公开(公告)号：US20170330846A1

公开(公告)日：2017-11-16

申请号：US15667640

申请日：2017-08-03

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG

IPC: H01L23/66 ,  H01L23/528 ,  G11B5/48 ,  H01L23/522 ,  H01L29/92 ,  H01L23/64

CPC classification number: H01L23/66 ,  G11B5/4873 ,  H01L21/568 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/5222 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L27/088 ,  H01L29/92 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The second semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The capacitor unit includes a plurality of capacitors. The semiconductor switch unit includes a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain of one sub micro-switch element in the second semiconductor switch element and is disposed adjacent to at least one drain electrode from the first semiconductor switch element or one source electrode from the second semiconductor switch element.

公开(公告)号：US20170062386A1

公开(公告)日：2017-03-02

申请号：US15230670

申请日：2016-08-08

Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD

Inventor： Tao WANG ,  Zhenqing ZHAO ,  Kai LU ,  Zeng LI ,  Jianhong ZENG

IPC: H01L25/065 ,  H01L21/78 ,  H01L23/31 ,  H01L21/54 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L21/78 ,  H01L21/54 ,  H01L23/3142 ,  H01L23/3178 ,  H01L24/03 ,  H01L24/08 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/03009 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0805 ,  H01L2224/085 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2224/05599 ,  H01L2924/00

Abstract: The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit; and a sealing layer isolating the power chip unit on the substrate from surroundings to seal the power chip unit; the bonding part and the sealing layer are made from different insulated material, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel.

Abstract translation: 本公开的实施例涉及多个功率芯片的功率封装模块和制造功率芯片单元的方法。 多个功率芯片的功率封装模块包括：功率芯片单元，包括并联放置的至少两个功率芯片和接合两个功率芯片的焊接部分; 支撑所述功率芯片单元并且包括与所述功率芯片单元电连接的金属层的基板; 以及将基板上的功率芯片单元与周围隔离以密封功率芯片单元的密封层; 接合部和密封层由不同的绝缘材料制成，平行放置的两个功率芯片之间的间隔距离小于或等于预设宽度，并且将接合部分填充在间隙中，绝缘地接合 两个电源芯片并置放置。

公开(公告)号：US20150180351A1

公开(公告)日：2015-06-25

申请号：US14581096

申请日：2014-12-23

Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG ,  Yi-Cong XIE

IPC: H02M3/335 ,  H02M1/44 ,  H02M1/42

CPC classification number: H02M1/44 ,  H02M3/00

Abstract: Disclosed herein is a power electronic circuit having a reference ground and a differential mode loop unit. The differential mode loop unit has a capacitance component, a switch and an electronic component, wherein the capacitance component has a first end, the switch has a first end connecting in series with the capacitance component, the electronic component has a first end, the electronic component connects in series with the capacitance component and the switch, the capacitance component and switch are packaged in a power module, the power module has a trace and at least one output pin connected to reference ground, wherein the first end of the switch or the first end of the electronic component is only connected to the first end of the capacitance component through the trace, and the first end of the capacitance component is connected to reference ground through the output pin.

Abstract translation: 这里公开了具有参考地和差模回路单元的电力电子电路。 差分模式环路单元具有电容部件，开关和电子部件，其中电容部件具有第一端，开关具有与电容部件串联连接的第一端，电子部件具有第一端，电子部件 组件与电容部件和开关串联连接，电容部件和开关被封装在电源模块中，电源模块具有一个跟踪和至少一个连接到参考接地的输出引脚，其中开关的第一端或 电子部件的第一端仅通过迹线连接到电容部件的第一端，并且电容部件的第一端通过输出引脚连接到参考接地。

公开(公告)号：US20190287943A1

公开(公告)日：2019-09-19

申请号：US16428231

申请日：2019-05-31

Applicant: Delta Electronics (Shanghai) CO., LTD

Inventor： Tao WANG ,  Zhenqing ZHAO ,  Kai LU ,  Zeng LI ,  Jianhong ZENG

IPC: H01L25/065 ,  H01L23/00

Abstract: The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; and a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit, wherein the bonding part is made from an insulated material with cohesiveness, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel, and wherein side surfaces of the two power chips are naked except the portions contacting the bonding part.

