公开(公告)号：US3698078A

公开(公告)日：1972-10-17

申请号：US3698078D

申请日：1969-12-22

申请人： GEN ELECTRIC

发明人： REDINGTON ROWLAND W

IPC分类号： H01J29/45 ,  H01L27/00 ,  B01J17/00 ,  H01L5/00

CPC分类号： H01J29/453 ,  H01J9/233 ,  H01L27/00 ,  Y10S148/026 ,  Y10S148/049 ,  Y10S148/051 ,  Y10S148/052 ,  Y10S148/06 ,  Y10S148/103 ,  Y10S148/106 ,  Y10S148/114 ,  Y10S148/118 ,  Y10S148/141 ,  Y10S148/151

摘要： A self-registered diode array camera tube target is formed utilizing a refractory metal grid as a mask both during etching of the insulating layer protecting the semiconductive substrate from electron beam irradiation and during diffusion of the monolithic diode array into the substrate. The refractory metal grid thus completely overlies the insulating layer between adjacent diodes of the target and, upon the application of a suitable electrical bias to the grid, the landing characteristics of the electron beam upon the target is controlled to inhibit charging of the insulating layer by the scanning beam. A dual grid camera tube target also is disclosed wherein the outermost grid controls the electron beam landing profile while a more positively biased inner grid remote from the electron beam negates the generation of conductivity producing charge carriers at the substrate-insulating layer interface.

摘要翻译： 在绝缘层的蚀刻期间，在保护半导体衬底免受电子束照射和在单片二极管阵列扩散到衬底期间，利用难熔金属网格作为掩模形成自我注册的二极管阵列相机管目标。 因此，难熔金属网格完全覆盖在目标的相邻二极管之间的绝缘层上，并且当对电网施加合适的电偏压时，电子束对靶的着陆特性被控制，以阻止绝缘层的充电 扫描光束。 还公开了一种双栅相机管目标，其中最外面的栅格控制电子束着陆轮廓，而偏离电子束的更正偏置的内栅格消除了在衬底绝缘层界面处产生导电性的电荷载流子的产生。

公开(公告)号：US3494809A

公开(公告)日：1970-02-10

申请号：US3494809D

申请日：1967-06-05

申请人： HONEYWELL INC

发明人： ROSS CARL A

IPC分类号： H01L21/033 ,  H01L21/318 ,  H01L21/82 ,  H01L7/44 ,  H01L7/36

CPC分类号： H01L21/3185 ,  H01L21/033 ,  H01L21/82 ,  Y10S148/007 ,  Y10S148/017 ,  Y10S148/037 ,  Y10S148/043 ,  Y10S148/05 ,  Y10S148/052 ,  Y10S148/085 ,  Y10S148/114

公开(公告)号：US3475362A

公开(公告)日：1969-10-28

申请号：US3475362D

申请日：1968-05-07

申请人： PPG INDUSTRIES INC

发明人： ROMANICK JOHN F ,  PRUIKSMA ARTHUR B

IPC分类号： C09J121/00 ,  C08G8/28 ,  C08L13/00 ,  C08L45/00 ,  C09J111/00 ,  C09J113/00 ,  C09J123/22 ,  C09J161/06 ,  H01L21/00 ,  H01L33/00 ,  H01S5/30 ,  C08D9/10

CPC分类号： H01S5/30 ,  C08L13/00 ,  C08L45/00 ,  C08L2666/02 ,  C09J111/00 ,  C09J113/00 ,  C09J123/22 ,  C09J161/06 ,  H01L21/00 ,  H01L33/00 ,  Y10S148/018 ,  Y10S148/02 ,  Y10S148/048 ,  Y10S148/049 ,  Y10S148/052 ,  Y10S148/059 ,  Y10S148/067 ,  Y10S148/072 ,  Y10S148/142 ,  Y10S148/15 ,  Y10S438/967

