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公开(公告)号:US20250020689A1
公开(公告)日:2025-01-16
申请号:US18762393
申请日:2024-07-02
Applicant: FormFactor, Inc.
Inventor: Choon Beng Sia , Yoichi Funatoko , Isao Kunioka , Masanori Watanabe , Peter Andrews , Ken Dawson
Abstract: Probes, probe blades, tools for probe blades, blade holders, and probe systems for electrically testing a device under test (DUT). In some examples, the probe blades are configured to provide a Kelvin electrical connection with the DUT. In some examples, the probe blades include an alignment structure configured to engage with a blade holder when the probe blade is received within a blade-receiving region of the blade holder. The blade holders are configured to separably and operatively attach a probe blade to a probe system. In some examples, the blade holders include the probe blade. The probe systems are configured to electrically test the DUT and include the blade holder.
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公开(公告)号:US12044704B2
公开(公告)日:2024-07-23
申请号:US17682825
申请日:2022-02-28
Applicant: FormFactor, Inc.
Inventor: Kalyanjit Ghosh , Douglas Stewart Ondricek , Paul Hsiao
CPC classification number: G01R1/07342 , G01R31/2886
Abstract: A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
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公开(公告)号:US20240201225A1
公开(公告)日:2024-06-20
申请号:US18391228
申请日:2023-12-20
Applicant: FormFactor, Inc.
Inventor: Kevin John Hughes , January Kister
IPC: G01R1/073
CPC classification number: G01R1/07307
Abstract: MEMS probes are provided having decoupled electrical and mechanical design. In these probes, electrical conduction is primarily through one or more electrically conductive rails, and mechanical compliance for vertical compression is provided by a coil. The resulting independence of electrical and mechanical design advantageously enables probes to have a combination of electrical and mechanical properties that cannot be obtained in probes where the probe body is subject to both electrical and mechanical design constraints.
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公开(公告)号:US20240110942A1
公开(公告)日:2024-04-04
申请号:US18468568
申请日:2023-09-15
Applicant: FormFactor, Inc.
Inventor: Benjamin E. Waters
CPC classification number: G01R1/06705 , G01R31/2887
Abstract: Remote control devices for motorized positioners of probe systems, probe systems that include the remote control devices, and methods of remotely operating a motorized positioner of a probe system are disclosed herein. The remote control devices include a first rotary encoder, a second rotary encoder, a third rotary encoder, and a remote processing device. The probe systems include a chuck, a signal generation and analysis assembly, a probe, a motorized positioner, a local processing device, and the remote control device. The methods include generating a control signal utilizing the remote control device and transmitting the control signal to the probe system. The methods also include translating a probe of the probe system relative to a support surface of the probe system. The translating is based, at least in part, on the control signal.
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公开(公告)号:US11486898B2
公开(公告)日:2022-11-01
申请号:US17345613
申请日:2021-06-11
Applicant: FormFactor, Inc.
Inventor: Tim Lesher , Jason William Cosman
Abstract: Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.
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公开(公告)号:US11378619B2
公开(公告)日:2022-07-05
申请号:US17111283
申请日:2020-12-03
Applicant: FormFactor, Inc.
Inventor: Masahiro Sameshima
IPC: G01R31/28 , G01R1/44 , G01R31/319
Abstract: Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.
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公开(公告)号:US11346883B2
公开(公告)日:2022-05-31
申请号:US17076279
申请日:2020-10-21
Applicant: FormFactor, Inc.
Inventor: Kazuki Negishi
Abstract: Probe systems and methods for testing a device under test are disclosed herein. The probe systems include an electrically conductive ground loop and a structure that is electrically connected to a ground potential via at least a region of the electrically conductive ground loop. The probe systems also include nonlinear circuitry. The nonlinear circuitry is configured to resist flow of electric current within the ground loop when a voltage differential across the nonlinear circuitry is less than a threshold voltage differential and permit flow of electric current within the ground loop when the voltage differential across the nonlinear circuitry is greater than the threshold voltage differential. The methods include positioning a device under test (DUT) within a probe system that includes an electrically conductive ground loop and nonlinear circuitry. The methods also include selectively resisting and permitting electric current flow within the ground loop and through the nonlinear circuitry.
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公开(公告)号:US11313936B2
公开(公告)日:2022-04-26
申请号:US17028102
申请日:2020-09-22
Applicant: FormFactor, Inc.
Inventor: Joseph George Frankel , Kazuki Negishi
IPC: G01R35/00 , G01R31/308 , G01R1/067 , G01R31/28
Abstract: Probe systems and methods of characterizing optical coupling between an optical probe of a probe system and a calibration structure. The probe systems include a probe assembly that includes an optical probe, a support surface configured to support a substrate, and a signal generation and analysis assembly configured to generate an optical signal and to provide the optical signal to the optical device via the optical probe. The probe systems also include an electrically actuated positioning assembly, a calibration structure configured to receive the optical signal, and an optical detector configured to detect a signal intensity of the optical signal. The probe systems further include a controller programmed to control the probe system to generate a representation of signal intensity as a function of the relative orientation between the optical probe and the calibration structure. The methods include methods of operating the probe systems.
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公开(公告)号:US20210389348A1
公开(公告)日:2021-12-16
申请号:US17345613
申请日:2021-06-11
Applicant: FormFactor, Inc.
Inventor: Tim Lesher , Jason William Cosman
Abstract: Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.
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公开(公告)号:US11181550B2
公开(公告)日:2021-11-23
申请号:US16421243
申请日:2019-05-23
Applicant: FormFactor, Inc.
Inventor: Sia Choon Beng , Kazuki Negishi
Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.
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