公开(公告)号：US20200312792A1

公开(公告)日：2020-10-01

申请号：US16816298

申请日：2020-03-12

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Shouyu HONG ,  Shili WU ,  Ganyu ZHOU ,  Yuan GAO ,  Jinshan SHI ,  Jianhong ZENG

IPC: H01L23/62 ,  H01L23/525 ,  H01L23/31 ,  H01L21/768 ,  H03K17/0812

Abstract: The present disclosure provides a semiconductor chip including a functional area, a first end, a second end, a third end, and a connecting portion. The functional area has first and second sides opposite to each other. The first end is disposed on the first side and the third end is disposed on the first side, wherein the semiconductor chip is switched on or off according to the drive signal received between the third end and the first end, and the connecting portion is disposed on the first side of the functional area and connected to the first end and the third end, wherein when the temperature rises above the a first temperature, the connecting portion is in a conductive state, and when the temperature drops to be not higher than a third temperature, the connecting portion is in an insulated state.

公开(公告)号：US20220328430A1

公开(公告)日：2022-10-13

申请号：US17809277

申请日：2022-06-28

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Shouyu HONG ,  Shili WU ,  Ganyu ZHOU ,  Yuan GAO ,  Jinshan SHI ,  Jianhong ZENG

IPC: H01L23/62 ,  H01L21/768 ,  H01L23/31 ,  H01L23/525 ,  H03K17/0812

Abstract: The present disclosure provides a semiconductor chip including a functional area, a first end, a second end, a third end, and a connecting portion. The functional area has first and second sides opposite to each other. The first end is disposed on the first side and the third end is disposed on the first side, wherein the semiconductor chip is switched on or off according to the drive signal received between the third end and the first end, and the connecting portion is disposed on the first side of the functional area and connected to the first end and the third end, wherein when the temperature rises above the a first temperature, the connecting portion is in a conductive state, and when the temperature drops to be not higher than a third temperature, the connecting portion is in an insulated state.