公开(公告)号：US11913733B2

公开(公告)日：2024-02-27

申请号：US17344729

申请日：2021-06-10

申请人： Asia Pacific Fuel Cell Technologies, Ltd.

发明人： Wei-Pin Lo ,  Wen-Yen Huang ,  Chin-Hsien Cheng

IPC分类号： F28F9/00 ,  F28D9/00 ,  F28D1/06 ,  H01M8/04007 ,  H01M8/04082 ,  F28F3/08 ,  F28F21/06 ,  F28F21/02 ,  F28F21/04 ,  F28F23/00 ,  F28D21/00

CPC分类号： F28F9/002 ,  F28D1/06 ,  F28F3/086 ,  F28F21/065 ,  H01M8/04074 ,  H01M8/04208 ,  F28D9/0025 ,  F28D2021/0047 ,  F28F21/02 ,  F28F21/04 ,  F28F23/00 ,  H01M8/04007

摘要： The present disclosure provides a heat transferring device and a heat transferring component thereof. The heat transferring device includes a heat transferring component, a lower plate and a positioning component. The heat transferring component is in a shape of pouch and includes at least one input end and at least one output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on an exterior of the heat transferring component. An end of the positioning component is connected to the lower plate.

公开(公告)号：US11885577B2

公开(公告)日：2024-01-30

申请号：US17197910

申请日：2021-03-10

申请人： Other Lab, LLC

发明人： Peter Lynn ,  Saul Griffith ,  Sam Sarcia ,  Brent Ridley ,  Shara Maikranz ,  James McBride ,  Vincent Domenic Romanin ,  Keith Pasko

IPC分类号： F28F21/06 ,  F28D1/02 ,  F28D1/047 ,  C02F1/04 ,  C02F1/06 ,  B01D1/26 ,  B01D1/28 ,  F28B1/06 ,  B01D1/02 ,  F04B35/01 ,  F28F3/14 ,  F28F3/06 ,  F04B25/00 ,  F04B39/00 ,  F04B39/12 ,  F04B45/02 ,  F04B53/14 ,  F04D25/08 ,  F15B15/10 ,  F28D21/00 ,  C02F103/08 ,  F28D7/00

CPC分类号： F28F21/062 ,  B01D1/02 ,  B01D1/26 ,  B01D1/28 ,  B01D1/289 ,  C02F1/041 ,  C02F1/06 ,  F04B25/005 ,  F04B35/01 ,  F04B39/0094 ,  F04B39/12 ,  F04B45/02 ,  F04B53/144 ,  F04D25/088 ,  F15B15/10 ,  F28B1/06 ,  F28D1/024 ,  F28D1/0472 ,  F28D1/0477 ,  F28F3/06 ,  F28F3/14 ,  F28F21/065 ,  C02F2103/08 ,  F28D7/005 ,  F28D2021/0063

摘要： An air thermal conditioning system, for at least one of heating air and cooling air, which includes a cross-flow heat exchanger array. The cross-flow heat exchanger array includes a plurality of planar membrane heat exchangers disposed in parallel with a space separating adjacent planar membrane heat exchangers. Each of the planar membrane heat exchangers include a first sheet; a second sheet coupled to the first sheet; and at least one fluid chamber defined by the first and second sheets, with the at least one fluid chamber extending between first and second ends of the planar membrane heat exchangers and opening to a first and second port at the first and second ends respectively.

公开(公告)号：US20230269916A1

公开(公告)日：2023-08-24

申请号：US18151647

申请日：2023-01-09

申请人： Aptiv Technologies Limited

发明人： Jakub Antoni Korta ,  Tomasz Dolot

IPC分类号： H05K7/20 ,  F28F9/02 ,  F28D1/03

CPC分类号： H05K7/20872 ,  F28F9/0256 ,  F28D1/03 ,  F28F2275/025 ,  F28F2275/08 ,  F28F21/065

摘要： This document describes inlet and outlet channels for a heat exchanger that provides a compact profile with consistent cooling performances among heat exchanger plates. For example, a manifold of a cooling system includes an inlet channel and an outlet channel designed to connect to multiple plates of a heat exchanger. The inlet and outlet channels include a junction portion, a connection portion, and a transfer portion. The junction portion includes opposing inclined contact surfaces that are inclined relative to a horizontal plane of the plates and mate with corresponding inclined contact surfaces of the plates. The connection portion accepts coolant hoses. The transfer portion is located between the junction portion and connection portions. The described channels of the manifold are especially useful for automotive applications that generally have tight assembly spaces.

