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    Magnetic element and method for manufacturing same
    4.
    发明授权
    Magnetic element and method for manufacturing same 有权

    公开(公告)号：US11664157B2

    公开(公告)日：2023-05-30

    申请号：US16653970

    申请日：2019-10-15

    Applicant: Delta Electronics (Shanghai) Co., Ltd.

    Inventor： Shouyu Hong ,  Jianping Ying ,  Jianhong Zeng ,  Chaofeng Cai ,  Ganyu Zhou ,  Pengkai Ji

    IPC: H01F41/04 ,  H01F27/28 ,  H01F27/24

    CPC classification number: H01F41/041 ,  H01F27/24 ,  H01F27/2804

    Abstract: The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.

    Power module and method for manufacturing the same
    5.
    发明授权
    Power module and method for manufacturing the same 有权

    公开(公告)号：US11495521B2

    公开(公告)日：2022-11-08

    申请号：US16936798

    申请日：2020-07-23

    Applicant: Delta Electronics (Shanghai) CO., LTD

    Inventor： Pengkai Ji ,  Shouyu Hong ,  Yiqing Ye

    IPC: H01L23/49 ,  H01L27/06 ,  H01L21/48 ,  H01L23/36 ,  H01L25/16 ,  H01L49/02

    Abstract: The present disclosure provides a power module and a method for manufacturing the power module. The power module includes a chip, a passive element and connection pins. The connection pins are provided on a pin-out surface of the power module, and are electrically connected to at least one of a chip terminal of the chip and the passive element; a projection of the chip on the pin-out surface of the power module does not overlap with a projection of the passive element on the pin-out surface of the power module, and an angle between the terminal-out surface of the chip and the pin-out surface of the power module is greater than 45° and less than 135°.

    Power module assembly
    6.
    发明授权
    Power module assembly 有权

    公开(公告)号：US11444036B2

    公开(公告)日：2022-09-13

    申请号：US17155956

    申请日：2021-01-22

    Applicant: Delta Electronics (Shanghai) Co., Ltd.

    Inventor： Shouyu Hong ,  Yan Tong ,  Weicheng Zhou ,  Dongfang Lian ,  Haiyang Cao ,  Haibin Xu ,  Tao Wang ,  Yicong Xie

    IPC: H05K1/14 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L23/522 ,  H01L23/367 ,  H01L23/528 ,  H01L25/18

    Abstract: A power module assembly is disclosed and includes a package body, a first wiring layer, a capacitor, and a system bus set. The package body includes a first surface, a second surface and two switches connected in series to form a bridge arm between the first surface and the second surface. The first wiring layer is disposed on the first surface. The capacitor is connected in parallel with the bridge arm to form a first high-frequency loop. The system bus set includes a positive-electrode bus and a negative-electrode bus fanned out from the first surface, respectively. The projection of the positive-electrode bus or/and the negative-electrode bus on the first surface is at least partially overlapped with the projection of the two switches on the first surface. The bridge arm is electrically connected between the positive-electrode bus and the negative-electrode bus to form a second high-frequency loop.

    Power module and production method of the same
    8.
    发明授权
    Power module and production method of the same 有权

    公开(公告)号：US10825759B2

    公开(公告)日：2020-11-03

    申请号：US16292342

    申请日：2019-03-05

    Applicant: Delta Electronics (Shanghai) Co., Ltd.

    Inventor： Shouyu Hong ,  Wei Cheng ,  Ganyu Zhou ,  Xin Zou ,  Zhenqing Zhao

    IPC: H01L23/34 ,  H01L23/48 ,  H01L21/00 ,  H01L21/44 ,  H01L23/498 ,  H01L23/373 ,  H01L23/00 ,  H01L21/48 ,  H01L25/07

    Abstract: A power module and a production method of the same, wherein a metal substrate is connected with the connection substrate in a high temperature, and in a process of cooling from a high temperature to a low temperature, an upper surface and a lower surface of the metal substrate are bendingly deformed toward the connection substrate, and the upper surface of the metal substrate is formed as a curved surface protruding toward the connection substrate, then the lower surface of the metal substrate is processed into a plane. In the power module and the production method of the disclosure, the second bonding material between the metal substrate and the connection substrate has a larger edge thickness, which reduces the thermal stress that the edge of the second bonding material is subject to, thereby improving the reliability of the power module while the power module has good heat dissipation performance.

    Magnetic assembly
    9.
    发明授权
    Magnetic assembly 有权

    公开(公告)号：US10117334B2

    公开(公告)日：2018-10-30

    申请号：US15158016

    申请日：2016-05-18

    Applicant: Delta Electronics (Shanghai) Co., Ltd.

    Inventor： Jianhong Zeng ,  Shouyu Hong ,  Min Zhou

    IPC: H01F5/00 ,  H01F27/28 ,  H05K1/18 ,  H05K1/16 ,  H01F3/14 ,  H01F17/00 ,  H01F17/06 ,  H05K3/28

    Abstract: A magnetic assembly is disclosed. The magnetic assembly includes a first magnetic core, a second magnetic core and a first series winding. The first magnetic core has a first top surface, a first bottom surface, a first sidewall, a second sidewall, at least one first sidewall through-hole and at least one second sidewall through-hole. The second magnetic core is connected to the first top surface of the first magnetic core. The first series winding has a first upper winding set, a first sidewall winding set, and a second sidewall winding set disposed on the first top surface, the first sidewall and the second sidewall respectively. The upper winding set is connected to the lower winding set via the first sidewall winding set and the second sidewall winding set is further connected to the lower winding set, so as to form the first series winding around the first magnetic core.

    Package module, package terminal and manufacturing method thereof
    10.
    发明授权
    Package module, package terminal and manufacturing method thereof 有权
    封装模块，封装端子及其制造方法

    公开(公告)号：US09088121B2

    公开(公告)日：2015-07-21

    申请号：US13844265

    申请日：2013-03-15

    Applicant: Delta Electronics (Shanghai) CO., LTD.

    Inventor： Xianming Wang ,  Shouyu Hong

    IPC: H01R12/57 ,  H01R43/16 ,  H01R13/05

    CPC classification number: H01R43/16 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01R12/57 ,  H01R13/05 ,  Y10T29/49204

    Abstract: A package terminal is provided, which comprising: a base; an end portion with a first section; and a bent portion having a C-shape bend with a gradual change section, wherein the bent portion includes a first end and a second end, the first end is connected to the end portion, the second end is connected to the base, the bent portion includes a second section, and an area of the second section is smaller than an area of the first section.

    Abstract translation: 提供一种封装端子，其包括：基座; 具有第一部分的端部; 以及具有逐渐变化部分的C形弯曲部的弯曲部分，其中所述弯曲部分包括第一端和第二端，所述第一端连接到所述端部，所述第二端连接到所述基部，所述弯曲部 部分包括第二部分，并且所述第二部分的区域小于所述第一部分的区域。

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