Abstract:
Disclosed is a nonvolatile semiconductor memory device in which a disturbance phenomenon can be prevented. A nonvolatile semiconductor memory device has a semiconductor substrate, and a floating gate electrode formed on the semiconductor substrate via a gate insulating film. The floating gate electrode includes a lower conductive layer formed on the gate insulating film and having a first width W1 in a channel width direction, and an upper conductive layer formed on the lower conductive layer and having a second width W2 wider than the first width W1 in the channel width direction.
Abstract:
A semiconductor device is provided and contains a substrate, a first wiring layer, a first oxide film, a dielectric film, a first nitrogen layer, a second wiring layer, a via hole, and a second nitrogen layer. The first wiring layer is formed on the substrate, and the first oxide film formed on the first wiring layer. The dielectric film has a low dielectric constant and is disposed between the first and second wiring layers. The first nitrogen layer contains nitrogen and is formed in the first oxide film. The via hole is formed through the dielectric film and is disposed between the first wiring layer and the second wiring layer for electrically connecting the first wiring layer and the second wiring layer. The second nitrogen layer contains nitrogen and is formed on a side wall of the via hole. Since the first and second nitrogen layers prevent moisture from spreading to various portions of the semiconductor device, leak current between adjacent wirings of the wiring layers is prevented. Also, the chances that an opening will not form in the via hole when the via hole is created is reduced.
Abstract:
A method is provided for forming one or more doped layers using ion-implantation in the fabrication of thyristor devices. For example, these thyristors may be made from single crystalline silicon carbide. According to one aspect of the invention, one of the required layers is formed by introducing dopants after crystal growth as opposed to conventional methods which involve doping during crystal growth. Specifically, impurities may be introduced by using the technique of ion implantation.
Abstract:
A semiconductor device includes an interlayer insulation film formed on a substrate so as to cover first and second regions defined on the substrate, and a capacitor formed over the interlayer insulation film in the first region, wherein the interlayer insulation film includes, in the first region, a stepped part defined by a groove having a bottom surface lower in level than a surface of the interlayer insulation film in the second region.
Abstract:
In a semiconductor memory, a barrier layer formed of a first metal film, a metal nitride film and a second metal film laminated in the named order is formed under a lower electrode of a ferroelectric capacitor in a memory cell, in order to minimize a pealing and lifting of the lower electrode from an underlying plug in the process of forming a ferroelectric material film as a capacitor dielectric film and in its succeeding annealing process. The metal nitride film is formed of a nitride of a metal constituting the first or second metal film.
Abstract:
One aspect of the present invention relates to a SONOS type non-volatile semiconductor memory device having improved erase speed, the device containing bitlines extending in a first direction; wordlines extending in a second direction, the wordlines comprising functioning wordlines and at least one dummy wordline, wherein the dummy wordline is positioned near at least one of a bitline contact and an edge of the core region, and the dummy wordline is treated so as not to cycle between on and off states. Another aspect of the present invention relates to a method of making a SONOS type non-volatile semiconductor memory device having improved erase speed, involving forming a plurality of bitlines extending in a first direction in the core region; forming a plurality of functioning wordlines extending in a second direction in the core region; forming at least one dummy wordline between the functioning wordlines and the periphery region or between the functioning wordlines and a bitline contact and treating the device so that the dummy wordline does not cycle between on and off states.
Abstract:
A memory cell configuration includes, as a memory cell, a ferroelectric transistor having a first gate intermediate layer and a first gate electrode between source/drain regions at the surface of a semiconductor substrate. The first gate intermediate layer contains at least one ferroelectric layer. Beside the first gate intermediate layer, a second gate intermediate layer and a second gate electrode are disposed between the source/drain regions, the second gate intermediate layer containing a dielectric layer. The first gate electrode and the second gate electrode are connected to one another through a diode structure. Strip-type doped well regions are provided in the semiconductor substrate, which well regions run between the source/drain regions of the respective ferroelectric transistor.
Abstract:
A highly miniaturized nanomechanical transistor switch is fabricated using a mechanical cantilever which creates a conductive path between two electrodes in its deflected state. In one embodiment, the cantilever is deflected by an electrostatic attraction arising from a voltage potential between the cantilever and a control electrode. In another embodiment, the cantilever is formed of a material with high magnetic permeability, and is deflected in response to complementary magnetic fields induced in the cantilever and in an adjacent electrode. The nanomechanical switch can be fabricated using well known semiconductor fabrication techniques, although semiconductor materials are not necessary for fabrication. The switch can rely upon physical contact between the cantilever and the adjacent electrode for current flow, or can rely upon sufficient proximity between the cantilever and the adjacent electrode to allow for tunneling current flow.
Abstract:
The present invention discloses a method for fabricating a non-volatile memory structure from a single layer of polysilicon in a semiconductor substrate, wherein the semiconductor substrate with two active areas, first and second, are divided by isolation regions. In accordance with this method, a doped buried layer is formed in the first active area. Then, a first floating gate is formed on the buried layer and a second floating gate is formed on the second active area from the single layer of polysilicon. Next, two doped regions are formed at opposite sides of the second floating gate in the second active areas. Finally, a floating gate connection line is employed to connect the first and second floating gate for making sure that the two floating gates are in the same potential.
Abstract:
A semiconductor device with a semiconductor body (1) provided with a memory capacitor (12, 26) with a lower electrode (11, 23) consisting of a layer of semiconductor material (7, 23) having a rough surface (8, 24) formed by hemispherical grains (9, 25) of the relevant semiconductor material on which a dielectric layer (12, 27) and an upper electrode (13, 28) are provided. The semiconductor material from which the lower electrode is manufactured is Si1−xGex, wherein 0.2