-
公开(公告)号：CN102812543A
公开(公告)日：2012-12-05
申请号：CN201180014602.7
申请日：2011-03-18
Applicant: 古河电气工业株式会社
IPC: H01L21/60
CPC classification number: H01L23/4924 , H01L21/4853 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05166 , H01L2224/05644 , H01L2224/1132 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13294 , H01L2224/13305 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13323 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13349 , H01L2224/13355 , H01L2224/13357 , H01L2224/13364 , H01L2224/13366 , H01L2224/13369 , H01L2224/1601 , H01L2224/16227 , H01L2224/16245 , H01L2224/2732 , H01L2224/2747 , H01L2224/29294 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/29317 , H01L2224/29318 , H01L2224/2932 , H01L2224/29323 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/3201 , H01L2224/32227 , H01L2224/32245 , H01L2224/81075 , H01L2224/81125 , H01L2224/81127 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/8184 , H01L2224/83075 , H01L2224/83125 , H01L2224/83127 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83447 , H01L2224/8384 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/351 , H05K2203/0338 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
Abstract: 本发明提供由热循环特性优异的金属多孔质体构成的导电性凸块、导电性芯片焊接部等导电连接部件。所述导电连接部件在半导体元件的电极端子或电路基板的电极端子的接合面形成，其特征在于，该导电连接部件是对包含平均一次粒径为10nm～500nm的金属微粒(P)和有机溶剂(S)或者由有机溶剂(S)与有机粘结剂(R)构成的有机分散介质(D)的导电性糊料进行加热处理而使金属微粒彼此结合所形成的金属多孔质体，该金属多孔质体的空隙率为5体积%～35体积%，构成该金属多孔质体的金属微粒的平均粒径为10nm～500nm的范围，且存在于该金属微粒间的平均空穴直径为1nm～200nm的范围。
-
公开(公告)号：CN102812543B
公开(公告)日：2016-03-30
申请号：CN201180014602.7
申请日：2011-03-18
Applicant: 古河电气工业株式会社
IPC: H01L21/60
CPC classification number: H01L23/4924 , H01L21/4853 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05166 , H01L2224/05644 , H01L2224/1132 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13294 , H01L2224/13305 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13323 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13349 , H01L2224/13355 , H01L2224/13357 , H01L2224/13364 , H01L2224/13366 , H01L2224/13369 , H01L2224/1601 , H01L2224/16227 , H01L2224/16245 , H01L2224/2732 , H01L2224/2747 , H01L2224/29294 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/29317 , H01L2224/29318 , H01L2224/2932 , H01L2224/29323 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/3201 , H01L2224/32227 , H01L2224/32245 , H01L2224/81075 , H01L2224/81125 , H01L2224/81127 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/8184 , H01L2224/83075 , H01L2224/83125 , H01L2224/83127 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83447 , H01L2224/8384 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/351 , H05K2203/0338 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
Abstract: 本发明提供由热循环特性优异的金属多孔质体构成的导电性凸块、导电性芯片焊接部等导电连接部件。所述导电连接部件在半导体元件的电极端子或电路基板的电极端子的接合面形成，其特征在于，该导电连接部件是对包含平均一次粒径为10nm～500nm的金属微粒(P)和有机溶剂(S)或者由有机溶剂(S)与有机粘结剂(R)构成的有机分散介质(D)的导电性糊料进行加热处理而使金属微粒彼此结合所形成的金属多孔质体，该金属多孔质体的空隙率为5体积%～35体积%，构成该金属多孔质体的金属微粒的平均粒径为10nm～500nm的范围，且存在于该金属微粒间的平均空穴直径为1nm～200nm的范围。
-
Search Results
2
records
(took 0.02 seconds)
