公开(公告)号：US20200029455A1

公开(公告)日：2020-01-23

申请号：US16502175

申请日：2019-07-03

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Shouyu HONG ,  Haibin XU ,  Wei CHENG ,  Juan CHENG ,  Tao WANG ,  Zhenqing ZHAO

IPC: H05K7/14 ,  H05K1/14 ,  H05K5/00 ,  H05K5/02

Abstract: A power module structure includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer, wherein the fourth metal layer is connected to the second metal layer via a connecting bridge; at least one first switch including a first end connected to the third metal layer and a second end connected to the second metal layer; and at least one second switch including a third end connected to the fourth metal layer and a fourth end connected to the first metal layer; wherein the projection of the first metal layer and the projection of the third metal layer are overlapped to form a first overlapping area; wherein the direction of the current flowing through the first metal layer is opposite to the direction of the current flowing through the third metal layer.

公开(公告)号：US20160365306A1

公开(公告)日：2016-12-15

申请号：US15068658

申请日：2016-03-14

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Kai LU ,  Zhen-Qing ZHAO ,  Tao WANG

IPC: H01L23/498 ,  H01L21/48 ,  H01L25/10 ,  H01L23/00 ,  H01L23/053 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A method of fabricating a package module includes placing a pin frame having plural pins on a circuit substrate; bonding the pins to corresponding bonding areas on a circuit substrate, thereby connecting the pins to the bonding areas; cutting off a connecting portion of the pin frame; and bending the pins to be vertical to the circuit substrate. By placing the pins on the corresponding bonding areas on the circuit substrate through the pin frame, and then cutting off the connecting portion of the pin frame and bending the pins, the efficiency of assembling the package module can be greatly promoted.

Abstract translation: 制造封装模块的方法包括将具有多个引脚的引脚框架放置在电路基板上; 将引脚连接到电路基板上的对应的接合区域，从而将引脚连接到接合区域; 切断销框架的连接部分; 并且使引脚弯曲成垂直于电路基板。 通过将销钉通过销框架放置在电路基板上的对应接合区域上，然后切断销框架的连接部分并弯曲销钉，可以大大提高组装封装模块的效率。

公开(公告)号：US20190287943A1

公开(公告)日：2019-09-19

申请号：US16428231

申请日：2019-05-31

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Tao WANG ,  Zhenqing ZHAO ,  Kai LU ,  Zeng LI ,  Jianhong ZENG

IPC: H01L25/065 ,  H01L23/00

Abstract: The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; and a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit, wherein the bonding part is made from an insulated material with cohesiveness, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel, and wherein side surfaces of the two power chips are naked except the portions contacting the bonding part.

公开(公告)号：US20180076728A1

公开(公告)日：2018-03-15

申请号：US15704118

申请日：2017-09-14

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Shouyu HONG ,  Juan CHENG ,  Tao WANG ,  Zhenqing ZHAO

IPC: H02M7/00 ,  H02M7/48 ,  G06F1/30 ,  H02J9/06 ,  H02M1/10

CPC classification number: H02M7/003 ,  G06F1/30 ,  H01L25/072 ,  H01L25/115 ,  H01L25/16 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/40227 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H02J9/061 ,  H02M1/10 ,  H02M7/48 ,  H05K1/025 ,  H05K1/0265 ,  H05K2201/10015 ,  H05K2201/10166 ,  H01L2924/00

Abstract: The disclosure relates to a power conversion module, including: a substrate including a routing layer and an insulating layer, the routing layer including a first routing area and a second routing area; an electronic device provided on the first routing area and electrically connected to the first routing area and the second routing area, respectively; a vertical type power device provided on the second routing area and electrically connected to the second routing area; and a capacitor provided on the substrate, disposed between the electronic device and the vertical type power device, and electrically connected to the electronic device and the vertical type power device, respectively. The power conversion module is provided with all devices on the same substrate, thus cost is reduced, yield rate and reliability are improved, and parasitic inductance inside the power conversion module can be reduced.