公开(公告)号：US11686530B2

公开(公告)日：2023-06-27

申请号：US16151988

申请日：2018-10-04

申请人： Hamilton Sundstrand Corporation

发明人： James Streeter ,  Feng Feng ,  Matthew W. Miller

IPC分类号： F28D1/047 ,  F28F21/06 ,  F28D1/04 ,  B33Y80/00 ,  B22F5/10 ,  B22F10/28 ,  F28F9/02 ,  F28D21/00 ,  F28F3/14 ,  B22F10/32

CPC分类号： F28D1/0476 ,  B22F5/10 ,  B22F10/28 ,  B33Y80/00 ,  F28D1/0426 ,  F28F21/065 ,  B22F10/32 ,  F28D2021/0021 ,  F28F3/14 ,  F28F9/0221 ,  F28F2255/02

摘要： A flexible manifold adapted for use on a plate-fin heat exchanger core, the flexible manifold including a plurality of individual layers configured to be metallurgically joined to respective ones of a plurality of layers of the plate-fin heat exchanger core, and further including a first end with at least one port adapted to receive or discharge a medium, a second end distal from the first end, adapted to transfer the medium to or from the plurality of individual layers, a plurality of horizontal guide vanes defining the plurality of individual layers, and a plurality vertical members positioned within each of the individual layers. The flexible manifold is configured to be mechanically and thermally compliant, and can be metallurgically joined to the heat exchanger core by brazing or welding.

公开(公告)号：US20230144307A1

公开(公告)日：2023-05-11

申请号：US17918217

申请日：2021-05-27

申请人： SEKISUI POLYMATECH CO., LTD.

发明人： Hiroki KUDOH ,  Miho ISHIHARA

IPC分类号： C09K5/14 ,  C08J5/12 ,  C08K13/04 ,  H05K7/20 ,  F28F21/06 ,  B32B27/28 ,  B32B27/20 ,  B32B7/12 ,  B32B37/15 ,  B32B38/00 ,  B32B27/08

CPC分类号： C09K5/14 ,  C08J5/12 ,  C08K13/04 ,  H05K7/20445 ,  F28F21/065 ,  B32B27/283 ,  B32B27/20 ,  B32B7/12 ,  B32B37/15 ,  B32B38/0004 ,  B32B27/08 ,  C08K2201/001 ,  C08K2201/014 ,  C08K7/06

摘要： The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.

公开(公告)号：US20190191589A1

公开(公告)日：2019-06-20

申请号：US15844462

申请日：2017-12-15

申请人： Google LLC

发明人： John Stuart Fitch

IPC分类号： H05K7/20 ,  F28D20/02 ,  H05K5/00 ,  H05K5/04 ,  H05K5/02 ,  H05K5/06

CPC分类号： H05K7/2029 ,  F28D15/0233 ,  F28D15/0241 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/04 ,  F28D20/021 ,  F28D20/025 ,  F28F3/042 ,  F28F21/04 ,  F28F21/065 ,  F28F21/08 ,  F28F23/00 ,  F28F2225/04 ,  F28F2240/00 ,  F28F2265/12 ,  F28F2265/14 ,  F28F2265/26 ,  F28F2275/02 ,  F28F2275/04 ,  F28F2275/06 ,  F28F2275/085 ,  F28F2275/122 ,  G02B27/017 ,  G06F1/163 ,  G06F1/203 ,  H05K5/0017 ,  H05K5/0213 ,  H05K5/04 ,  H05K5/06

摘要： This document describes techniques for implementing phase-change cooling in a three-dimensional structure. A three-dimensional structure having three-dimensional curvatures is fabricated to include a phase-change chamber with a fluid in a saturated thermodynamic state. As part of fabrication, specific mechanisms may be included that create a thermo-mechanical network that improves thermal performance of the phase-change chamber and also provides structural integrity to the three-dimensional structure.

公开(公告)号：US20180182685A1

公开(公告)日：2018-06-28

申请号：US15873131

申请日：2018-01-17

申请人： Laird Technologies, Inc.

