公开(公告)号：US12090563B2

公开(公告)日：2024-09-17

申请号：US18175676

申请日：2023-02-28

申请人： DISCO CORPORATION

发明人： Yuta Mizumoto

IPC分类号： B23K26/00 ,  B23K1/00 ,  B23K1/005 ,  B23K26/03 ,  B23K26/04 ,  B23K101/40

CPC分类号： B23K1/0056 ,  B23K26/03 ,  B23K26/04 ,  B23K2101/40

摘要： A laser reflow method includes preparing a workpiece including a board and semiconductor chips each having one or more bumps formed on one surface thereof, the semiconductor chips being placed on the board with the bumps interposed therebetween. An inclination detection step captures an image of one semiconductor chip and detects an inclination of the semiconductor chip within the captured image. A laser beam irradiation step irradiates each semiconductor chip with a laser beam from another surface side opposite to the one surface to reflow the bumps formed within an irradiated range of the workpiece. A phase pattern displayed by a spatial light modulator is rotated in such a manner as to agree with the inclination of the detected semiconductor chip, to thereby rotate an irradiation range of the laser beam within an irradiated surface of the workpiece, before the semiconductor chips are irradiated with the laser beam.