公开(公告)号：US20160374223A1

公开(公告)日：2016-12-22

申请号：US15067146

申请日：2016-03-10

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K3/30 ,  H05K3/284 ,  H05K5/064 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10636 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

Abstract translation: 封装模块包括电路板，布置在电路板上的电子部件，邻近电子部件的至少一侧设置的框架和密封剂。 在框架和电子部件之间形成间隙。 密封剂包括覆盖电路板的至少一部分的第一部分和填充到间隙的至少一部分中的第二部分。 第一部分具有相对于电路板的第一高度，并且第二部分具有相对于电路板的第二高度，其中第二高度大于第一高度。

公开(公告)号：US20200294893A1

公开(公告)日：2020-09-17

申请号：US16891546

申请日：2020-06-03

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Shouyu HONG ,  Juan CHENG ,  Tao WANG ,  Zhenqing ZHAO

IPC: H01L23/492 ,  H01L25/07 ,  H02B1/20 ,  H02M7/00 ,  H01L25/16 ,  H01L25/18

Abstract: The present disclosure relates to a component structure, a power module and a power module assembly structure having the component structure. The component structure comprises: a first bus bar, having one end extending to a first plane to form a first connecting terminal; a second bus bar, comprising a front portion of the second bus bar and a rear portion of the second bus bar, wherein the front portion of the second bus bar is laminated in parallel with the first bus bar, and the rear portion of the second bus bar is extended to a second plane to form a second connecting terminal; and an external circuit comprising a third bus bar, wherein the third bus bar is settled in parallel with the rear portion of the second bus bar, to reduce a parasitic inductance between the first connecting terminal and the second connecting terminal.

公开(公告)号：US20190037706A1

公开(公告)日：2019-01-31

申请号：US16145142

申请日：2018-09-27

Applicant: Delta Electronics (Shanghai) Co.,Ltd.

Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H05K3/30 ,  H05K3/28 ,  H05K5/06 ,  H05K7/14

Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

公开(公告)号：US20220336311A1

公开(公告)日：2022-10-20

申请号：US17660423

申请日：2022-04-25

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Wei CHENG ,  Shouyu HONG ,  Dongfang LIAN ,  Tao WANG ,  Zhenqing ZHAO

IPC: H01L23/34 ,  H01L23/538 ,  H01L23/50 ,  H01L23/64

Abstract: A power module, including: a first conductor, disposed at a first reference plane; a second conductor, disposed at a second reference plane, wherein projections of the first and second conductors on the first reference plane have a first overlap area; a third conductor, disposed at a third reference plane; a plurality of first switches and a plurality of second switches, wherein at least one of the first switches and at least one of the second switches that are located on a left side are alternatively disposed, at least one of the first switches and at least one of the second switches that are located on a right side are alternately disposed, and the left side and the right side of the first overlap area are oppositely disposed. Heat sources of the power module are evenly distributed and its parasitic inductance is low.

公开(公告)号：US20200027807A1

公开(公告)日：2020-01-23

申请号：US16533868

申请日：2019-08-07

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Wei CHENG ,  Shouyu HONG ,  Dongfang LIAN ,  Tao WANG ,  Zhenqing ZHAO

IPC: H01L23/34 ,  H01L23/64 ,  H01L23/50 ,  H01L23/538

Abstract: A power module, including: a first conductor, disposed at a first reference plane; a second conductor, disposed at a second reference plane, wherein projections of the first and second conductors on the first reference plane have a first overlap area; a third conductor, disposed at a third reference plane; a plurality of first switches, first ends of which are coupled to the first conductor; and a plurality of second switches, first ends of which are coupled to second ends of the first switches through the third conductor, and second ends of the second switches are coupled to the second conductor, wherein projections of minimum envelope areas of the first and second switches on the first reference plane have a second overlap area, and the first and second overlap areas have an overlap region. Heat sources of the power module are evenly distributed and its parasitic inductance is low.

公开(公告)号：US20170062386A1

公开(公告)日：2017-03-02

申请号：US15230670

申请日：2016-08-08

Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD

Inventor： Tao WANG ,  Zhenqing ZHAO ,  Kai LU ,  Zeng LI ,  Jianhong ZENG

IPC: H01L25/065 ,  H01L21/78 ,  H01L23/31 ,  H01L21/54 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L21/78 ,  H01L21/54 ,  H01L23/3142 ,  H01L23/3178 ,  H01L24/03 ,  H01L24/08 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/03009 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0805 ,  H01L2224/085 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2224/05599 ,  H01L2924/00

Abstract: The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit; and a sealing layer isolating the power chip unit on the substrate from surroundings to seal the power chip unit; the bonding part and the sealing layer are made from different insulated material, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel.

Abstract translation: 本公开的实施例涉及多个功率芯片的功率封装模块和制造功率芯片单元的方法。 多个功率芯片的功率封装模块包括：功率芯片单元，包括并联放置的至少两个功率芯片和接合两个功率芯片的焊接部分; 支撑所述功率芯片单元并且包括与所述功率芯片单元电连接的金属层的基板; 以及将基板上的功率芯片单元与周围隔离以密封功率芯片单元的密封层; 接合部和密封层由不同的绝缘材料制成，平行放置的两个功率芯片之间的间隔距离小于或等于预设宽度，并且将接合部分填充在间隙中，绝缘地接合 两个电源芯片并置放置。