公开(公告)号：US12230471B2

公开(公告)日：2025-02-18

申请号：US17788556

申请日：2019-12-24

Applicant: Hitachi High-Tech Corporation

Inventor： Shota Aida ,  Hisayuki Takasu ,  Atsushi Kamino ,  Hitoshi Kamoshida

IPC: H01J37/24 ,  H01J37/08 ,  H01J37/244 ,  H01J37/30 ,  H01J37/305

Abstract: There is provided an ion milling apparatus that can enhance reproducibility of ion distribution.
The ion milling apparatus includes an ion source 101, a sample stage 102 on which a sample processed by radiating a non-convergent ion beam from the ion source 101 is placed, a drive unit 107 that moves a measurement member holding section 106 holding an ion beam current measurement member 105 along a track located between the ion source and the sample stage, and an electrode 112 that is disposed near the track, in which a predetermined positive voltage is applied to the electrode 112, the ion beam current measurement member 105 is moved within a radiation range of the ion beam by the drive unit 107, in a state in which the ion beam is output from the ion source 101 under a first radiation condition, and an ion beam current that flows when the ion beam is radiated to the ion beam current measurement member 105 is measured.

公开(公告)号：US12176180B2

公开(公告)日：2024-12-24

申请号：US17773433

申请日：2019-11-20

Applicant: Hitachi High-Tech Corporation

Inventor： Atsushi Sawada ,  Tsunenori Nomaguchi

IPC: H01J37/20 ,  H01J37/26 ,  H01J37/30 ,  H01J37/305

Abstract: A lamella 10 including an analysis portion 11 and a cutout portion 12 separated from the analysis portion 11 is produced. When a plurality of the lamellae 10 are transported to a lamella grid 20, the plurality of lamellae 10 are supported by a support portion 22 protruding from a surface of a substrate 21, and are mounted adjacent to each other in a Z direction. At this time, the cutout portion 12 prevents the analysis portion 11 from damage.

公开(公告)号：US12106935B2

公开(公告)日：2024-10-01

申请号：US18139184

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Joseph C. Olson ,  Morgan Evans ,  Rutger Meyer Timmerman Thijssen

IPC: H01J37/305 ,  G02B6/136 ,  H01J37/12 ,  H01J37/147 ,  H01J37/20 ,  G02B6/12

CPC classification number: H01J37/3053 ,  G02B6/136 ,  H01J37/12 ,  H01J37/1478 ,  H01J37/20 ,  H01J37/3056 ,  G02B2006/12107 ,  H01J2237/1507 ,  H01J2237/3174

Abstract: Embodiments described herein relate to methods and apparatus for forming gratings having a plurality of fins with different slant angles on a substrate and forming fins with different slant angles on successive substrates using angled etch systems and/or an optical device. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle ϑ relative to a surface normal of the substrates and form gratings in the grating material.

公开(公告)号：US20240321548A1

公开(公告)日：2024-09-26

申请号：US18187700

申请日：2023-03-22

Applicant: NUVOTON TECHNOLOGY CORPORATION

Inventor： Yuval Kirschner

IPC: H01J37/305 ,  H01J37/30 ,  H01J37/304

CPC classification number: H01J37/3056 ,  H01J37/3005 ,  H01J37/304 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: An Integrated Circuit (IC), designed for debugging by Focused Ion Beam (FIB) editing, includes functional circuitry, a network of Basic FIB elements (BFEs), and routing circuitry. The functional circuitry includes functional nodes. Each of the BFEs includes a respective metal pad configured to be connected to one of the functional nodes using FIB editing. The routing circuitry is configured to route one or more selected BFEs for analysis.

公开(公告)号：US20240274397A1

公开(公告)日：2024-08-15

申请号：US18509372

申请日：2023-11-15

Applicant: Carl Zeiss Microscopy GmbH

Inventor： Sebastian Schaedler

IPC: H01J37/147 ,  H01J37/302 ,  H01J37/305

CPC classification number: H01J37/1474 ,  H01J37/3023 ,  H01J37/3053

Abstract: Operating a particle beam apparatus includes processing, imaging, and/or analyzing an object. When guiding the particle beam along first dwell regions of a first scan line, the particle beam remains at each of the first dwell regions for a first dwell time. When guiding the particle beam along second dwell regions of a second scan line, the particle beam remains at each of the second dwell regions for a second dwell time. The first dwell time is shorter than the second dwell time. Alternatively, a first region of the first dwell regions has a first spacing with respect to a closest arranged adjacent second region of the first dwell regions. A first region of the second dwell regions has a second spacing with respect to a closest arranged adjacent second region of the second dwell regions. The second spacing is smaller than the first spacing.

公开(公告)号：US20240249909A1

公开(公告)日：2024-07-25

申请号：US18099169

申请日：2023-01-19

Applicant: Applied Materials Israel Ltd.

