摘要:
This document describes techniques for implementing phase-change cooling in a three-dimensional structure. A three-dimensional structure having three-dimensional curvatures is fabricated to include a phase-change chamber with a fluid in a saturated thermodynamic state. As part of fabrication, specific mechanisms may be included that create a thermo-mechanical network that improves thermal performance of the phase-change chamber and also provides structural integrity to the three-dimensional structure.
摘要:
A heat transfer segment for a curved heat exchanger, wherein the heat transfer segment comprises a plurality of enclosure bars that at least partially define two opposite ends of the heat transfer segment, wherein the two opposite ends define respective general planes, characterised in that: the enclosure bars are shaped and arranged such that the general plane of one end of the heat transfer segment is not parallel with the general plane of the other end of the heat transfer segment, such that when said heat transfer segment is joined to an adjacent heat transfer segment in an end-to-end fashion the enclosure bars the heat transfer segment may join to corresponding enclosure bars of the adjacent heat transfer segment.
摘要:
It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.
摘要:
A method and system for fabricating a part includes sectionalizing a computer-generated representation of a part into strata having an order, forming layers corresponding to the strata from sheet material, stacking at least two of the layers in the order, and joining the layers together. The method and system are suitable for producing a phase-change material container for a thermal energy harvesting device, for example.
摘要:
The present invention relates to a thermal conductive cylinder installed with U-type core piping and loop piping for being installed within natural thermal storage body or artificial thermal storage body; wherein the piping segments of fluid inlet terminal and/or outlet terminal of the U-type core piping and loop piping are directly made of thermal insulating material, or thermal insulating structure is installed between the inlet terminal and the outlet terminal; so as to prevent thermal energy loss between adjacent piping segments on the same side when thermal conductive fluid with temperature difference passing through.
摘要:
A pipe embedded structure includes: a pipe made of a metal or an alloy, and having a periphery forming a circular shape; a base material made of a metal or an alloy, including a recessed portion having an inner wall on which a part of the periphery abuts and in which the pipe is fitted; and a deposited layer formed by accelerating powder formed of a metal or an alloy together with a gas in a state where the pipe is fitted into the recessed portion, and spraying and depositing the powder on surfaces of the pipe and the base material while maintaining a solid phase state of the powder, wherein a ratio h/R of a protruding amount h by which the pipe protrudes from the surface of the base material and a curvature R of the periphery is not smaller than 0.3 and not greater than 0.7.
摘要:
A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.
摘要:
A method of manufacturing a heat transfer plate includes: an insertion process of inserting a heat medium pipe in a concave groove formed in a bottom face of a lid groove open to an obverse of a base member; a lid groove closing process of arranging a lid plate in the lid groove; and a main joining process of moving a main joining rotation tool along butt portions (V1, V2) between sidewalls of the lid groove and side faces of the lid plate, wherein in the main joining process a plastic fluidizing material (Q), where the base member and the lid plate are fluidized due to frictional heat, is made to flow in air gap portions (P1, P2) formed around the heat medium pipe.
摘要:
The invention relates to a method for extracting heat from an effluent (2) circulating in a conduit (1), especially a waste water collector, according to which a heat exchanger (E) is installed, at least in the bottom of the conduit, said heat exchanger (E) lying in the effluent and being formed by coating tubes (3) with sufficiently heat-conductive concrete cast around the tubes intended for the circulation of a heat-transfer fluid, the heat exchange with the effluent of the conduit being carried out through the moulded coating. The concrete (4) of the coating consists of a least 50 weigh % of silicon carbide, a load of needles made of a heat-conductive and mechanically resistant material, a binding agent and the remainder of alumina, metal powder or carbon.
摘要:
A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.