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公开(公告)号：US12130422B2
公开(公告)日：2024-10-29
申请号：US17066945
申请日：2020-10-09
申请人： NPS CO., LTD.
发明人： Seong Ho Bae
CPC分类号： G02B26/0816 , B23K26/043 , B23K26/1462 , G01M11/0221 , G05B19/401 , G06N20/00 , B23K26/38 , G05B2219/4719
摘要： The present disclosure relates to a laser apparatus including a laser oscillator for oscillating a laser beam; a mirror mount assembly including a mount-side reflective mirror for transmitting the laser beam by reflecting the laser beam; an aligner including a dial that is configured to change alignment of the mount-side reflective mirror according to a rotation angle and a rotation direction and is responsible for adjusting, by the degree of displacement of the reflection angle of the mount-side reflective mirror according to change in the alignment state, a processing optical path through which the laser beam travels, and a driving motor for driving rotation of the dial; an examination module for calculating the optical path difference between a predetermined reference processing optical path and the processing optical path and examining whether optical path distortion occurs on the processing optical path; a calculation module for, when the optical path difference exceeds predetermined reference optical path difference, calculating the target driving speed and target driving time of the driving motor for changing alignment of the mount-side reflective mirror to correct the optical path distortion so that the optical path difference is less than or equal to the predetermined reference optical path difference; and a controller for driving the driving motor according to the target driving speed and the target driving time, wherein the examination module recalculates the optical path difference between the reference processing optical path and the processing optical path that has been changed by the driving motor according to the target driving speed and the target driving time and re-examines whether the optical path distortion occurs, the calculation module recalculates the target driving speed and the target driving time based on the recalculated optical path difference when the recalculated optical path difference exceeds the reference optical path difference, and the controller drives the driving motor again according to the recalculated target driving speed and target driving time.
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公开(公告)号：US12121992B2
公开(公告)日：2024-10-22
申请号：US16185364
申请日：2018-11-09
IPC分类号： B23K26/08 , B23K26/04 , B23K26/046 , B23K26/073 , B23K26/082 , B25J9/16
CPC分类号： B23K26/0884 , B23K26/043 , B23K26/046 , B23K26/0736 , B23K26/082 , B25J9/1679
摘要： A laser machining method includes obtaining a movement direction in which a head that variably makes a shape of a radiation locus using a laser is being moved by a robot that causes the head to move along a machining line, and adjusting the radiation locus made by the head to keep a constant relative angle between the movement direction obtained by the obtaining and a representative angle of the shape of the radiation locus.
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公开(公告)号：US12121991B2
公开(公告)日：2024-10-22
申请号：US16756604
申请日：2017-10-25
申请人： NIKON CORPORATION
IPC分类号： B23K26/04
CPC分类号： B23K26/04
摘要： A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a processing light; and a measurement apparatus that measures a position of an irradiation area, which is formed on the surface of the object by the light irradiation apparatus, relative to the object.
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公开(公告)号：US12090563B2
公开(公告)日：2024-09-17
申请号：US18175676
申请日：2023-02-28
申请人： DISCO CORPORATION
发明人： Yuta Mizumoto
CPC分类号： B23K1/0056 , B23K26/03 , B23K26/04 , B23K2101/40
摘要： A laser reflow method includes preparing a workpiece including a board and semiconductor chips each having one or more bumps formed on one surface thereof, the semiconductor chips being placed on the board with the bumps interposed therebetween. An inclination detection step captures an image of one semiconductor chip and detects an inclination of the semiconductor chip within the captured image. A laser beam irradiation step irradiates each semiconductor chip with a laser beam from another surface side opposite to the one surface to reflow the bumps formed within an irradiated range of the workpiece. A phase pattern displayed by a spatial light modulator is rotated in such a manner as to agree with the inclination of the detected semiconductor chip, to thereby rotate an irradiation range of the laser beam within an irradiated surface of the workpiece, before the semiconductor chips are irradiated with the laser beam.
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公开(公告)号：US12064830B2
公开(公告)日：2024-08-20
申请号：US16817147
申请日：2020-03-12
申请人： ROHR, INC.
发明人： Arabella Mueller , Angel Cabrera , Fassil Ghebremichael , Charles Novak , Dominic J. Elliott , Andrew Adan
IPC分类号： B23K26/38 , B23K26/04 , B23K26/067
CPC分类号： B23K26/38 , B23K26/04 , B23K26/0673 , B23K26/0676
摘要： A perforation system is disclosed that utilizes an optical beamlet generator and a scanner (e.g., at least two moveable mirrors). The optical beamlet generator may be a lenslet array or a diffractive optical element. The optical beamlet generator outputs a plurality of beamlets from a single input laser beam. These beamlets are moved in at least two dimensions relative to a surface of a substrate to form perforations in the substrate.
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公开(公告)号：US12042879B2
公开(公告)日：2024-07-23
申请号：US17079223
申请日：2020-10-23
申请人： NPS CO., LTD.
