公开(公告)号：US20140125849A1

公开(公告)日：2014-05-08

申请号：US14064550

申请日：2013-10-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: G02B27/00 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。

公开(公告)号：US20130088845A1

公开(公告)日：2013-04-11

申请号：US13644682

申请日：2012-10-04

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Hartmut Rudmann ,  Michel Barge

IPC: G03B15/02 ,  F21V8/00

CPC classification number: G03B15/02 ,  B29D11/00307 ,  B29D11/00365 ,  B29D11/00663 ,  B29D11/00692 ,  G02B6/0011 ,  G02B13/0085 ,  G02B19/0061

Abstract: The optical system comprises a base plate having a first plate side and a second plate side, a light guide element located substantially on said first plate side and a lens element located on said second plate side. The base plate and the light guide element are integrally formed or are distinct parts, and the base plate is at least partially transparent The optical system forms a light path for light passing through said lens element, across said base plate and through said light guide element, and wherein said base plate comprises at least one mechanical guiding element. The method for manufacturing such an optical system comprises providing a wafer comprising a multitude of said base plates.

Abstract translation: 光学系统包括具有第一板侧和第二板侧的基板，基本上位于所述第一板侧的导光元件和位于所述第二板侧的透镜元件。 基板和导光元件整体形成或不同的部分，并且基板至少部分透明。光学系统形成光通过所述透镜元件的光，穿过所述基板并通过所述导光元件 ，并且其中所述基板包括至少一个机械引导元件。 制造这种光学系统的方法包括提供包括多个所述基板的晶片。

公开(公告)号：US20190081187A1

公开(公告)日：2019-03-14

申请号：US16093840

申请日：2017-04-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Martin Lukas Balimann ,  Matthias Gloor ,  Hartmut Rudmann ,  Nicola Spring

IPC: H01L31/0232 ,  G02B19/00 ,  G02B7/00 ,  G03B17/12 ,  G03B21/14 ,  H01L27/146 ,  G02B6/42

Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.

公开(公告)号：US10204945B2

公开(公告)日：2019-02-12

申请号：US15850003

申请日：2017-12-21

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Jukka Alasirniö ,  Bojan Tesanovic ,  Tobias Senn ,  Devanraj Kupusamy ,  Alexander Bietsch

IPC: H01L21/00 ,  H01L27/146 ,  H01L23/00 ,  H04N5/225

Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

公开(公告)号：US10186540B2

公开(公告)日：2019-01-22

申请号：US14743073

申请日：2015-06-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H04N5/225 ,  H01L25/00 ,  G02B13/00 ,  G02B5/22 ,  F21V5/04 ,  G02B7/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L23/00 ,  H01L31/054 ,  H01L33/58 ,  F21Y115/10

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

公开(公告)号：US20180295453A1

公开(公告)日：2018-10-11

申请号：US15788267

申请日：2017-10-19

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Jens Geiger ,  Markus Rossi ,  Hartmut Rudmann

IPC: H04R19/04 ,  H04R3/00 ,  B81C1/00 ,  H04R31/00 ,  B81B7/00 ,  H04R19/00

CPC classification number: H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00873 ,  H04R3/00 ,  H04R19/005 ,  H04R31/00

Abstract: The disclosure describes various MEMS microphone modules that have a small footprint and can be integrated, for example, into consumer electronic or other devices in which space is at premium. Wafer-level fabrication techniques for making the modules also are described.

公开(公告)号：US20180267214A1

公开(公告)日：2018-09-20

申请号：US15546298

申请日：2016-01-26

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Markus Rossi ,  Hans Peter Herzig ,  Philipp Mueller ,  Ali Naqavi ,  Daniel Infante Gomez ,  Moshe Doron ,  Matthias Gloor ,  Alireza Yasan ,  Hartmut Rudmann ,  Martin Lukas Balimann ,  Mai-Lan Elodie Boytard ,  Bassam Hallal ,  Daniel Pérez Calero ,  Julien Boucart ,  Hendrik Volkerink

IPC: G02B3/00 ,  G02B3/04

CPC classification number: G02B3/0056 ,  F21Y2105/16 ,  F21Y2115/30 ,  G02B3/0062 ,  G02B3/04 ,  G02B5/045 ,  G02B19/0066 ,  G02B27/0905 ,  G02B27/48 ,  G02B2207/123

Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N≥1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.

公开(公告)号：US09997506B2

公开(公告)日：2018-06-12

申请号：US15626699

申请日：2017-06-19

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H01L25/16 ,  H01L33/58 ,  H01L27/146 ,  H01L25/075 ,  H01L23/544

CPC classification number: H01L25/167 ,  H01L23/544 ,  H01L25/0753 ,  H01L25/162 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L27/1469 ,  H01L33/58 ,  H01L2223/54426 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2933/0058 ,  H01L2924/00

Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

公开(公告)号：US09887221B2

公开(公告)日：2018-02-06

申请号：US15119182

申请日：2015-02-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Jukka Alasirniö ,  Bojan Tesanovic ,  Tobias Senn ,  Devanraj Kupusamy ,  Alexander Bietsch

IPC: H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H04N5/225

CPC classification number: H01L27/14618 ,  H01L24/48 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/181 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

公开(公告)号：US20180006192A1

公开(公告)日：2018-01-04

申请号：US15631361

申请日：2017-06-23

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Qichuan Yu ,  Simon Gubser ,  Bojan Tesanovic ,  Xu Yi ,  Eunice Ho Hui Ong ,  Hongyuan Liu ,  Ji Wang ,  Edmund Koon Tian Lua ,  Myo Paing ,  Jian Tang ,  Ming Jie Lee

IPC: H01L33/48 ,  H01L31/02 ,  H01L33/54 ,  H01L31/0232 ,  H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L31/0203

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.