LASER WIRE PROCESSING DEVICE
    2.
    发明申请

    公开(公告)号:US20190151995A1

    公开(公告)日:2019-05-23

    申请号:US16239146

    申请日:2019-01-03

    摘要: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

    Vibrating pallet system for automated wire insertion

    公开(公告)号:US10109974B2

    公开(公告)日:2018-10-23

    申请号:US15010525

    申请日:2016-01-29

    摘要: A wire insertion system includes a fixture, a first vibrating element connected to the fixture, and a gripper adapted to interface with the fixture and to support a plurality of wires, in which the gripper includes a body, at least one gripping member coupled to the body, and a second vibrating element connected to the gripper. The wire insertion system further includes a sensor coupled to the fixture, and a controller coupled to the sensor and in communication with the first vibrating element, the second vibrating element, and the gripper, and configured to vibrate the first vibrating element and the second vibrating element using signals from the sensor.

    SYSTEMS AND METHODS FOR AUTOMATICALLY INSPECTING WIRE SEGMENTS
    5.
    发明申请
    SYSTEMS AND METHODS FOR AUTOMATICALLY INSPECTING WIRE SEGMENTS 有权
    用于自动检查电线部分的系统和方法

    公开(公告)号:US20160377555A1

    公开(公告)日:2016-12-29

    申请号:US14750447

    申请日:2015-06-25

    摘要: A wire inspection system is provided. The wire inspection system includes a mirror assembly including an odd number of sides arranged to form a pyramid structure configured to surround a wire segment, wherein a plurality of the sides include a mirror, a light source configured to illuminate the wire segment, and at least one camera configured to acquire a plurality of images of the wire segment that are reflected by the plurality of mirrors, wherein each image of the plurality of images shows a different side of the wire segment.

    摘要翻译: 提供线检测系统。 线检查系统包括反射镜组件,其包括奇数个侧面,其被布置成形成构造成围绕线段的金字塔结构,其中多个侧面包括反射镜,被配置为照亮线段的光源,并且至少 一个摄像机被配置为获取由多个反射镜反射的线段的多个图像,其中多个图像中的每个图像示出了线段的不同侧。

    Automated methods and apparatus for installing a sleeve on a cable

    公开(公告)号:US11640862B2

    公开(公告)日:2023-05-02

    申请号:US17458063

    申请日:2021-08-26

    摘要: A method utilizes a funnel system and robotic end effector grippers to feed an unjacketed portion of a shielded cable through a sleeve. The funnel is designed with one or more thin extensions (hereinafter “prongs”) on which a sleeve is placed prior to a cable entering the funnel. Preferably two or more prongs are employed, although a single prong may be used if properly configured to both guide a cable and fit between the sleeve and cable. The prongs close off the uneven surface internal to a sleeve and provide a smooth surface for the cable to slide along and through the sleeve, preventing any damage to the exposed shielding. The sleeve is picked up and held on the prongs using a robotic end effector. If the sleeve is a solder sleeve, the robotic end effector has grippers designed to make contact with the portions of the solder sleeve that are between the insulating rings and the central solder ring.

    Laser wire processing device
    8.
    发明授权

    公开(公告)号:US11446768B2

    公开(公告)日:2022-09-20

    申请号:US16239146

    申请日:2019-01-03

    摘要: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

    Wire bundle processing method
    9.
    发明授权

    公开(公告)号:US11319183B2

    公开(公告)日:2022-05-03

    申请号:US16655019

    申请日:2019-10-16

    摘要: A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

    Cable processing apparatus and method therefore

    公开(公告)号:US10587101B2

    公开(公告)日:2020-03-10

    申请号:US15472452

    申请日:2017-03-29

    IPC分类号: H01R43/00 H02G1/12

    摘要: A cable processing apparatus including a frame; a cable guide coupled to the frame; a first cable clamp adjacent the cable guide; a second cable clamp adjacent the cable guide where the first cable clamp is disposed between the cable guide and the second cable clamp; and a controller configured to move the second cable clamp to a clamped position such that a cable extending through the cable guide is clamped by the second cable clamp, move the second cable clamp, relative to the cable guide, in a direction extending along the cable such that a first portion of the insulation is removed from the cable at the first score to expose shielding of the cable, and move the second cable clamp, relative to the first cable clamp, in the direction extending along the cable to cut the shielding to expose one or more conductor of the cable.