公开(公告)号：US12207443B2

公开(公告)日：2025-01-21

申请号：US17812855

申请日：2022-07-15

Applicant: Dell Products L.P.

Inventor： Qinghong He

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/427 ,  H01L23/467

Abstract: In one or more embodiments, one or more systems comprise a heat exchanger comprising a first heat sink coupled to a first portion of a set of heat pipes, a first fan for generating a first airflow in a first direction through the first heat sink, a second heat sink coupled to a second portion of the set of heat pipes and a second fan for generating a second airflow in a second direction through the second heat sink, wherein the first heat sink is separated from the second heat sink by a gap with a distance configured to thermally isolate the first heat sink and the second heat sink and the first direction is opposite the second direction. The heat exchanger may be oriented such that the first fan and the second fan generate airflows perpendicular to a main airflow.

公开(公告)号：US12183659B2

公开(公告)日：2024-12-31

申请号：US18397505

申请日：2023-12-27

Applicant: Adeia Semiconductor Bonding Technologies Inc.

Inventor： Belgacem Haba

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/427 ,  H01L23/467 ,  H01L25/18 ,  H10B80/00

Abstract: A device package may include a package substrate, a package cover disposed on the package substrate, and an integrated cooling assembly disposed between the package substrate and the package cover. The package cover generally has an inlet opening and an outlet opening disposed there through. The integrated cooling assembly includes a semiconductor device and a cold plate attached to the semiconductor device. The device package may include a material layer between the package cover and the cold plate. The cold plate may include a patterned first side and an opposite second side. The patterned first side may include a base surface and sidewalls extending downward from the base surface, where the base surface is spaced apart from the semiconductor device to collectively define a coolant channel. Here, the coolant channel is in fluid communication with the inlet opening and the outlet opening through openings disposed through respective portions of the material layer.

公开(公告)号：US12173966B2

公开(公告)日：2024-12-24

申请号：US17181737

申请日：2021-02-22

Applicant: FUJITSU LIMITED

Inventor： Hideo Kubo ,  Atsushi Endo ,  Masahide Kodama ,  Shinnosuke Fujiwara

IPC: F28D15/02 ,  F28D21/00 ,  H01L23/427

Abstract: A cooling device includes a vessel having a refrigerant sealed inside, an evaporator that receives heat to evaporate a liquid phase of the refrigerant inside the vessel, a condenser that dissipates heat to condense a vapor phase of the refrigerant inside the vessel, a tube shaped transporter that transports the liquid-phase refrigerant inside the vessel to the evaporator by capillary action, and a gap generator that generates a gap between the transporter and the evaporator for the liquid-phase refrigerant to move from the transporter to the evaporator.

公开(公告)号：US20240404915A1

公开(公告)日：2024-12-05

申请号：US18807071

申请日：2024-08-16

Applicant: Delta Electronics (Shanghai) CO., LTD.

Inventor： Pengkai JI ,  Shouyu HONG ,  Xin ZOU ,  Lanyan XU

IPC: H01L23/40 ,  H01L23/427 ,  H01L23/64 ,  H01L25/18 ,  H05K7/20

Abstract: The present disclosure provides a data processing device. The data processing device includes a carrier board, a data processor, a power module, a first heat sink, and a heat transfer plate. The data processor is provided above the carrier board. The power module is provided below the carrier board and supplies power to the data processor through the carrier board. The first heat sink is provided above the carrier board. The heat transfer plate includes a main body portion and a first extension. The main body portion is provided below the power module. The first extension portion extends upward from the main body portion and is connected to the first heat sink.

公开(公告)号：US20240389282A1

公开(公告)日：2024-11-21

申请号：US18660539

申请日：2024-05-10

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Maofan Li ,  Zhibing Yang ,  Faming Sun

IPC: H05K7/20 ,  H01L23/427

Abstract: A top-mounted heat dissipation photovoltaic inverter device includes an inverter module and a top-mounted heat dissipation module. The top-mounted heat dissipation module includes a top-installed heat dissipation assembly and a back-mounted heat dissipation assembly. The top-installed heat dissipation assembly includes a condenser and a fan assembly. The back-mounted heat dissipation assembly includes an evaporator and an air-cooled heat sink. The condenser and the box are arranged in a laminated manner in a first direction. The condenser and the fan assembly are arranged adjacently in a second direction. The box, the evaporator, and the air-cooled heat sink are arranged sequentially and adjacently in the second direction. A projection of the top-installed heat dissipation assembly does not overlap with a projection of the back-mounted heat dissipation assembly in a third direction.

