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公开(公告)号：CN101661894B
公开(公告)日：2012-01-11
申请号：CN200910168130.5
申请日：2009-08-28
IPC: H01L21/50 , H01L21/60 , H01L21/56 , H01L21/58 , H01L25/00 , H01L23/495 , H01L23/48 , H01L21/48 , H01L23/28 , H01L23/488 , H01L23/49 , H01L23/13
CPC classification number: H01L24/06 , H01L21/4842 , H01L21/565 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L23/49589 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05553 , H01L2224/05599 , H01L2224/0603 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48599 , H01L2224/48699 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/85201 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19105 , H01L2924/00
Abstract: 本发明提供树脂密封型半导体装置及其制造方法、树脂密封型电子装置。该树脂密封型电子装置谋求消灭切断连接杆时产生的焊锡毛刺，可靠性高。防止树脂密封型电子装置的引线和外部电极的焊接不良，且增大引线与电子零件的接合面积，防止连接不良。根据本发明的树脂密封型半导体装置的制造方法，将半导体芯片等搭载在引线框上，进行树脂封装之后，切断连接杆的情况下，从冲压加工时的上述引线框的存在引线毛刺的方向切断上述连接杆。在本发明的树脂密封型电子装置中，芯片电容器借助导电性糊剂接合在引线和岛的毛刺形成面。毛刺形成面的表面积大于塌角面的表面积，所以能增大焊接面积。引线的与控制电极的焊接面为作为毛刺形成面的相反面的塌角面。
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Patent Agency Ranking
公开(公告)号：CN102244016A
公开(公告)日：2011-11-16
申请号：CN201110157820.8
申请日：2009-08-28
IPC: H01L21/56 , H01L21/60 , H01L23/28 , H01L23/495
CPC classification number: H01L23/49541 , B23K20/005 , B23K20/106 , B23K2101/42 , H01L21/4842 , H01L21/565 , H01L21/82 , H01L23/3107 , H01L23/49503 , H01L23/49575 , H01L23/49589 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/0655 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/484 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2224/78 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
Abstract: 本发明提供一种树脂密封型半导体装置及其制造方法、引线框。防止因超声波Al引线接合牢固地将被固定在引线框上的各半导体芯片等和引线框的引线接合部接合以及切断引线框的外框时的外框的未切断部分而造成的各半导体芯片等产生短路的弊害。使引线框上的引线接合部等沿引线接合方向延伸，用连结引线等与引线框的外框连结，从而阻止超声波Al引线接合时的超声波振动力的发散，形成Al线与引线接合部等的牢固的接合。而且，树脂密封工序结束后，切断外框，但即使外框的未切断部分残留在树脂封装件的侧面的情况下，通过在连结引线等和其他悬吊引线等之间的外框上设有缺口等，防止连结引线等与悬吊引线等连结。
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公开(公告)号：CN101661893A
公开(公告)日：2010-03-03
申请号：CN200910168127.3
申请日：2009-08-28
IPC: H01L21/50 , H01L21/607 , H01L21/56 , H01L23/495 , H01L21/48 , H01L21/60 , H01L23/28
CPC classification number: H01L23/49541 , B23K20/005 , B23K20/106 , B23K2101/42 , H01L21/4842 , H01L21/565 , H01L21/82 , H01L23/3107 , H01L23/49503 , H01L23/49575 , H01L23/49589 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/0655 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/484 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2224/78 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
Abstract: 本发明提供一种树脂密封型半导体装置及其制造方法、引线框。防止因超声波Al引线接合牢固地将被固定在引线框上的各半导体芯片等和引线框的引线接合部接合以及切断引线框的外框时的外框的未切断部分而造成的各半导体芯片等产生短路的弊害。使引线框上的引线接合部等沿引线接合方向延伸，用连结引线等与引线框的外框连结，从而阻止超声波Al引线接合时的超声波振动力的发散，形成Al线与引线接合部等的牢固的接合。而且，树脂密封工序结束后，切断外框，但即使外框的未切断部分残留在树脂封装件的侧面的情况下，通过在连结引线等和其他悬吊引线等之间的外框上设有缺口等，防止连结引线等与悬吊引线等连结。
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公开(公告)号：CN102244016B
