公开(公告)号：US12217925B2

公开(公告)日：2025-02-04

申请号：US17796501

申请日：2021-08-25

Applicant: Beijing BOE Technology Development Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingli Shi

IPC: H01H59/00 ,  B81B3/00

Abstract: The present disclosure provides a radio frequency micro-electro-mechanical switch and a radio frequency device, belong to the field of micro-electro-mechanical systems technology, and can at least partially solve a problem that functional performance of an existing radio frequency micro-electro-mechanical switch is easily to be affected in scenarios such as bending deformation of devices. The radio frequency micro-electro-mechanical switch provided by the present disclosure includes: a substrate; and a signal electrode, a first ground electrode, a second ground electrode and a connecting membrane bridge disposed on the substrate, the connecting membrane bridge crosses over the signal electrode, two ends of the connecting membrane bridge are connected to the first ground electrode and the second ground electrode respectively, and the connecting membrane bridge includes a stretchable structure being stretchable in a stretchable direction the same as an extending direction in which the connecting membrane bridge extends.

公开(公告)号：US12094675B2

公开(公告)日：2024-09-17

申请号：US17631077

申请日：2020-07-28

Applicant: Siemens Aktiengesellschaft

Inventor： Franziska Lambrecht ,  Markus Schwarz

IPC: H01H59/00 ,  H01H1/00

CPC classification number: H01H59/0009 ,  H01H1/0036 ,  H01H2001/0084

Abstract: Various embodiments include an arrangement comprising a plurality of MEMS switches with movable elements. The plurality of MEMS switches are connected to one another in a total-cross-tied configuration.

公开(公告)号：US12091313B2

公开(公告)日：2024-09-17

申请号：US17000634

申请日：2020-08-24

Applicant: The Research Foundation for The State University of new York

Inventor： Shahrzad Towfighian ,  Mark Pallay ,  Meysam Daeichin ,  Ronald Miles

IPC: B81B7/02 ,  B81B3/00 ,  B81B7/00 ,  H02N2/18 ,  H01H59/00

CPC classification number: B81B7/02 ,  B81B3/0021 ,  B81B7/0022 ,  B81B7/008 ,  H02N2/181 ,  H02N2/186 ,  H01H59/0009

Abstract: A microelectromechanical actuator, comprising: a substrate, having a surface; a conductive beam suspended parallel to the substrate, displaceable along an axis normal to the surface of the substrate; a center electrode on the substrate under the beam; a pair of side electrodes on the substrate configured, when charged, to exert an electrostatic force normal to the surface of the substrate on the beam that repulses the beam from the substrate, and exerts a balanced electrostatic force on the beam in a plane of the surface of the substrate, the center conductive electrode being configured to shield the beam from electrostatic forces induced by the side electrodes from beneath the beam, and the center electrode being configured to have a voltage different from a voltage on the beam, to thereby induce an attractive electrostatic force on the beam.

公开(公告)号：US20240274388A1

公开(公告)日：2024-08-15

申请号：US18168959

申请日：2023-02-14

Applicant: Texas Instruments Incorporated

Inventor： Adam Fruehling ,  Scott Summerfelt

IPC: H01H59/00

CPC classification number: H01H59/0009 ,  H01H2203/02 ,  H01H2205/004

Abstract: An apparatus includes a semiconductor structure having a cavity. The apparatus also includes a first electrical terminal on a first cavity side, a second electrical terminal on a second cavity side, and the second electrical terminal including an extension that overlaps part of the cavity. The apparatus also includes a bendable beam extending from the first cavity side and overlapping at least part of the extension. The apparatus also includes an actuator in a periphery of the beam, the actuator configured to generate a fringing electric field that causes the second beam side to move towards the extension in a direction different from the fringing electric field and bend the beam.

公开(公告)号：US20240128032A1

公开(公告)日：2024-04-18

申请号：US18394444

申请日：2023-12-22

Applicant: Menlo Microsystems, Inc.

