TRANSFORMER MODULE AND POWER MODULE
    1.
    发明公开

    公开(公告)号:US20240363282A1

    公开(公告)日:2024-10-31

    申请号:US18762688

    申请日:2024-07-03

    Abstract: A transformer module and a power module are provided. The transformer module includes: a magnetic core, a first winding and a second winding. The magnetic core includes at least one magnetic column at least partially covered by a multi-layer carrier including a plurality of horizontal copper foils and connecting copper foils. Horizontal copper foils are located on horizontal wiring layers, and connecting copper foils are disposed to connect horizontal copper foils. First and second windings surround the magnetic column, and the second winding is located outside the first winding. Both the first and second windings are formed by a horizontal copper foil and a connecting copper foil; two ends of the first winding are electrically connected to first and second surface-mounted pins; two ends of the second winding are electrically connected to third and fourth surface-mounted pins; these pins are disposed on at least one surface of the transformer module.

    SEMICONDUCTOR CHIP
    4.
    发明申请

    公开(公告)号:US20220328430A1

    公开(公告)日:2022-10-13

    申请号:US17809277

    申请日:2022-06-28

    Abstract: The present disclosure provides a semiconductor chip including a functional area, a first end, a second end, a third end, and a connecting portion. The functional area has first and second sides opposite to each other. The first end is disposed on the first side and the third end is disposed on the first side, wherein the semiconductor chip is switched on or off according to the drive signal received between the third end and the first end, and the connecting portion is disposed on the first side of the functional area and connected to the first end and the third end, wherein when the temperature rises above the a first temperature, the connecting portion is in a conductive state, and when the temperature drops to be not higher than a third temperature, the connecting portion is in an insulated state.

    MULTI-WINDING INDUCTOR AND POWER SUPPLY MODULE

    公开(公告)号:US20220285071A1

    公开(公告)日:2022-09-08

    申请号:US17653134

    申请日:2022-03-02

    Abstract: A multi-winding inductor includes a magnetic core including four magnetic columns and a winding assembly including two windings. Each winding includes three portions. The first and third portions of the first winding are respectively between the first and the second magnetic columns, and the third and the fourth magnetic columns; and the first and third portions of the second winding are respectively between the fourth and the first magnetic columns, and the second and the third magnetic columns. Both the first portions of two windings extend to a surface of the magnetic core and respectively form a first and a third pins. The winding is a flat wire with the thickness less than the width, and the width direction is parallel to an extension direction of the first magnetic column.

    COMPONENT STRUCTURE, POWER MODULE AND POWER MODULE ASSEMBLY STRUCTURE

    公开(公告)号:US20190067167A1

    公开(公告)日:2019-02-28

    申请号:US16003234

    申请日:2018-06-08

    Abstract: The present disclosure relates to a component structure, a power module and a power module assembly structure having the component structure. The component structure comprises: a first bus bar, having one end extending to a first plane to form a first connecting terminal; a second bus bar, comprising a front portion of the second bus bar and a rear portion of the second bus bar, wherein the front portion of the second bus bar is laminated in parallel with the first bus bar, and the rear portion of the second bus bar is extended to a second plane to form a second connecting terminal; and an external circuit comprising a third bus bar, wherein the third bus bar is settled in parallel with the rear portion of the second bus bar, to reduce a parasitic inductance between the first connecting terminal and the second connecting terminal.

    POWER CHIP AND BRIDGE CIRCUIT
    7.
    发明申请

    公开(公告)号:US20180062638A1

    公开(公告)日:2018-03-01

    申请号:US15613424

    申请日:2017-06-05

    Abstract: A power chip and a bridge circuit are disclosed in the present disclosure. The power chip includes a metal region and a wafer region, wherein the power chip further includes: a first power switch, formed in the wafer region; and a second power switch, formed in the wafer region, wherein the first and second power switches constitute an upper bridge arm and a lower bridge arm of a bridge circuit, respectively. At least one of the upper bridge arm and the lower bridge arm includes two or more power switches which are connected in parallel with each other, and the first and second power switches are arranged alternatively along at least one dimension direction.

    POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE

    公开(公告)号:US20250062296A1

    公开(公告)日:2025-02-20

    申请号:US18938311

    申请日:2024-11-06

    Abstract: A power supply system includes a system board, a load and a power module, the power module includes a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, wherein the first package and the load are configured to be provided on an upper surface of the system board, the second package is stacked on an upper side of the load, and the bridge member is stacked on upper sides of the first package and the second package.

    MAGNETIC ELEMENT AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:US20230253149A1

    公开(公告)日:2023-08-10

    申请号:US18301977

    申请日:2023-04-17

    CPC classification number: H01F41/041 H01F27/2804 H01F27/24

    Abstract: The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.

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