发明人： Seong Ho Bae
IPC分类号： B23K26/042 , B23K26/02 , B23K26/04 , B23K26/06 , B23K26/082 , B23K26/14 , G02B7/182
CPC分类号： B23K26/042 , B23K26/02 , B23K26/043 , B23K26/0643 , B23K26/082 , B23K26/1462 , G02B7/1822 , G02B7/1825 , G02B7/1827
摘要： Disclosed herein is a laser apparatus including: a laser oscillator configured to generate a laser beam; a plurality of mirror mount assemblies each arranged in one of predetermined reference transmission steps, each of the mirror mount assemblies including: a mount-side reflective mirror configured to reflect and transmit the laser beam; and an aligner configured to change alignment of the mount-side reflective mirror to adjust a machining optical path through which the laser beam transmitted by the mount-side reflective mirror travels; a laser nozzle assembly including a laser nozzle configured to radiate the laser beam transmitted from the mirror mount assembly located in the last step of the reference transmission steps onto an object to be processed; a database configured to store big data constructed to include optical path adjustment data indicating a pattern of selective adjustment of the machining optical path by the mount-side reflective mirror linked with the aligner according to a driving method of the aligner; and a controller configured to correct, when distortion occurs in the machining optical path, the distortion of the machining optical path by selectively driving the aligner provided in each of at least one mirror mount assembly among the mirror mount assemblies based on the big data using a driving method according to a pattern of the distortion of the machining optical path.
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公开(公告)号：US20240227070A9
公开(公告)日：2024-07-11
申请号：US18548392
申请日：2022-04-25
CPC分类号： B23K26/048 , B23K26/0869 , B23K26/1476 , B23K26/18
摘要： A laser machining device uses laser light to machine a workpiece disposed in a light-blocking liquid having light-blocking properties. A nozzle unit for the laser machining device includes an inner nozzle through which the laser light passes, a gas outlet port that blows a gas toward the workpiece in order to remove the light-blocking liquid from between the inner nozzle and the workpiece, and a swirler that causes the gas to swirl.
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公开(公告)号：US11992897B2
公开(公告)日：2024-05-28
申请号：US18362995
申请日：2023-08-01
发明人： Tim Hesse , Daniel Flamm , Myriam Kaiser
IPC分类号： B23K26/067 , B23K26/04
CPC分类号： B23K26/0676 , B23K26/043
摘要： An apparatus for laser machining a workpiece in a machining plane includes a first laser machining unit for forming a first focal zone which extends in a first main direction of extent, and at least one further laser machining unit for forming at least one further focal zone which extends in a further main direction of extent oriented transversely to the first main direction of extent. The first focal zone and the at least one further focal zone are spaced apart from one another parallel to the machining plane at a work distance. The first laser machining unit and the at least one further laser machining unit are movable in an advancement direction that is oriented parallel to the machining plane. The workpiece comprises a material that is transparent to a laser beam which respectively forms the first focal zone and the at least one further focal zone.
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公开(公告)号：US11794277B2
公开(公告)日：2023-10-24
申请号：US17113627
申请日：2020-12-07
申请人： DISCO CORPORATION
发明人： Keiji Nomaru
IPC分类号： B23K26/03 , B23K26/04 , B23K26/064 , H01S3/08 , B23K26/08 , B23K101/40
CPC分类号： B23K26/03 , B23K26/048 , B23K26/064 , B23K26/0853 , H01S3/08009 , B23K2101/40
摘要： A mechanism for detecting the inside of a workpiece includes a wavelength delaying unit for outputting each pulse of a pulsed laser beam emitted from a laser oscillator with time differences imparted to respective wavelengths, and a ring generating unit for generating a ring-shaped pulsed laser beam from the pulsed laser beam with the time differences imparted to the respective wavelengths and diffracting the ring-shaped pulsed laser beam into ring-shaped laser beams ranging from small to large at the respective wavelengths. When the ring-shaped laser beams with the time differences imparted to the respective wavelengths are applied to the workpiece, they produce an interference wave of ultrasonic waves in the workpiece, and vibrations are produced at a position where the interference wave of the ultrasonic waves is converged. A laser beam is applied to an upper surface of the workpiece at a position aligned with the center of the vibrations.
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公开(公告)号：US11768157B2
公开(公告)日：2023-09-26
申请号：US18098083
申请日：2023-01-17
发明人： Jong Hyun Yoo , Chunyi Liu , Richard E. Russo
CPC分类号： G01N21/718 , B23K26/048 , H01J49/0004 , H01J49/0463 , H01J49/0468 , H01J49/105
摘要： Apparatus for laser induced ablation spectroscopy (LIBS) is disclosed. An apparatus can have a computer, a pulsed laser and a lightguide fiber bundle that is subdivided into branches. One branch can convey a first portion of the light to a first optical spectrometer and a different branch can convey a second portion of the light to another optical spectrometer. The first spectrometer can be relatively wideband to analyze a relative wide spectral segment and the other spectrometer can be high dispersion to measure minor concentrations. The apparatus can further comprise an unbranched lightguide fiber bundle to provide more light to a low sensitivity spectrometer. The apparatus can include an inductively coupled plasma mass spectrometer ICP-MS and a computer instructions operable to provide normalized LIBS/ICP-MS composition analyses.
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