公开(公告)号：US11527376B2

公开(公告)日：2022-12-13

申请号：US16521682

申请日：2019-07-25

申请人： Kionix, Inc.

发明人： Scott A. Miller ,  Nicole Kerness ,  Randy Phillips ,  Sangtae Park ,  Martin Heller ,  Mizuho Okada ,  Andrew Hocking ,  Wenting Gu

IPC分类号： B81B3/00 ,  H01H59/00

摘要： A micro-electromechanical system (MEMS) device includes a substrate and a beam suspended relative to a surface of the substrate. The substrate includes a buried insulator layer and a cavity. The beam includes a first portion and a second portion that are separated by an isolation joint. The cavity separates the surface of the substrate from the beam.