公开(公告)日：2015-06-17
申请号：CN201110157820.8
申请日：2009-08-28
IPC: H01L21/56 , H01L21/60 , H01L23/28 , H01L23/495
CPC classification number: H01L23/49541 , B23K20/005 , B23K20/106 , B23K2101/42 , H01L21/4842 , H01L21/565 , H01L21/82 , H01L23/3107 , H01L23/49503 , H01L23/49575 , H01L23/49589 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/0655 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/484 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2224/78 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
Abstract: 本发明提供一种树脂密封型半导体装置及其制造方法、引线框。防止因超声波Al引线接合牢固地将被固定在引线框上的各半导体芯片等和引线框的引线接合部接合以及切断引线框的外框时的外框的未切断部分而造成的各半导体芯片等产生短路的弊害。使引线框上的引线接合部等沿引线接合方向延伸，用连结引线等与引线框的外框连结，从而阻止超声波Al引线接合时的超声波振动力的发散，形成Al线与引线接合部等的牢固的接合。而且，树脂密封工序结束后，切断外框，但即使外框的未切断部分残留在树脂封装件的侧面的情况下，通过在连结引线等和其他悬吊引线等之间的外框上设有缺口等，防止连结引线等与悬吊引线等连结。
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公开(公告)号：CN101661893B
公开(公告)日：2011-07-27
申请号：CN200910168127.3
申请日：2009-08-28
IPC: H01L21/50 , H01L21/607 , H01L21/56 , H01L23/495 , H01L21/48 , H01L21/60 , H01L23/28
CPC classification number: H01L23/49541 , B23K20/005 , B23K20/106 , B23K2101/42 , H01L21/4842 , H01L21/565 , H01L21/82 , H01L23/3107 , H01L23/49503 , H01L23/49575 , H01L23/49589 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/0655 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/05624 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/484 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2224/78 , H01L2924/00 , H01L2224/48824 , H01L2924/00012
Abstract: 本发明提供一种树脂密封型半导体装置及其制造方法、引线框。防止因超声波A1引线接合牢固地将被固定在引线框上的各半导体芯片等和引线框的引线接合部接合以及切断引线框的外框时的外框的未切断部分而造成的各半导体芯片等产生短路的弊害。使引线框上的引线接合部等沿引线接合方向延伸，用连结引线等与引线框的外框连结，从而阻止超声波A1引线接合时的超声波振动力的发散，形成A1线与引线接合部等的牢固的接合。而且，树脂密封工序结束后，切断外框，但即使外框的未切断部分残留在树脂封装件的侧面的情况下，通过在连结引线等和其他悬吊引线等之间的外框上设有缺口等，防止连结引线等与悬吊引线等连结。
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公开(公告)号：CN101661894A
公开(公告)日：2010-03-03
申请号：CN200910168130.5
申请日：2009-08-28
IPC: H01L21/50 , H01L21/60 , H01L21/56 , H01L21/58 , H01L25/00 , H01L23/495 , H01L23/48 , H01L21/48 , H01L23/28 , H01L23/488 , H01L23/49 , H01L23/13
CPC classification number: H01L24/06 , H01L21/4842 , H01L21/565 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L23/49589 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/05553 , H01L2224/05599 , H01L2224/0603 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48599 , H01L2224/48699 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/85201 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19105 , H01L2924/00
Abstract: 本发明提供树脂密封型半导体装置及其制造方法、树脂密封型电子装置。该树脂密封型电子装置谋求消灭切断连接杆时产生的焊锡毛刺，可靠性高。防止树脂密封型电子装置的引线和外部电极的焊接不良，且增大引线与电子零件的接合面积，防止连接不良。根据本发明的树脂密封型半导体装置的制造方法，将半导体芯片等搭载在引线框上，进行树脂封装之后，切断连接杆的情况下，从冲压加工时的上述引线框的存在引线毛刺的方向切断上述连接杆。在本发明的树脂密封型电子装置中，芯片电容器借助导电性糊剂接合在引线和岛的毛刺形成面。毛刺形成面的表面积大于塌角面的表面积，所以能增大焊接面积。引线的与控制电极的焊接面为作为毛刺形成面的相反面的塌角面。
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