摘要： 1,137,046. Adhesives based on carboxylated rubber. PITTSBURGH PLATE GLASS CO. 12 Sept., 1967 [13 Sept., 1966 (3)], No. 41585/67. Heading C3P. An adhesive composition comprises:- (1) 100 parts by weight of one or more rubbery diene addition polymers having an average molecular weight of at least 30,000 and containing a total of 0À00025-0À12 carboxyl equivalents/100 grams; (2) From 0À1-80 parts by weight of a metal of Group IA, IIA, IIB or IVA of the Periodic Table in the form of an organic solvent-soluble metalorganic resin; and (3) 50-450 parts by weight of an organic solvent-soluble resin compatible with (1). Ingredient (1) is preferably a carboxylated polybutadiene or butadiene-styrene copolymer. The rubber may also be a mixture of carboxylated and non-carboxylated polymers. The resin (2) may be an oil-soluble heat-hardenable phenol-formaldehyde resin or a rosin acid and the metal may be lithium, sodium, magnesium, calcium, barium, zinc or lead. Resin (3) is suitably a poly-#-pinene or an ethylene glycol ester of polymerized rosin. The compositions may contain filler and a small amount of solvent for use as mastics or dissolved in solvents for brushing and spraying. Ingredients (1) and (2) may be reacted together by masticating at high temperatures. Additionally part or all of resin (3) can be constituted by " excess " resin (2)

公开(公告)号：US3466256A

公开(公告)日：1969-09-09

申请号：US3466256D

申请日：1968-05-07

申请人： PPG INDUSTRIES INC

发明人： ROMANICK JOHN F ,  PRUIKSMA ARTHUR B

IPC分类号： C09J121/00 ,  C08G8/28 ,  C08L13/00 ,  C08L45/00 ,  C09J111/00 ,  C09J113/00 ,  C09J123/22 ,  C09J161/06 ,  H01L21/00 ,  H01L33/00 ,  H01S5/30 ,  C08D9/10 ,  C09J3/12

CPC分类号： H01S5/30 ,  C08L13/00 ,  C08L45/00 ,  C08L2666/02 ,  C09J111/00 ,  C09J113/00 ,  C09J123/22 ,  C09J161/06 ,  H01L21/00 ,  H01L33/00 ,  Y10S148/018 ,  Y10S148/02 ,  Y10S148/048 ,  Y10S148/049 ,  Y10S148/052 ,  Y10S148/059 ,  Y10S148/067 ,  Y10S148/072 ,  Y10S148/142 ,  Y10S148/15 ,  Y10S438/967

摘要： 1,137,046. Adhesives based on carboxylated rubber. PITTSBURGH PLATE GLASS CO. 12 Sept., 1967 [13 Sept., 1966 (3)], No. 41585/67. Heading C3P. An adhesive composition comprises:- (1) 100 parts by weight of one or more rubbery diene addition polymers having an average molecular weight of at least 30,000 and containing a total of 0À00025-0À12 carboxyl equivalents/100 grams; (2) From 0À1-80 parts by weight of a metal of Group IA, IIA, IIB or IVA of the Periodic Table in the form of an organic solvent-soluble metalorganic resin; and (3) 50-450 parts by weight of an organic solvent-soluble resin compatible with (1). Ingredient (1) is preferably a carboxylated polybutadiene or butadiene-styrene copolymer. The rubber may also be a mixture of carboxylated and non-carboxylated polymers. The resin (2) may be an oil-soluble heat-hardenable phenol-formaldehyde resin or a rosin acid and the metal may be lithium, sodium, magnesium, calcium, barium, zinc or lead. Resin (3) is suitably a poly-#-pinene or an ethylene glycol ester of polymerized rosin. The compositions may contain filler and a small amount of solvent for use as mastics or dissolved in solvents for brushing and spraying. Ingredients (1) and (2) may be reacted together by masticating at high temperatures. Additionally part or all of resin (3) can be constituted by " excess " resin (2)

公开(公告)号：US3392069A

公开(公告)日：1968-07-09

申请号：US38223064

申请日：1964-07-13

申请人： SIEMENS AG

发明人： HANS MERKEL ,  SIEGFRIED LEIBENZEDER

IPC分类号： C30B25/02 ,  H01L21/00 ,  H01L21/205 ,  H01L21/3065

CPC分类号： C30B29/06 ,  C30B25/02 ,  H01L21/00 ,  H01L21/3065 ,  Y10S117/913 ,  Y10S148/016 ,  Y10S148/051 ,  Y10S148/052 ,  Y10S148/054 ,  Y10S257/912

公开(公告)号：US3290181A

公开(公告)日：1966-12-06

申请号：US38625864

申请日：1964-07-30

申请人： SIEMENS AG

发明人： ERHARD SIRTL

IPC分类号： C01B31/30 ,  C01B31/36 ,  C01B33/02 ,  C01G1/12 ,  C22C1/00 ,  H01L21/00

CPC分类号： C01B33/02 ,  C01B32/90 ,  C01B32/956 ,  C01G1/12 ,  C22C1/007 ,  H01L21/00 ,  Y10S148/052 ,  Y10S148/135 ,  Y10S438/933