发明人： Jason L. Strader ,  Eugene Anthony Pruss

IPC分类号： H01L23/373 ,  H01L23/552 ,  F28F21/02 ,  F28F21/06

CPC分类号： H01L23/3735 ,  F28F21/02 ,  F28F21/06 ,  F28F21/065 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552

摘要： A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side, and coating layers substantially covering the first side and the second side of the low melting alloy layer. In some embodiments, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture. Other example devices are also disclosed.

公开(公告)号：US20180151473A1

公开(公告)日：2018-05-31

申请号：US15391651

申请日：2016-12-27

申请人： ENZOTECHNOLOGY CORP.

发明人： Kuo-An Liang

IPC分类号： H01L23/473 ,  F28F9/00 ,  F28F21/06 ,  F28F9/26 ,  H05K7/20 ,  H01L23/40

CPC分类号： H01L23/473 ,  F28F9/001 ,  F28F9/002 ,  F28F9/266 ,  F28F21/065 ,  F28F2275/025 ,  H01L23/3672 ,  H01L23/4006 ,  H01L2023/4025 ,  H01L2023/4037 ,  H01L2023/4087 ,  H05K7/20254

摘要： The present invention relates to a lightweight liquid-cooling-plate assembly having a plastic frame and a heat dissipation system using the same. The liquid-cooling-plate assembly includes a plastic frame and at least one coolant chamber unit. The plastic frame includes a plurality of lateral walls, at least one accommodation opening, and a plurality of fastening elements. The lateral walls are connected with each other to form and define the at least one accommodation opening. The fastening elements are disposed on a part of the lateral walls. The coolant chamber unit is connected with the plastic frame and embedded in the at least one accommodation opening, and includes at least one surface exposed.

公开(公告)号：US20180148622A1

公开(公告)日：2018-05-31

申请号：US15576533

申请日：2016-05-24

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yoshitaka TAKEZAWA ,  Shihui SONG ,  Keiji FUKUSHIMA ,  Tomokazu TANASE ,  Tetsuji KATOH ,  Akihiro SANO ,  Hiroaki KOJIMA

IPC分类号： C09K5/14 ,  F28F21/06 ,  F28F21/08 ,  C08J5/18 ,  C08L63/00 ,  H01B3/40 ,  B32B15/092 ,  C08J5/24

CPC分类号： C09K5/14 ,  B32B15/08 ,  B32B15/092 ,  B32B2264/107 ,  B32B2307/302 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/00 ,  C08J2461/14 ,  C08K3/22 ,  C08L63/00 ,  C08L101/00 ,  F28F21/065 ,  F28F21/089 ,  H01B3/40

摘要： A resin composition contains: a thermosetting resin; a thermally conductive filler; and mica; in which, when the thermally conductive filler is divided into a filler group (A) having a particle diameter of from 10 μm to 100 μm, a filler group (B) having a particle diameter of from 1.0 μm to smaller than 10 μm, and a filler group (C) having a particle diameter of from 0.1 μm to smaller than 1.0 μm, a ratio of the filler group (C) with regard to the thermally conductive filler, based on volume, is larger than a ratio of the filler group (B) with regard to the thermally conductive filler, based on volume.

公开(公告)号：US09921010B2

公开(公告)日：2018-03-20

申请号：US14410023

申请日：2013-08-20

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Miyuki Ootomo ,  Yousuke Hamada

IPC分类号： F28F21/06 ,  F28D9/00 ,  F24F3/147 ,  F28D21/00 ,  F24F12/00 ,  F24F3/14

CPC分类号： F28F21/065 ,  F24F3/147 ,  F24F12/006 ,  F24F2003/1435 ,  F28D9/0037 ,  F28D21/0015 ,  F28F2245/02 ,  Y02B30/563

摘要： Partitioning member (1) for total heat exchange element includes porous base material (2), and porous base material (2) is filled with hydrophilic polymer compound (3) at a surface and an inside thereof. Hydrophilic polymer compound (3) is formed by polymerizing a low-molecular-weight organic compound having a quaternary ammonium group and an amide group, and represented by chemical formula (1): wherein A is a linear or branched alkylene group having 1 to 10 carbon atoms; R1, R2 and R3 are linear or branched alkyl groups each independently having 1 to 8 carbon atoms; and Y has a polymerizable functional group, and is polymerized to form a main chain of the hydrophilic polymer compound.