder to form a new filler-solder alloy having an increased melting point and added robustness.

公开(公告)号：US20040026484A1

公开(公告)日：2004-02-12

申请号：US10215732

申请日：2002-08-09

发明人： Tsuyoshi Yamashita ,  Tongbi Jiang

IPC分类号： B23K031/00

CPC分类号： H01L24/10 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K2101/40 ,  H01L23/488 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2203/043 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599

摘要： Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

摘要翻译： 本发明的方面提供了包括两种不同助熔剂的焊料组合物。 助熔剂之一促进在第一活化温度下焊接金属的熔化，另一种助熔剂促进金属在高于第一活化温度的第二活化温度下熔化。 这种双通量焊料可用于制造微电子部件和微电子部件组件。 在一个具体应用中，焊料可用于制造倒装芯片或其他包括自熔焊球的微电子部件。 这可以避免在随后的组件附着回流操作之前将另外的焊剂组合物应用于焊球。

公开(公告)号：US20030218261A1

公开(公告)日：2003-11-27

申请号：US10390603

申请日：2003-03-19

申请人： M. A. Capote

发明人： Miguel A. Capote ,  Zhiming Zhou ,  Xiaoqi Zhu ,  Ligui Zhou

IPC分类号： H01L023/28

CPC分类号： H01L24/81 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  C09J4/00 ,  H01L21/563 ,  H01L23/293 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/27614 ,  H01L2224/27618 ,  H01L2224/29 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29562 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  C08F222/1006 ,  C08F222/20 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.

摘要翻译： 通过使用具有分离的分离焊料柱的密封剂底部填充材料预涂芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工，测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面，将芯片和预包封的密封剂与衬底成角度地放置并与预涂覆的衬底接触，然后将芯片和预包封的密封剂围绕第一接触点枢转，排出任何气体 直到芯片上的焊料凸块与基板完全接触。 还提供了倒装芯片配置，其具有投诉焊料/柔性密封剂底部结构，当衬底经历膨胀或收缩时，其基本上横向变形。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，而不会使芯片和基板弯曲。

公开(公告)号：US06458472B1

公开(公告)日：2002-10-01

申请号：US09755146

申请日：2001-01-08

申请人： Mark M. Konarski ,  J. Paul Krug

发明人： Mark M. Konarski ,  J. Paul Krug

IPC分类号： H01L2912

CPC分类号： H01L21/563 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49171 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

摘要翻译： 本发明涉及用于助熔金属表面的助焊剂底部填充组合物，以准备提供电连接并密封半导体器件之间的空间，例如芯片尺寸或芯片尺寸封装（“CSP”），球栅阵列（“BGA”）， 每个都具有半导体芯片，例如大规模集成（“LSI”）或半导体芯片本身的电路阵列（“LGAs”），倒装芯片组件（“FC”）等，以及电路板 设备或芯片分别电连接。 本发明的助焊剂底部填充组合物在与用于建立电互连熔体的焊料大约相同的温度下开始固化。

公开(公告)号：US20020050305A1

公开(公告)日：2002-05-02

申请号：US09774011

申请日：2001-01-31

发明人： Toshihiko Taguchi ,  Kunihito Takaura ,  Masahiko Hirata ,  Hisahiko Yoshida ,  Takashi Nagashima

IPC分类号： B23K035/34

CPC分类号： B23K35/3612 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3613

摘要： A solder paste having a powder of a Zn-containing solder alloy such as an SnnullZn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.

摘要翻译： 通过将0.1重量％〜5.0重量％的缩水甘油醚化合物，例如添加0.1〜5.0重量％的缩水甘油醚化合物，可以提高含有Sn-Zn系合金等Zn系合金粉末与助熔剂如松香助熔剂的混合物的焊膏， 作为烷基，烯基或芳基缩水甘油醚。 改进的焊膏具有增加的老化耐受性，并且伴随着焊料合金中的Zn与焊剂中的成分的反应引起的可焊性的劣化，并且具有大大延长的保质期。

公开(公告)号：US20020040624A1

公开(公告)日：2002-04-11

申请号：US09970036

申请日：2001-10-04

发明人： Sinzo Nakamura ,  Ryoichi Kurata ,  Hiroshi Takahashi

IPC分类号： C22C013/02

CPC分类号： H05K3/3484 ,  B22F2998/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3613 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3463 ,  H05K2201/0272 ,  C22C1/04

摘要： A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230null C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an SnnullBi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an SnnullZn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.

摘要翻译： 焊膏包括无铅焊料合金粉末和焊剂，适用于在230℃或更低的焊接温度下回流焊接电子部件，同时对电子部件的损伤最小化，形成良好焊接的焊接接头 强度。 焊料合金粉末为10〜30体积％的Sn-Bi合金的第一粉末的混合物，其主要由Bi的10-45重量％和余量的Sn和70〜90体积％的第二粉末组成 的基本上由9-15重量％的Zn和余量的Sn组成的Sn-Zn合金。 混合物得到熔融组成的合金，其基本上由7-11重量％的Zn，1-5重量％的Bi和余量的Sn组成。

公开(公告)号：US06367150B1

公开(公告)日：2002-04-09

申请号：US09148506

申请日：1998-09-04

申请人： Kenneth J. Kirsten

发明人： Kenneth J. Kirsten

IPC分类号： H05K334

CPC分类号： B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H01L21/563 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/11822 ,  H01L2224/13111 ,  H01L2224/1369 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/81011 ,  H01L2224/81211 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2224/81862 ,  H01L2224/0401

摘要： An epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a thermosetting epoxy resin and a cross-linking agent with inherent flux activity. When heated the cross-linking agent cleans the metal oxides from the metal surfaces on the chip and then reacts with the epoxy resin to form a thermosetting epoxy residue. The flux residue left on the board after soldering does not inhibit the flow of an underfill encapsulant. The underfill binds to the thermosetting residue of the flux which increases adhesion strength preventing delamination of the chip during thermal cycling.