Inventor： Pallab Midya ,  Yan-Fei Liu ,  Chris Giovanniello ,  Peter Maimone ,  Mohammed Agamy

IPC: H01H1/00 ,  H01H59/00 ,  H01H71/08

CPC classification number: H01H1/0036 ,  H01H59/0009 ,  H01H71/08 ,  H01H2071/008

Abstract: A switch device may comprise a micro-relay disposed between a first terminal and a second terminal. The micro-relay may be configured to selectively electrically couple the first terminal to the second terminal. The switch device may further comprise a bypass circuit configured to selectively divert at least a portion of electrical current flowing from the first terminal to the micro-relay, and direct the diverted electrical current to the second terminal. The switch device may further comprise an energy harvesting circuit configured to (i) withdraw a portion of energy flowing into the switch device, (ii) store the portion of energy in an energy storage device, and (iii) supplying the energy stored in the energy storage device to one or more components within the switch device.

公开(公告)号：US11728116B2

公开(公告)日：2023-08-15

申请号：US16907161

申请日：2020-06-19

Applicant: Qorvo US, Inc.

Inventor： Roberto Gaddi ,  Robertus Petrus Van Kampen

IPC: H01H59/00 ,  H01P1/12

CPC classification number: H01H59/0009 ,  H01P1/12

Abstract: An electrical arrangement for performing radio frequency isolation for microelectromechanical relay switches. A microelectromechanical relay switch comprises a beam configured to switch from a first position connected to an upper voltage source to a second position connected to a lower voltage source. The microelectromechanical relay switch further comprises at least one frequency isolation circuit or resistor disposed adjacent to the beam. The at least one frequency isolation circuit or resistor biases a direct current potential to allow for electrostatic actuation and further provides a path for transient electrical currents during switching.

公开(公告)号：US20230064520A1

公开(公告)日：2023-03-02

申请号：US18046774

申请日：2022-10-14

Applicant: Menlo Microsystems, Inc.

Inventor： Andrew Minnick ,  Christopher F. Keimel ,  Xu Zhu

IPC: H01H1/0237 ,  H01H49/00 ,  H01H59/00 ,  H01L21/00

Abstract: A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum-group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

公开(公告)号：US11527376B2

公开(公告)日：2022-12-13

申请号：US16521682

申请日：2019-07-25

Applicant: Kionix, Inc.

Inventor： Scott A. Miller ,  Nicole Kerness ,  Randy Phillips ,  Sangtae Park ,  Martin Heller ,  Mizuho Okada ,  Andrew Hocking ,  Wenting Gu

IPC: B81B3/00 ,  H01H59/00

Abstract: A micro-electromechanical system (MEMS) device includes a substrate and a beam suspended relative to a surface of the substrate. The substrate includes a buried insulator layer and a cavity. The beam includes a first portion and a second portion that are separated by an isolation joint. The cavity separates the surface of the substrate from the beam.

公开(公告)号：US11342149B2

公开(公告)日：2022-05-24

申请号：US16131750

申请日：2018-09-14

Applicant: International Business Machines Corporation

Inventor： Michel Despont

IPC: H01H49/00 ,  H01H59/00

Abstract: The present invention provides an integrated electro-mechanical actuator and a manufacturing method for manufacturing such an integrated electro-mechanical actuator. The integrated electro-mechanical actuator comprises an electrostatic actuator gap between actuator electrodes and an electrical contact gap between contact electrodes. An inclination with an inclination angle is provided between the actuator electrodes and the contact electrodes. The thickness of this electrical contact gap is equal to the thickness of a sacrificial layer which is etched away in a manufacturing process.

公开(公告)号：US20210297011A1

公开(公告)日：2021-09-23

申请号：US17338650

申请日：2021-06-03

Applicant: PixArt Imaging Inc.

Inventor： Ville Mäkinen ,  Roberto Tejera-Garcia ,  Aki Salminen

IPC: H02N1/00 ,  G06F3/01 ,  H01H59/00 ,  H02N1/08

Abstract: An actuator is configured to include a first substrate that has a first conductive surface, which maybe or include a first conductive electrode layer. The actuator also includes a second substrate that has a second conductive surface, which may be or include a second conductive electrode layer. The first and second conductive surfaces face toward each other across a compression space between the first and second substrates. A group of elastic support nodules span the compression space and separate the first and second conductive surfaces. The compression space is less than fully filled with solid elastic material and is configured to be compressed by relative movement of the first and second conductive surfaces toward each other in response to a voltage difference between the first and second conductive surfaces.