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公开(公告)号：CN103765577B
公开(公告)日：2017-04-26
申请号：CN201280041440.0
申请日：2012-08-09
Applicant: 日立汽车系统株式会社
CPC classification number: H05K7/209 , B60L1/003 , B60L1/02 , B60L3/003 , B60L11/123 , B60L11/14 , B60L15/007 , B60L15/2036 , B60L2200/26 , B60L2200/42 , B60L2210/40 , B60L2220/14 , B60L2240/12 , B60L2240/24 , B60L2240/36 , B60L2240/421 , B60L2240/423 , B60L2240/525 , B60L2250/16 , B60L2250/24 , B60L2250/26 , B60L2260/28 , H01L21/565 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49575 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/06181 , H01L2224/291 , H01L2224/29139 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37157 , H01L2224/3716 , H01L2224/3718 , H01L2224/3754 , H01L2224/40137 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01047 , H01L2924/1203 , H01L2924/12042 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/203 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/003 , H05K7/20927 , Y02P90/60 , Y02T10/6217 , Y02T10/645 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/0002 , H01L2924/01033 , H01L2224/45099
Abstract: 本发明提供一种功率模块，其包括：密封体，其用树脂将搭载有半导体芯片的导体板以该导体板的散热面露出的方式密封；散热部件，其以与散热面相对的方式配置；绝缘层，其配置于密封体与散热部件之间，绝缘层具有：层叠体，其将含浸有含浸用树脂的陶瓷喷镀膜和混入有导热性良好的填料的粘接用树脂层层叠，以与散热部件和至少散热面的整个区域相接触的方式设置；应力缓和用树脂部，其以覆盖层叠体的端部的整个边缘的方式设于散热部件与密封体之间的间隙。
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公开(公告)号：CN103999211B
公开(公告)日：2017-04-05
申请号：CN201280061694.9
申请日：2012-11-09
Applicant: 日立汽车系统株式会社
CPC classification number: H05K7/20427 , H01L23/34 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L25/072 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49175 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K1/0271 , H05K7/02 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 本发明提供一种功率半导体模块及功率模块。并且提供树脂密封部与具有导体板的功率半导体模块之间的紧贴力及导热率大的绝缘膜。在功率半导体模块(302)与散热部(307B)之间设有绝缘层(700)。功率半导体模块(302)具备覆盖导体板(315)的周侧面的树脂密封部(348)，在树脂密封部(348)上设有多个凹部(348D)。绝缘层(700)由喷镀膜(710)、绝缘膜(720)、树脂层(730)构成，喷镀膜(710)在包括凹部(348D)的树脂密封部(348)的表面形成为整面状。凹部(348D)的平面尺寸形成得比构成喷镀膜(710)的各扁平体(711)的平面尺寸大。
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公开(公告)号：CN103999211A
公开(公告)日：2014-08-20
申请号：CN201280061694.9
申请日：2012-11-09
Applicant: 日立汽车系统株式会社
CPC classification number: H05K7/20427 , H01L23/34 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L25/072 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49175 , H01L2224/73265 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K1/0271 , H05K7/02 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 本发明提供一种功率半导体模块及功率模块。并且提供树脂密封部与具有导体板的功率半导体模块之间的紧贴力及导热率大的绝缘膜。在功率半导体模块(302)与散热部(307B)之间设有绝缘层(700)。功率半导体模块(302)具备覆盖导体板(315)的周侧面的树脂密封部(348)，在树脂密封部(348)上设有多个凹部(348D)。绝缘层(700)由喷镀膜(710)、绝缘膜(720)、树脂层(730)构成，喷镀膜(710)在包括凹部(348D)的树脂密封部(348)的表面形成为整面状。凹部(348D)的平面尺寸形成得比构成喷镀膜(710)的各扁平体(711)的平面尺寸大。
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公开(公告)号：CN103765577A
公开(公告)日：2014-04-30
申请号：CN201280041440.0
申请日：2012-08-09
Applicant: 日立汽车系统株式会社
CPC classification number: H05K7/209 , B60L1/003 , B60L1/02 , B60L3/003 , B60L11/123 , B60L11/14 , B60L15/007 , B60L15/2036 , B60L2200/26 , B60L2200/42 , B60L2210/40 , B60L2220/14 , B60L2240/12 , B60L2240/24 , B60L2240/36 , B60L2240/421 , B60L2240/423 , B60L2240/525 , B60L2250/16 , B60L2250/24 , B60L2250/26 , B60L2260/28 , H01L21/565 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/49524 , H01L23/49575 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/06181 , H01L2224/291 , H01L2224/29139 , H01L2224/32225 , H01L2224/371 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37157 , H01L2224/3716 , H01L2224/3718 , H01L2224/3754 , H01L2224/40137 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01047 , H01L2924/1203 , H01L2924/12042 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/203 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/003 , H05K7/20927 , Y02P90/60 , Y02T10/6217 , Y02T10/645 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2924/0002 , H01L2924/01033 , H01L2224/45099
Abstract: 本发明提供一种功率模块，其包括：密封体，其用树脂将搭载有半导体芯片的导体板以该导体板的散热面露出的方式密封；散热部件，其以与散热面相对的方式配置；绝缘层，其配置于密封体与散热部件之间，绝缘层具有：层叠体，其将含浸有含浸用树脂的陶瓷喷镀膜和混入有导热性良好的填料的粘接用树脂层层叠，以与散热部件和至少散热面的整个区域相接触的方式设置；应力缓和用树脂部，其以覆盖层叠体的端部的整个边缘的方式设于散热部件与密封体之间的间隙。
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