公开(公告)号：US12117244B2

公开(公告)日：2024-10-15

申请号：US18173576

申请日：2023-02-23

Applicant: COOLER MASTER CO., LTD.

Inventor： Chi-Lung Chen

IPC: F28D15/04 ,  F28D15/02 ,  H01L23/427 ,  H05K7/20

CPC classification number: F28D15/04 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  H01L23/427 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336

Abstract: A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

公开(公告)号：US12107032B2

公开(公告)日：2024-10-01

申请号：US16717493

申请日：2019-12-17

Applicant: ABB Schweiz AG

Inventor： Colin Tschida ,  Pietro Cairoli ,  Hongrae Kim ,  Francesco Agostini ,  Luca Raciti ,  Davide Leoni

IPC: H01L23/427 ,  H01C1/082 ,  H01C7/12 ,  H01L23/495 ,  H02H9/04 ,  H05K7/20

CPC classification number: H01L23/427 ,  H01C1/082 ,  H01C7/12 ,  H01L23/49562 ,  H02H9/044 ,  H05K7/20172 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/209 ,  H05K7/20909 ,  H05K7/20936

Abstract: Cooling arrangements are disclosed for solid state circuit breakers. In one arrangement, a MOV is disposed between two pulsating heat pipes. An IGCT is disposed on the other side of each pulsating heat pipe away from the MOV. In another arrangement, a bus bar is integral with a heat spreader disposed between a pulsating heat pipe and an IGCT.

公开(公告)号：US12094802B2

公开(公告)日：2024-09-17

申请号：US17232461

申请日：2021-04-16

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Pengkai Ji ,  Shouyu Hong ,  Xin Zou ,  Lanyan Xu

IPC: H01L23/40 ,  H01L23/427 ,  H01L25/18 ,  H05K7/20 ,  H01L23/64

CPC classification number: H01L23/4012 ,  H01L23/427 ,  H01L25/18 ,  H05K7/20445 ,  H01L2023/4087 ,  H01L23/642

Abstract: The present disclosure provides a data processing device. The data processing device includes a carrier board, a data processor, a power module, a first heat sink, and a heat transfer plate. The data processor is provided above the carrier board. The power module is provided below the carrier board and supplies power to the data processor through the carrier board. The first heat sink is provided above the carrier board. The heat transfer plate includes a main body portion and a first extension. The main body portion is provided below the power module. The first extension portion extends upward from the main body portion and is connected to the first heat sink.

公开(公告)号：US12089374B2

公开(公告)日：2024-09-10

申请号：US17683228

申请日：2022-02-28

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Lumaya Ahmed ,  Shekhar Halakatti

IPC: H05K7/20 ,  B06B1/06 ,  F04B43/04 ,  H01L23/427 ,  H01L23/433 ,  H01L23/46 ,  H10N30/20

CPC classification number: H05K7/2039 ,  B06B1/06 ,  H01L23/427 ,  H01L23/433 ,  H10N30/20

Abstract: A cooling system including a heat spreader and a cooling element is described. The heat spreader is thermally coupled with a heat-generating structure. The cooling element is in fluid communication heat spreader. The heat-generating structure is offset from the cooling element. The cooling element undergoes vibrational motion when actuated to drive a fluid toward the heat spreader while not directing the fluid directly at the heat-generating structure.

公开(公告)号：US20240295366A1

公开(公告)日：2024-09-05

申请号：US18662214

申请日：2024-05-13

Applicant: Delta Electronics, Inc.

Inventor： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ting-Yuan WU

IPC: F28D15/04 ,  F28D15/02 ,  F28D21/00 ,  H01L23/427

CPC classification number: F28D15/046 ,  H01L23/427 ,  F28D15/0233 ,  F28D2021/0028

Abstract: A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.