-
公开(公告)号：US09958213B2
公开(公告)日：2018-05-01
申请号：US15204648
申请日：2016-07-07
申请人： ABB Schweiz AG
IPC分类号： F28D15/02 , F28D7/00 , F28D15/04 , F28F3/02 , H05K7/20 , H01L23/427 , F28D21/00 , H01L23/367
CPC分类号： F28D15/0266 , F28D7/0075 , F28D15/0233 , F28D15/04 , F28D2015/0216 , F28D2021/0028 , F28D2021/0029 , F28F3/025 , H01L23/3677 , H01L23/427 , H05K7/20936
摘要： The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.
-
公开(公告)号：US09888612B2
公开(公告)日：2018-02-06
申请号：US15401630
申请日：2017-01-09
申请人： ABB Schweiz AG
CPC分类号： H05K7/20309 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F1/022 , F28F13/00 , F28F2270/00 , F28F2275/02 , H05K7/20318 , H05K7/20327 , H05K7/20336 , H05K7/20936
摘要： It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.
-
公开(公告)号：US20170010049A1
公开(公告)日：2017-01-12
申请号：US15204648
申请日：2016-07-07
申请人： ABB Schweiz AG
CPC分类号： F28D15/0266 , F28D7/0075 , F28D15/0233 , F28D15/04 , F28D2015/0216 , F28D2021/0028 , F28D2021/0029 , F28F3/025 , H01L23/3677 , H01L23/427 , H05K7/20936
摘要： The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.
摘要翻译： 本发明涉及一种热交换器，其包括用于从一个或多个电气部件接受热负荷的基板，与基板的表面热接触的蒸发器，用于将所述热负载传送到蒸发器通道中的第一流体， 以及从第一流体散热的冷凝器。 为了提供有效的热交换器，热交换器包括从冷凝器接收第一流体的收集空间，并且位于高于蒸发器通道的下端的收集器空间与蒸发器通道的下端流体连通， 将从冷凝器接收的第一流体通过蒸发器通道的下端。
-
公开(公告)号：US20180368292A1
公开(公告)日：2018-12-20
申请号：US16113341
申请日：2018-08-27
申请人： ABB Schweiz AG
IPC分类号： H05K7/20 , F28F27/02 , H01L23/427
CPC分类号： H05K7/20936 , F28F27/02 , H01L23/427 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20354 , H05K7/20381
摘要： A heat exchanger assembly (1) is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit (100), the passive cooling circuit comprising an evaporator (110) connectable to a device (50) to be cooled for conducting heat from the device (50) to be cooled to the cooling fluid within the evaporator (110), thereby evaporating the cooling fluid, and a condenser (120) interconnected with the evaporator (110) for receiving the evaporated cooling fluid from the evaporator (110), releasing heat from the cooling fluid to an environment of the condenser (120), thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit (200) comprising a compressor (250) and an auxiliary condenser (220), the active partial circuit (200) being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit (200), the cooling fluid from the evaporator (110), for compressing the received cooling fluid by the compressor (250), for releasing heat, by the auxiliary condenser (220), from the compressed cooling fluid to an environment of the auxiliary condenser (220), and for returning the condensed cooling fluid to the evaporator (110). Furthermore, the passive cooling circuit (100) is a base-to-air type thermosiphon or an air-to-air type thermosiphon.
-
公开(公告)号：US10077947B2
公开(公告)日：2018-09-18
申请号：US15272137
申请日：2016-09-21
申请人： ABB Schweiz AG
IPC分类号： F28D15/00 , F28D15/04 , F28D15/02 , F28F3/02 , F28F13/10 , H01L23/427 , H01L23/467 , F28D21/00
CPC分类号： F28D15/046 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28D15/0283 , F28D15/04 , F28D2021/0029 , F28F3/02 , F28F3/025 , F28F13/10 , F28F2215/06 , H01L23/427 , H01L23/467
摘要： A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.
-
公开(公告)号：US10748682B2
公开(公告)日：2020-08-18
申请号：US15610420
申请日：2017-05-31
申请人： ABB Schweiz AG
发明人： Colin Tschida , Pietro Cairoli , Francesco Agostini , Daniele Torresin , Davide Leoni , Luca Raciti , Zhiguo Pan
摘要： A surge arrester system includes a surge arrester, and an active cooling system having a cooling interface in contact with the surge arrester and operative to transfer heat from the surge arrester. The active cooling system includes a forced convection apparatus operative to provide forced convection cooling. A circuit breaker system includes a power semiconductor switch and an active cooling system constructed to cool the power semiconductor switch. The active cooling system includes a forced convection apparatus configured to provide forced convection cooling. The power semiconductor switch is in contact with the active cooling system. A surge arrester is disposed adjacent to and in contact with the active cooling system. The active cooling system includes a cooling interface constructed for contact with the surge arrester and operative to provide cooling to the surge arrester. The power semiconductor switch and the surge arrester dissipate power alternatively.
-
公开(公告)号：US20170082379A1
公开(公告)日：2017-03-23
申请号：US15272137
申请日：2016-09-21
申请人： ABB Schweiz AG
CPC分类号： F28D15/046 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28D15/0283 , F28D15/04 , F28D2021/0029 , F28F3/02 , F28F3/025 , F28F13/10 , F28F2215/06 , H01L23/427 , H01L23/467
摘要： A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.
-
公开(公告)号：US10212862B2
公开(公告)日：2019-02-19
申请号：US15195213
申请日：2016-06-28
申请人： ABB Schweiz AG
IPC分类号： H05K7/20 , F28D15/02 , F28D15/04 , F28F21/08 , H01L23/373 , H01L23/427 , B23P15/26 , F28D21/00
摘要： This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.
-
公开(公告)号：US20170301607A1
公开(公告)日：2017-10-19
申请号：US15485676
申请日：2017-04-12
申请人： ABB Schweiz AG
IPC分类号： H01L23/427 , H01L29/78 , H01L29/739 , H05K7/20 , H01L29/16
CPC分类号： H01L23/427 , F25B25/005 , H01L23/473 , H01L29/1608 , H01L29/2003 , H01L29/22 , H01L29/7393 , H01L29/78 , H05K7/20936
摘要： A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.
-
公开(公告)号：US20170202108A1
公开(公告)日：2017-07-13
申请号：US15401630
申请日：2017-01-09
申请人： ABB Schweiz AG
CPC分类号： H05K7/20309 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F1/022 , F28F13/00 , F28F2270/00 , F28F2275/02 , H05K7/20318 , H05K7/20327 , H05K7/20336 , H05K7/20936
摘要： It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.014 秒)
