EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME

    公开(公告)号:US20200251438A1

    公开(公告)日:2020-08-06

    申请号:US16730024

    申请日:2019-12-30

    Abstract: the present disclosure relates to an embedded packaging module comprising a first semiconductor device, a first packaging layer and a first wiring layer, the first semiconductor device having a first and a second face, at least two positioning bulges and at least one bonding pad being provided on the first face of the first semiconductor device; the first packaging layer being formed on both the first face and a surface adjacent to the first face, the positioning bulges being positioned in the first packaging layer, at least one first via hole being provided in the first packaging layer, the bottom of the first via hole being positioned in the bonding pad and contacting with the bonding pad; the first wiring layer being positioned on the side of the first packaging layer away from the first semiconductor device and being electrically connected with the bonding pad through the first via hole.

    MAGNETIC ELEMENT AND POWER MODULE
    3.
    发明公开

    公开(公告)号:US20230230747A1

    公开(公告)日:2023-07-20

    申请号:US18156427

    申请日:2023-01-19

    CPC classification number: H01F27/24 H01F27/306 H01F27/292

    Abstract: The present disclosure provides a magnetic element, including: a magnetic column extending along a first direction; a first winding surrounding the magnetic column, connected to a first terminal located on a first side of the magnetic element, and the first terminal has a first projection of the first terminal on a first side surface of the magnetic element; and a second winding surrounding the magnetic column and at least partially outside the first winding, wherein the second winding has a first projection of the second winding on the first side surface of the magnetic element, the first projection of the first terminal is at least partially outside the first projection of the second winding, the second winding is a flatwise-wound winding, and the number of turns of the first winding is greater than or equal to the number of turns of the second winding.

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