CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME
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    发明申请
    CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME 审中-公开
    微电子互连元件的接点提示结构及其制作方法

    公开(公告)号:US20080116927A1

    公开(公告)日:2008-05-22

    申请号:US12020380

    申请日:2008-01-25

    IPC分类号: G01R1/067 G01R31/02

    摘要: Contact tip structures are fabricated on sacrificial substrates for subsequent joining to interconnection elements including composite interconnection elements, monolithic interconnection elements, tungsten needles of probe cards, contact bumps of membrane probes, and the like. The spatial relationship between the tip structures can lithographically be defined to very close tolerances. The metallurgy of the tip structures is independent of that of the interconnection element to which they are attached, by brazing, plating or the like. The contact tip structures are readily provided with topological (small, precise, projecting, non-planar) contact features, such as in the form of truncated pyramids, to optimize electrical pressure connections subsequently being made to terminals of electronic components. Elongate contact tip structures, adapted in use to function as spring contact elements without the necessity of being joined to resilient contact elements are described. Generally, the invention is directed to making (pre-fabricating) relatively ‘perfect’ contact tip structures (“tips”) and joining them to relatively ‘imperfect’ interconnection elements to improve the overall capabilities of resulting “tipped” interconnection elements.

    摘要翻译: 接触尖端结构被制造在牺牲衬底上,用于随后连接到包括复合互连元件,单片互连元件,探针卡的钨针,膜探针的接触凸块等的互连元件。 尖端结构之间的空间关系可以光刻地定义为非常接近的公差。 尖端结构的冶金独立于它们所连接的互连元件的冶金,通过钎焊,电镀等。 接触尖端结构容易地具有拓扑(小的,精确的,突出的,非平面的)接触特征,例如呈截锥形的形式,以优化随后对电子部件的端子进行的电压连接。 描述了适于用作弹簧接触元件而不需要接合到弹性接触元件的细长接触尖端结构。 通常,本发明旨在制造(预制)相对“完美”的接触尖端结构(“尖端”)并将它们连接到相对“不完美”的互连元件,以改善所产生的“尖端”互连元件的整体能力。