公开(公告)号：US20060279300A1

公开(公告)日：2006-12-14

申请号：US11423808

申请日：2006-06-13

申请人： Igor Khandros ,  A. Sporck ,  Benjamin Eldridge

发明人： Igor Khandros ,  A. Sporck ,  Benjamin Eldridge

IPC分类号： G01R31/02

CPC分类号： H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

摘要翻译： 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US20070210822A1

公开(公告)日：2007-09-13

申请号：US11749004

申请日：2007-05-15

申请人： Igor Khandros ,  Benjamin Eldridge ,  A. Sporck ,  Charles Miller

发明人： Igor Khandros ,  Benjamin Eldridge ,  A. Sporck ,  Charles Miller

IPC分类号： G01R31/26

CPC分类号： G01R31/3025 ,  G01R31/31907 ,  G01R31/31908

摘要： One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.

摘要翻译： 一个或多个测试人员与一个或多个测试台无线通信。 无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。 无线通信还可以包括将测试结果传输给测试者。 消息也可以被无线地交换。

公开(公告)号：US20070182438A1

公开(公告)日：2007-08-09

申请号：US11696582

申请日：2007-04-04

申请人： Igor Khandros ,  Benjamin Eldridge ,  Charles Miller ,  A. Sporck

发明人： Igor Khandros ,  Benjamin Eldridge ,  Charles Miller ,  A. Sporck

IPC分类号： G01R31/26

CPC分类号： G01R1/0491 ,  G01R1/073 ,  G01R31/3025

摘要： A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.

摘要翻译： 设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。 基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。 然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

公开(公告)号：US20050086021A1

公开(公告)日：2005-04-21

申请号：US10690170

申请日：2003-10-21

申请人： Igor Khandros ,  Benjamin Eldridge ,  A. Sporck ,  Charles Miller

发明人： Igor Khandros ,  Benjamin Eldridge ,  A. Sporck ,  Charles Miller

IPC分类号： G01R31/319 ,  G06F19/00 ,  G01R31/00

CPC分类号： G01R31/3025 ,  G01R31/31907 ,  G01R31/31908

摘要： One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.

摘要翻译： 一个或多个测试人员与一个或多个测试台无线通信。 无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。 无线通信还可以包括将测试结果传输给测试者。 消息也可以被无线地交换。

公开(公告)号：US20050035347A1

公开(公告)日：2005-02-17

申请号：US10889334

申请日：2004-07-12

申请人： Igor Khandros ,  A. Sporck ,  Benjamin Eldridge

发明人： Igor Khandros ,  A. Sporck ,  Benjamin Eldridge

IPC分类号： B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01L23/58

CPC分类号： H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

摘要： In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

摘要翻译： 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US20050225347A1

公开(公告)日：2005-10-13

申请号：US10820319

申请日：2004-04-08

申请人： Igor Khandros ,  Benjamin Eldridge ,  Charles Miller ,  A. Sporck

发明人： Igor Khandros ,  Benjamin Eldridge ,  Charles Miller ,  A. Sporck

IPC分类号： G01R1/073 ,  G01R31/02 ,  G01R31/26

CPC分类号： G01R1/0491 ,  G01R1/073 ,  G01R31/3025

摘要： A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.

摘要翻译： 设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。 基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。 然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

公开(公告)号：US20070285114A1

公开(公告)日：2007-12-13

申请号：US11733562

申请日：2007-04-10

申请人： David Pedersen ,  Benjamin Eldridge ,  Igor Khandros

发明人： David Pedersen ,  Benjamin Eldridge ,  Igor Khandros

IPC分类号： G01R31/02

CPC分类号： H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

摘要： Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

摘要翻译： 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。 插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。 公开了各种捕获垫结构。 通过邻近插座基板表面的导电迹线提供与外部设备的连接。 插座基板可以由支撑基板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

公开(公告)号：US20060006384A1

公开(公告)日：2006-01-12

申请号：US11221231

申请日：2005-09-06

申请人： Benjamin Eldridge ,  Igor Khandros ,  David Pedersen ,  Ralph Whitten

发明人： Benjamin Eldridge ,  Igor Khandros ,  David Pedersen ,  Ralph Whitten

IPC分类号： H01L23/58

CPC分类号： G01R1/07307 ,  G01R31/2884 ,  G01R31/31723 ,  H01L22/32 ,  H01L23/50 ,  H01L23/60 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2224/29099 ,  H01L2924/00

摘要： One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e.g., nonvolatile circuits) at the die or package level. The special contact points may also be used to select redundant circuits for faulty circuits.

摘要翻译： 本发明的一个实施例涉及包括接合焊盘和特殊接触焊盘或点的集成电路。 接合焊盘用于将集成电路作为整体与外部电路接口，并且将被连接到封装或电路板。 接合焊盘以预定的对准方式设置在管芯上，例如外围，栅格或中心对准。 特殊接触焊盘用于向内部电路提供外部测试模式和/或外部监测测试内部电路的结果。 特别的接触垫可以有利地以高度的位置自由度位于集成电路上。 对于一个实施例，特殊接触焊盘可以在与焊盘不同于对准的位置处设置在管芯上。 特殊的接触焊盘可以小于接合焊盘，以便不会由于特殊的接触垫而增加管芯的尺寸。 特殊接触点也可以用于在芯片或封装级别外部编程内部电路（例如非易失性电路）。 特殊接触点也可用于选择故障电路的冗余电路。

公开(公告)号：US20050146339A1

公开(公告)日：2005-07-07

申请号：US11073187

申请日：2005-03-04

申请人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

发明人： Gary Grube ,  Igor Khandros ,  Benjamin Eldridge ,  Gaetan Mathieu ,  Poya Lotfizadeh ,  Chih-Chiang Tseng

IPC分类号： G01R31/26 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R31/2886 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49126

摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

公开(公告)号：US20080116927A1

公开(公告)日：2008-05-22

申请号：US12020380

申请日：2008-01-25

申请人： Thomas Dozier ,  Benjamin Eldridge ,  Igor Khandros ,  Gaetan Mathieu ,  Sheldon Taylor

发明人： Thomas Dozier ,  Benjamin Eldridge ,  Igor Khandros ,  Gaetan Mathieu ,  Sheldon Taylor

IPC分类号： G01R1/067 ,  G01R31/02

CPC分类号： G01R1/06727 ,  G01R1/07342 ,  H01L2924/01074 ,  H01L2924/01078

摘要： Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which they are attached, by brazing, plating or the like. The contact tip structures are readily provided with topological (small, precise, projecting, non-planar) contact features, such as in the form of truncated pyramids, to optimize electrical pressure connections subsequently being made to terminals of electronic components. Elongate contact tip structures, adapted in use to function as spring contact elements without the necessity of being joined to resilient contact elements are described. Generally, the invention is directed to making (pre-fabricating) relatively ‘perfect’ contact tip structures (“tips”) and joining them to relatively ‘imperfect’ interconnection elements to improve the overall capabilities of resulting “tipped” interconnection elements.

摘要翻译： 接触尖端结构被制造在牺牲衬底上，用于随后连接到包括复合互连元件，单片互连元件，探针卡的钨针，膜探针的接触凸块等的互连元件。 尖端结构之间的空间关系可以光刻地定义为非常接近的公差。 尖端结构的冶金独立于它们所连接的互连元件的冶金，通过钎焊，电镀等。 接触尖端结构容易地具有拓扑（小的，精确的，突出的，非平面的）接触特征，例如呈截锥形的形式，以优化随后对电子部件的端子进行的电压连接。 描述了适于用作弹簧接触元件而不需要接合到弹性接触元件的细长接触尖端结构。 通常，本发明旨在制造（预制）相对“完美”的接触尖端结构（“尖端”）并将它们连接到相对“不完美”的互连元件，以改善所产生的“尖端”互连元件的整体能力。