公开(公告)号：US20150318242A1

公开(公告)日：2015-11-05

申请号：US14798484

申请日：2015-07-14

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG

IPC: H01L23/522 ,  H01L27/088

CPC classification number: H01L23/66 ,  G11B5/4873 ,  H01L21/568 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/5222 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L27/088 ,  H01L29/92 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The second semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The capacitor unit includes a plurality of capacitors. The semiconductor switch unit includes a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain of one sub micro-switch element in the second semiconductor switch element and is disposed adjacent to at least one drain electrode from the first semiconductor switch element or one source electrode from the second semiconductor switch element.

Abstract translation: 开关电路封装模块包括半导体开关单元和电容器单元。 半导体开关单元包括第一半导体开关元件和第二半导体开关元件。 第一半导体开关元件包括副微开关元件，每个子微开关元件配置有漏电极和源电极。 第二半导体开关元件包括副微开关元件，每个子微开关元件配置有漏电极和源电极。 电容器单元包括多个电容器。 半导体开关单元包括多个公共电极，每个公共电极将第一半导体开关元件中的一个子微开关元件的源电极与第二半导体开关元件中的一个子微开关元件的漏极连接， 邻近于来自第一半导体开关元件的至少一个漏电极或来自第二半导体开关元件的一个源电极。

公开(公告)号：US20150318234A1

公开(公告)日：2015-11-05

申请号：US14798419

申请日：2015-07-13

Applicant: Delta Electronics (Shanghai) Co., Ltd.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG

IPC: H01L23/495 ,  H01L23/64

CPC classification number: H01L25/50 ,  H01L23/49562 ,  H01L23/49589 ,  H01L23/642 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M1/44 ,  H02M3/155 ,  H05K1/0228 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A switch circuit package module includes at least a semiconductor switch unit and at least a first capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element and the second semiconductor switch element include a plurality of sub micro-switch elements. The capacitor unit includes a plurality of capacitors configured to cooperate with the sub micro-switch elements. The capacitors are arranged in a symmetrical distribution surrounded the semiconductor switch unit, such that impedances of any two symmetrical commutation loops each of which mainly consists of one capacitor and two sub micro-switch elements from the first semiconductor switch element and second semiconductor switch element respectively are close to or the same with each other.

Abstract translation: 开关电路封装模块至少包括半导体开关单元和至少第一电容器单元。 半导体开关单元包括第一半导体开关元件和第二半导体开关元件。 第一半导体开关元件和第二半导体开关元件包括多个子微开关元件。 电容器单元包括配置成与子微开关元件配合的多个电容器。 电容器被布置成围绕半导体开关单元的对称分布，使得任何两个对称换向回路的阻抗分别主要由来自第一半导体开关元件和第二半导体开关元件的一个电容器和两个子微开关元件组成 彼此接近或相同。

公开(公告)号：US20140117495A1

公开(公告)日：2014-05-01

申请号：US13760079

申请日：2013-02-06

Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD.

Inventor： Zeng LI ,  Shou-Yu HONG ,  Jian-Hong ZENG

IPC: H01L23/66 ,  H01L25/00

CPC classification number: H01L25/50 ,  H01L23/49562 ,  H01L23/49589 ,  H01L23/642 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M1/44 ,  H02M3/155 ,  H05K1/0228 ,  H05K1/162 ,  H05K1/165 ,  H05K1/185 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation loops between the capacitor unit and the sub micro-switch elements are close to or the same with each other.

Abstract translation: 开关电路封装模块包括半导体开关单元和电容器单元。 半导体开关单元包括副微开关元件。 电容器单元布置在半导体开关单元的周围或层叠在半导体开关单元的表面上，使得电容器单元和子微开关元件之间的换向环的阻抗彼此接近或相同 。