Inventor： Yehuda Zur ,  Konstantin Chirko

IPC: H01J37/28 ,  H01J37/20 ,  H01J37/22 ,  H01J37/305

CPC classification number: H01J37/28 ,  H01J37/20 ,  H01J37/222 ,  H01J37/3056 ,  H01J2237/31749

Abstract: A method of evaluating, with an evaluation tool that includes a first charged particle column, a region of interest on a sample that includes an array of holes separated by solid portions, the method comprising: positioning the sample such that the region of interest is under a field of view of the first charged particle column; and locally depositing material within the array of holes in the region of interest by: pulsing a flow of deposition gas to the region of interest by turning the flow of the deposition gas ON and then OFF; thereafter, scanning a charged particle beam generated by the first charged particle column across the region of interest; and iteratively repeating the pulsing and scanning steps a plurality of times to locally deposit material within the array of holes in the region of interest.

公开(公告)号：US12040196B2

公开(公告)日：2024-07-16

申请号：US17578903

申请日：2022-01-19

Applicant: FEI Company

Inventor： James Clarke ,  Micah LeDoux ,  Jason Lee Monfort ,  Brett Avedisian

IPC: G01N1/32 ,  G11C5/02 ,  G11C5/06 ,  H01J37/305 ,  H01L21/3213 ,  H01L21/67 ,  H10B41/27 ,  H10B43/27

CPC classification number: H01L21/32131 ,  G01N1/32 ,  G11C5/025 ,  G11C5/06 ,  H01J37/3056 ,  H01L21/67069 ,  H10B41/27 ,  H10B43/27

Abstract: Apparatus and methods are disclosed for sample preparation, suitable for online or offline use with multilayer samples. Ion beam technology is leveraged to provide rapid, accurate delayering with etch stops at a succession of target layers. In one aspect, a trench is milled around a region of interest (ROI), and a conductive coating is developed on an inner sidewall. Thereby, reliable conducting paths are formed between intermediate layers within the ROI and a base layer, and stray current paths extending outside the ROI are eliminated, providing better quality etch progress monitoring, during subsequent etching, from body or scattered currents. Ion beam assisted gas etching provides rapid delayering with etch stops at target polysilicon layers. Uniform etching at deep layers can be achieved. Variations and results are disclosed.

公开(公告)号：US20240177967A1

公开(公告)日：2024-05-30

申请号：US18522679

申请日：2023-11-29

Applicant: FEI Company

Inventor： Matej Dolník ,  Veronika Vrbovská ,  Radim Kríž ,  Jakub Kuba ,  Tilman Franke

IPC: H01J37/305

CPC classification number: H01J37/3056 ,  H01J2237/31749

Abstract: The disclosure relates to a method for micromachining a biological sample for creating a lamella for analysis in a Cryo-Charged Particle Microscope (Cryo-CPM). The method comprising the steps of providing a biological sample on a sample carrier; Locating a sample area on the sample carrier, said sample area comprising a region of interest having biological material from which a lamella can be created; and Micromachining at least part of the biological sample so as to remove material in a part of the sample area surrounding the region of interest, in order to increase a visual contrast between the biological material in the region of interest and its surroundings. With the increased visual contrast a location for a potential lamella can be identified.

公开(公告)号：US20240177966A1

公开(公告)日：2024-05-30

申请号：US18432838

申请日：2024-02-05

Applicant: FIBICS INCORPORATED

Inventor： Michael William PHANEUF ,  Ken Guillaume LAGAREC

IPC: H01J37/26 ,  H01J37/22 ,  H01J37/28 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305

CPC classification number: H01J37/26 ,  H01J37/222 ,  H01J37/28 ,  H01J37/3005 ,  H01J37/304 ,  H01J37/3045 ,  H01J37/3056 ,  G06T2207/10061 ,  H01J2237/226 ,  H01J2237/2811 ,  H01J2237/3174 ,  H01J2237/31749

Abstract: Linear fiducials with known angles relative to each other are formed such that their structures appear in a cross-sectional face of the sample as a distinct structure. Therefore, when imaging the cross-section face during the cross-sectioning operation, the distance between the identified structures allows unique identification of the position of the cross-section plane along the Z axis. Then a direct measurement of the actual position of each slice can be calculated, allowing for dynamic repositioning to account for drift in the plane of the sample and also dynamic adjustment of the forward advancement rate of the FIB to account for variations in the sample, microscope, microscope environment, etc. that contributes to drift. An additional result of this approach is the ability to dynamically calculate the actual thickness of each acquired slice as it is acquired.

公开(公告)号：US11972923B2

公开(公告)日：2024-04-30

申请号：US17566904

申请日：2021-12-31

Applicant: FEI Company

Inventor： Christopher Thompson ,  Dustin Ellis ,  Adam Stokes ,  Ronald Kelley ,  Cedric Bouchet-Marquis

IPC: H01J37/305 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/3056 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/2007 ,  H01J2237/208 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: Methods and systems for creating attachments between a sample manipulator and a sample within a charged particle systems are disclosed herein. Methods include translating a sample manipulator so that it is proximate to a sample, and milling portions of the sample manipulator such that portions are removed. The portion of the sample manipulator proximate to the sample is composed of a high sputter yield material, and the high sputter yield material may be the material milled with the charged particle beam such that it is removed from the sample manipulator. According to the present disclosure, the portions of the sample manipulator are milled such that at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample.