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公开(公告)号：US20210200285A1
公开(公告)日：2021-07-01
申请号：US17199367
申请日：2021-03-11
发明人： Shouyu Hong , Yiqing Ye , Kai Lu , Qingdong Chen , Le Liang , Jianhong Zeng
摘要： A power module and a manufacturing method thereof are disclosed. The power module includes a substrate, a power device, a leading component and a molding component. The substrate includes a first side, a second side and a conductive wire. The power device is disposed on the substrate and electrically connected with the conductive wire. The leading component is disposed on the substrate and includes a first horizontal portion and a vertical portion connected with each other. The vertical portion is electrically connected with the conductive wire. The leading component includes a first contact surface and a second contact surface, which are non-coplanar. The molding component is disposed on the substrate and covers at least portion of the substrate and at least portion of the leading component. The first contact surface and the second contact surface are uncovered by the molding component.
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公开(公告)号：US20190138069A1
公开(公告)日：2019-05-09
申请号：US16238235
申请日：2019-01-02
发明人： Shouyu Hong , Yiqing Ye , Kai Lu , Qingdong Chen , Le Liang , Jianhong Zeng
摘要： A power module and a manufacturing method thereof are disclosed. The power module includes a substrate, a power device, a leading component and a molding component. The substrate includes a first side, a second side and a conductive wire. The power device is disposed on the substrate and electrically connected with the conductive wire. The leading component is disposed on the substrate and includes a first horizontal portion and a vertical portion connected with each other. The vertical portion is electrically connected with the conductive wire. The leading component includes a first contact surface and a second contact surface, which are non-coplanar. The molding component is disposed on the substrate and covers at least portion of the substrate and at least portion of the leading component. The first contact surface and the second contact surface are uncovered by the molding component.
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公开(公告)号：US20240136119A1
公开(公告)日：2024-04-25
申请号：US18399658
申请日：2023-12-28
发明人： Shouyu Hong , Qingdong Chen , Xin Zou , Mingzhun Zhang , Jiaoping Huang , Jinping Zhou
CPC分类号： H01F27/324 , H01F27/292 , H01F41/125 , H02M3/06
摘要： A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.
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公开(公告)号：US11901114B2
公开(公告)日：2024-02-13
申请号：US17015770
申请日：2020-09-09
发明人： Shouyu Hong , Qingdong Chen , Xin Zou , Mingzhun Zhang , Jiaoping Huang , Jinping Zhou
CPC分类号： H01F27/324 , H01F27/292 , H01F41/125 , H02M3/06
摘要： A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.
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公开(公告)号：US20220217836A1
公开(公告)日：2022-07-07
申请号：US17656432
申请日：2022-03-25
发明人： Shouyu Hong , Qingdong Chen , Sansan Guo , Wulong Cong , Yiqing Ye , Chongfeng Zheng , Ganyu Zhou , Pengkai Ji
摘要： The present disclosure provides a power supply system and an electronic device. The power supply system is used to supply power to a load and includes a system board where the load is disposed; a substrate; at least one output capacitor surface-mounted on the second side of the system board; at least one positive output conductive-connected region disposed on the first side of the substrate, and being electrically connected to one terminal of the at least one output capacitor; at least one negative output conductive-connected region disposed on the first side of the substrate, and being electrically connected to other terminal of the at least one output capacitor; and at least one power unit disposed on the second side of the substrate, and being electrically connected to the at least one positive output conductive-connected region and the at least one negative output conductive-connected region.
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公开(公告)号：US12002615B2
公开(公告)日：2024-06-04
申请号：US17024720
申请日：2020-09-18
发明人： Shouyu Hong , Ganyu Zhou , Zhiheng Fu , Yan Tong , Qingdong Chen , Xiaoni Xin , Jinping Zhou , Pengkai Ji , Yiqing Ye
CPC分类号： H01F27/2804 , H01F27/24 , H01F27/324 , H01F41/0206 , H01F41/041 , H01F41/125
摘要： The present disclosure provides a magnetic element, a manufacturing method of a magnetic element, and a power module. The magnetic element includes: a magnetic core; and a metal wiring layer, where the metal wiring layer is flat wound on a surface of at least one section of a magnetic column of the magnetic core, the metal wiring layer includes a vertical portion and a horizontal portion, and at least part of the vertical portion forms a multi-turn metal winding by mechanically dividing.
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公开(公告)号：US11984250B2
公开(公告)日：2024-05-14
申请号：US17684459
申请日：2022-03-02
发明人： Mingzhun Zhang , Jinping Zhou , Min Zhou , Shouyu Hong , Qingdong Chen
CPC分类号： H01F27/263 , H01F27/02 , H01F27/24 , H01F27/2823 , H02M3/003 , H02M1/0064 , H02M3/04 , H02M3/1586
摘要： A multi-winding inductor includes a magnetic core including three magnetic columns and two windings. Each winding includes a first, a second and a third portions. The first magnetic column is arranged between the first portion of the first winding and the first portion of the second winding; the second magnetic column is arranged on one side of the first portion of the first winding and the third portion of the second winding; and the third magnetic column is arranged between the third portion of the first winding and the third portion of the second winding. The first and the second portions of two windings respectively form pins on opposite sides of the magnetic core.
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公开(公告)号：US20220130587A1
公开(公告)日：2022-04-28
申请号：US17383503
申请日：2021-07-23
发明人： Shouyu Hong , Qingdong Chen , Ningning Zhang , Ganyu Zhou , Zhiheng Fu , Jinping Zhou , Min Zhou , Yiqing Ye
摘要： A magnetic element includes a magnetic core assembly and a winding assembly. The magnetic core assembly includes a first magnetic part. The winding assembly includes a first winding. The first winding is wound around the first magnetic part. Moreover, at least a portion of a substrate is formed as the first winding. The substrate includes a first accommodation space and a first metal structure. Moreover, at least a portion of the first metal structure is formed as at least a portion of the first winding and disposed on four lateral surfaces of the first accommodation space, and at least a portion of the first magnetic part is disposed within the first accommodation space.
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公开(公告)号：US11812545B2
公开(公告)日：2023-11-07
申请号：US17656432
申请日：2022-03-25
发明人： Shouyu Hong , Qingdong Chen , Sansan Guo , Wulong Cong , Yiqing Ye , Chongfeng Zheng , Ganyu Zhou , Pengkai Ji
CPC分类号： H05K1/0231 , G06F1/26 , H05K1/141 , H05K1/144 , H05K2201/10212
摘要： The present disclosure provides a power supply system and an electronic device. The power supply system is used to supply power to a load and includes a system board where the load is disposed; a substrate; at least one output capacitor surface-mounted on the second side of the system board; at least one positive output conductive-connected region disposed on the first side of the substrate, and being electrically connected to one terminal of the at least one output capacitor; at least one negative output conductive-connected region disposed on the first side of the substrate, and being electrically connected to other terminal of the at least one output capacitor; and at least one power unit disposed on the second side of the substrate, and being electrically connected to the at least one positive output conductive-connected region and the at least one negative output conductive-connected region.
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公开(公告)号：US11342257B2
公开(公告)日：2022-05-24
申请号：US17154170
申请日：2021-01-21
发明人： Shouyu Hong , Haibin Xu , Tao Wang , Yan Tong , Weicheng Zhou , Ganyu Zhou , Qingdong Chen , Zhenqing Zhao
IPC分类号： H05K1/02 , H01L23/498 , H01L23/538 , H01L25/16 , H01L23/14
摘要： A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.
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