Graphene electronics fabrication
    5.
    发明授权
    Graphene electronics fabrication 有权
    石墨烯电子制造

    公开(公告)号:US08193455B2

    公开(公告)日:2012-06-05

    申请号:US12345760

    申请日:2008-12-30

    IPC分类号: E21B10/64 E21B10/66

    摘要: An electrical circuit structure employing graphene as a charge carrier transport layer. The structure includes a plurality of graphene layers. Electrical contact is made with one of the layer of the plurality of graphene layers, so that charge carriers travel only through that one layer. By constructing the active graphene layer within or on a plurality of graphene layers, the active graphene layer maintains the necessary planarity and crystalline integrity to ensure that the high charge carrier mobility properties of the active graphene layer remain intact.

    摘要翻译: 使用石墨烯作为电荷载流子传输层的电路结构。 该结构包括多个石墨烯层。 电接触由多个石墨烯层中的一个层制成,使得电荷载流子仅行进该层。 通过在多个石墨烯层之内或之上构建活性石墨烯层,活性石墨烯层保持必要的平面性和晶体完整性,以确保活性石墨烯层的高电荷载流子迁移率性质保持不变。

    LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号:US20120007043A1

    公开(公告)日:2012-01-12

    申请号:US13237449

    申请日:2011-09-20

    IPC分类号: H01L33/04

    摘要: A light-emitting device includes an n-type silicon thin film (2), a silicon thin film (3), and a p-type silicon thin film (4). The silicon thin film (3) is formed on the n-type silicon thin film (2) and the p-type silicon thin film (4) is formed on the silicon thin film (3). The n-type silicon thin film (2), the silicon thin film (3), and the p-type silicon thin film (4) form a pin junction. The n-type silicon thin film (2) includes a plurality of quantum dots (21) composed of n-type Si. The silicon thin film (3) includes a plurality of quantum dots (31) composed of p-type Si. The p-type silicon thin film (4) includes a plurality of quantum dots (41) composed of p-type Si. Electrons are injected from the n-type silicon thin film (2) side and holes are injected from the p-type silicon thin film (4) side, whereby light is emitted at a silicon nitride film (3).

    摘要翻译: 发光装置包括n型硅薄膜(2),硅薄膜(3)和p型硅薄膜(4)。 在n型硅薄膜(2)上形成硅薄膜(3),在硅薄膜(3)上形成p型硅薄膜(4)。 n型硅薄膜(2),硅薄膜(3)和p型硅薄膜(4)形成pin结。 n型硅薄膜(2)包括由n型Si构成的多个量子点(21)。 硅薄膜(3)包括由p型Si构成的多个量子点(31)。 p型硅薄膜(4)包括由p型Si构成的多个量子点(41)。 从n型硅薄膜(2)侧注入电子,从p型硅薄膜(4)侧注入空穴,在氮化硅膜(3)发光。