Multi-purpose IO pads/bumps on semiconductor chips to maximize chip-to-chip data connectivity

    公开(公告)号:US12182051B1

    公开(公告)日:2024-12-31

    申请号:US16986004

    申请日:2020-08-05

    Inventor: Behzad Bahadori

    Abstract: Multi-purpose interface bumps on semiconductor chips may be used to optimize chip-to-chip data connectivity, including for example high speed chip-to-chip interfaces using fine-pitched bumps adaptable to interfaces with standard bumps without loss of total data rate. A chip with fine-pitch pads for μ-bumps may be connected to an organic package substrate with every other pad populated with a bump and connected to the organic package substrate, while adjacent pads are not populated with bumps and are deactivated. Total number of active bumps to 1/N for each data interface block, and the total bandwidth may be maintained by increasing the active bump data rate by N-times.

    Identifying alignment markers using partial correlators

    公开(公告)号:US11824761B1

    公开(公告)日:2023-11-21

    申请号:US16199744

    申请日:2018-11-26

    Applicant: Xilinx, Inc.

    Inventor: Ben J. Jones

    CPC classification number: H04L45/24 H04L1/0045 H04L25/14

    Abstract: Methods and apparatus for detecting alignment markers in received data streams received via a plurality of data lanes are disclosed. Corresponding data streams may be received via respective data lanes in the plurality of data lanes, where each data stream includes alignment markers delineating data frames, and each alignment marker has a predefined bit pattern. For each respective data lane, a determination is made whether a specified portion of the received data stream has at least a threshold degree of similarity with a portion of the predefined bit pattern. In response to determining, for one of the plurality of data lanes, that the specified portion has at least the threshold degree of similarity, a frame boundary may be determined based on the specified portion, and a verification may be performed, that the specified portion of the received data stream corresponds to an alignment marker.

    INTERFACE CIRCUIT AND INFORMATION PROCESSING SYSTEM

    公开(公告)号:US20220182210A1

    公开(公告)日:2022-06-09

    申请号:US17676972

    申请日:2022-02-22

    Abstract: A signal is transmitted at a high speed in a direction opposite to a transmitting direction of a main large-capacity channel. A first transmitting unit transmits a first signal including a clock component to an external device through a transmission path as a differential signal. A second transmitting unit superimposes a second signal including a clock component on the transmission path as an in-phase signal to transmit to the external device. A state notifying unit communicates with the external device through a pair of differential transmission paths included in the transmission path and notifies the external device of a connection state of its own device by a DC bias potential of at least one of the pair of differential transmission paths.

    Interface circuit and information processing system

    公开(公告)号:US11271706B2

    公开(公告)日:2022-03-08

    申请号:US17022356

    申请日:2020-09-16

    Abstract: A signal is transmitted at a high speed in a direction opposite to a transmitting direction of a main large-capacity channel. A first transmitting unit transmits a first signal including a clock component to an external device through a transmission path as a differential signal. A second transmitting unit superimposes a second signal including a clock component on the transmission path as an in-phase signal to transmit to the external device. A state notifying unit communicates with the external device through a pair of differential transmission paths included in the transmission path and notifies the external device of a connection state of its own device by a DC bias potential of at least one of the pair of differential transmission paths.

    Low power chip-to-chip bidirectional communications

    公开(公告)号:US11032110B2

    公开(公告)日:2021-06-08

    申请号:US16808252

    申请日:2020-03-03

    Applicant: Kandou Labs SA

    Inventor: Ali Hormati

    Abstract: Methods and systems are described for receiving symbols of a codeword via wires of a multi-wire bus, the codeword representing an aggregate sum of a plurality of sub-channel constituent codewords, each sub-channel constituent codeword representing a weight applied to an associated sub-channel vector of a plurality of sub-channel vectors of an orthogonal matrix, generating a plurality of comparator outputs using a plurality of common-mode resistant multi-input comparators (MICs), each common-mode resistant MIC having a set of input coefficients representing a corresponding sub-channel vector of the plurality of sub-channel vectors, each sub-channel vector (i) mutually orthogonal and (ii) orthogonal to a common-mode sub-channel vector, outputting a set of forward-channel output bits formed based on the plurality of comparator outputs, obtaining a sequence of reverse-channel bits, and transmitting the sequence of reverse-channel bits by sequentially transmitting common-mode codewords over the wires of the multi-wire bus.

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