摘要翻译： 使用环氧基助焊剂将倒装芯片IC器件焊接到基板材料上的金属结合位置。 助焊剂由热固性环氧树脂和具有固有助焊剂活性的交联剂组成。 当加热时，交联剂从芯片上的金属表面清洗金属氧化物，然后与环氧树脂反应形成热固性环氧树脂残渣。 焊接后留在板上的焊剂残留物不会妨碍底部填充密封剂的流动。 底部填充物结合到焊剂的热固性残余物，这增加了粘合强度，防止在热循环期间芯片的分层。

公开(公告)号：US20010025874A1

公开(公告)日：2001-10-04

申请号：US09819518

申请日：2001-03-27

申请人： NEC Corporation

发明人： Tomohiro Nishiyama

IPC分类号： B23K031/02 ,  B23K001/20 ,  B23K035/12

CPC分类号： H05K3/3436 ,  B23K1/0016 ,  B23K35/3613 ,  B23K2101/40 ,  H01L24/11 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/3478 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0338 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00

摘要： Solder balls are mounted on electrodes with an active resin therebetween. The solder is heated and melts to be connected to pads of an LSI chip, thereby forming solder bumps on the chip. In a method of forming bumps, a method of mounting flip chips, and a mounting structure, by the use of the active resin, a flux washing process can be eliminated and at the same time, an assembly cost can be minimized.

摘要翻译： 焊球安装在其间具有活性树脂的电极上。 焊料被加热并熔化以连接到LSI芯片的焊盘，从而在芯片上形成焊料凸块。 在形成凸块的方法中，通过使用活性树脂安装倒装芯片和安装结构的方法可以消除助焊剂清洗过程，同时可以最小化组装成本。

公开(公告)号：US5885369A

公开(公告)日：1999-03-23

申请号：US911674

申请日：1997-08-15

申请人： Kenzo Hanawa ,  Takayuki Araki ,  Yoshinobu Okamura ,  Yasuhiro Asano

发明人： Kenzo Hanawa ,  Takayuki Araki ,  Yoshinobu Okamura ,  Yasuhiro Asano

IPC分类号： B23K35/22 ,  B22F1/02 ,  B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  B23K35/36 ,  B23K35/363 ,  B23K35/40 ,  C07C55/14 ,  H05K3/34

CPC分类号： B23K35/0244 ,  B23K35/3618 ,  B23K35/262 ,  B23K35/3613 ,  H05K3/3484 ,  Y10T428/2991

摘要： According to the present invention, the oxidation of the surface of solder particles is inhibited and the generation of solder balls in the reflow soldering process is inhibited. More specifically, the present invention protects the surface of the solder particles from oxidation during all steps, including the storage of a solder powder, formation of a paste from the solder powder, printing, transferring to a reflow oven and reflow soldering, to minimize the oxidation of the solder particles at these steps so that the generation of solder balls is minimized. In addition, the present invention provides a method for making the solder powder and a solder paste using the solder powder. The objective of the present invention is achieved by the solder powder, the particles of which have on the surface thereof an organometallic compound composed of adipic acid and a metal of the solder alloy. This solder powder is produced by reacting particles of the solder alloy powder with vaporized adipic acid. According to the present invention, the solder powder, the particles of which have on the surface thereof an adipic acid-derived organometallic compound combined chemically with the surface of the solder particles, is blended with a flux to be made into a paste.

摘要翻译： 根据本发明，焊料颗粒表面的氧化被抑制，并且在回流焊接过程中产生焊球被抑制。 更具体地说，本发明在所有步骤中保护焊料颗粒的表面免于氧化，包括焊料粉末的存储，焊料粉末的形成，印刷，转移到回流炉和回流焊接，以最小化 在这些步骤中焊料颗粒的氧化使得焊球的产生最小化。 此外，本发明提供了使用焊料粉末制造焊料粉末和焊膏的方法。 本发明的目的是通过在其表面上具有由己二酸和焊料合金的金属组成的有机金属化合物的焊料粉末来实现的。 这种焊料粉末是通过将焊料合金粉末的颗粒与汽化的己二酸反应制备的。 根据本发明，其表面上具有与焊料颗粒的表面化学结合的己二酸衍生的有机金属化合物的焊料粉末与要制成糊料的助熔剂共混。

公开(公告)号：US5863355A

公开(公告)日：1999-01-26

申请号：US606772

申请日：1996-02-27

申请人： Takao Ohno ,  Shouichi Saito ,  Satoshi Shinohara ,  Kazuyuki Takakuwa

发明人： Takao Ohno ,  Shouichi Saito ,  Satoshi Shinohara ,  Kazuyuki Takakuwa

IPC分类号： B23K35/363 ,  B23K35/36 ,  H05K3/06

CPC分类号： B23K35/3618 ,  B23K35/3613 ,  B23K35/3615

摘要： The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsaturated organic acid according to the Diels-Alder reaction in an aqueous solvent. A volatile basic agent may further be contained in the flux.

摘要翻译： 本发明提供了一种用于安装电路基板的助焊剂，其不受任何有机溶剂的影响，可由于空气污染而排除任何洗涤步骤。 焊剂通过将根据Diels-Alder反应的不饱和有机酸改性的松香溶解在水性溶剂中而获得。 挥发性碱性剂可以进一步包含在助熔剂中。