发明申请
US20070285114A1 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component
失效
用于制造电子元件的插座，特别是具有弹簧封装的半导体器件，用于固定，测试，燃烧或操作这样的部件
- 专利标题： Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component
- 专利标题（中）： 用于制造电子元件的插座，特别是具有弹簧封装的半导体器件，用于固定，测试，燃烧或操作这样的部件
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申请号： US11733562申请日： 2007-04-10
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公开(公告)号： US20070285114A1公开(公告)日： 2007-12-13
- 发明人: David Pedersen , Benjamin Eldridge , Igor Khandros
- 申请人： David Pedersen , Benjamin Eldridge , Igor Khandros
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.
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