公开(公告)号：US5693577A

公开(公告)日：1997-12-02

申请号：US632032

申请日：1996-04-12

申请人： William R. Krenik ,  Mark Appleton

发明人： William R. Krenik ,  Mark Appleton

IPC分类号： G01N27/12 ,  H01L21/22

CPC分类号： G01N27/12 ,  Y10S148/035 ,  Y10S148/052

摘要： A sensor 20 is formed on semiconductor substrate 22. Dielectric layers 23 and 24 are formed on the face and backside of substrate 22, respectively. Metal leads 26 and 28 contact the substrate through openings in the dielectric layer 23. The leads 26 and 28 are also connected to the set of interleaved longitudinal contact fingers 27 and 29. Additionally, a pair of backside contacts 30 and 32 are formed on the dielectric layer 24. The backside contact 30 is in contact only with the metal lead 26 through a conductive region 34.

摘要翻译： 传感器20形成在半导体衬底22上。电介质层23和24分别形成在衬底22的表面和背面上。 金属引线26和28通过介质层23中的开口接触基板。引线26和28也连接到一组交错的纵向接触指27和29.另外，一对背侧触点30和32形成在 电介质层24.背面触点30仅通过导电区域34与金属引线26接触。

公开(公告)号：US3783009A

公开(公告)日：1974-01-01

申请号：US3783009D

申请日：1971-02-22

申请人： AIR REDUCTION

发明人： TRAMPOSCH R

IPC分类号： H01L21/00 ,  H01L21/205 ,  B44D1/02

CPC分类号： H01L21/0242 ,  H01L21/00 ,  H01L21/0245 ,  H01L21/02532 ,  H01L21/02617 ,  Y10S148/006 ,  Y10S148/007 ,  Y10S148/025 ,  Y10S148/049 ,  Y10S148/052 ,  Y10S148/072 ,  Y10S148/15 ,  Y10S428/938 ,  Y10T428/12528 ,  Y10T428/12611 ,  Y10T428/12674

摘要： A METHOD FOR IMPROVING THE CRYSTALLINE PERFECTION OF EPITAXIAL FILMS OF GERMANIUM IS SET FORTH, WHICH IS PARTICULARLY APPLICABLE TO FORMING A DEVICE-QUALITY LAYER ON A FOEIGN SUBSTRATE. IN THIS LATTER ENVIRONMENT, THE PROCESS IS CARRIED OUT BY VAPOR DEPOSITING ON THE FOREIGN SUBSTRATE A GERMANIUM SINGLE CRYSTAL BASE FILM AT TEMPERATURES IN THE RANGE OF 800*C. TO 825*C., EPITAXIALLY VAPOR DEPOSITING A BUFFER GERMANIUM LAYER ON SAID BASE FILM AT TEMPERATURES IN THE RANGE 340*C TO 360*., AND THEREAFTER EPITAXIALY DEPOSITING A LAYER OF GERMANIUM AT A HIGHER TEMPERATURE RANGE OF 700*C. AND ABOVE.

公开(公告)号：US3725135A

公开(公告)日：1973-04-03

申请号：US3725135D

申请日：1968-10-09

申请人： HONEYWELL INC

发明人： HAGER R ,  HITCHELL M ,  TUFTE O

IPC分类号： H01L31/18 ,  H01L3/20

CPC分类号： H01L31/1832 ,  Y10S117/906 ,  Y10S148/052 ,  Y10S438/909

摘要： An isothermal process for preparing epitaxial layers of Hg1 xCdxTe in an excess mercury vapor environment. In a preferred embodiment the process provides layers having a predetermined x value within the Hg1 xCdxTe alloy system by the selection of a predetermined mercury vapor pressure during processing.

摘要翻译： 在过量汞蒸汽环境中制备Hg1-xCdxTe外延层的等温工艺。 在优选实施方案中，该方法通过在处理期间选择预定的水银蒸汽压力来提供在Hg1-xCdxTe合金系统内具有预定x值的层。

公开(公告)号：US3508836A

公开(公告)日：1970-04-28

申请号：US3508836D

申请日：1965-05-04

申请人： BARNES ENG CO

发明人： POLCHLOPEK STANLEY E ,  HARRIS ROBERT L

IPC分类号： G01N1/00 ,  G01N21/03 ,  G01N21/35 ,  G01N21/55 ,  G01N1/10 ,  C23C13/08

CPC分类号： G01N21/03 ,  G01N1/22 ,  G01N21/3577 ,  Y10S148/052