Method of uniformly diffusing impurities into semiconductor wafers
    1.
    发明授权
    Method of uniformly diffusing impurities into semiconductor wafers 失效
    将杂质均匀地扩散到半导体晶片的方法

    公开(公告)号:US5401686A

    公开(公告)日:1995-03-28

    申请号:US909600

    申请日:1992-07-07

    申请人: Hiromi Kiyose

    发明人: Hiromi Kiyose

    摘要: The temperature of the front heater is set to a higher value than the set temperature of the center heater and the temperature of the rear heater is set to a lower value than the set temperature of the center heater to thereby provide such a temperature gradient that the temperature of a center heater region gradually rises from the rear side toward the front side and the impurity diffusion is accelerated under the temperature gradient, whereby it is possible to compensate for the decrease in the quantity of the diffused impurity caused by the lowering of the impurity concentration of the impurity gas gradually from the rear side toward the front side, so that the impurity is uniformly diffused into the wafers located in the core pipe.

    摘要翻译: 前加热器的温度被设定为比中心加热器的设定温度更高的值,并且后加热器的温度被设定为比中心加热器的设定温度低的值,从而提供这样的温度梯度,使得 中心加热器区域的温度从后侧朝向前侧逐渐上升,并且在温度梯度下杂质扩散加速,由此可以补偿由于杂质的降低引起的扩散杂质的量的减少 杂质气体从后侧朝向前侧逐渐浓缩,从而杂质均匀地扩散到位于芯管中的晶片中。

    Method of manufacturing semiconductor device
    2.
    发明授权
    Method of manufacturing semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US4125426A

    公开(公告)日:1978-11-14

    申请号:US825763

    申请日:1977-08-18

    摘要: A simplified method of manufacturing a semiconductor device is disclosed wherein a base region is formed on a silicon substrate and an impurity is diffused into the base region. Any insulating film present on the silcon substrate is removed, substrate and an even film of silicon dioxide is coated thereon. Emitter diffusion windows, base electrode windows, collector electrode windows and resistor electrode windows are formed in the silicon dioxide film and a uniform film of polycrystal silicon is deposited over the silicon dioxide film and the electrode windows. Impurities are diffused through the polycrystal silicon film at the emitter and collector windows but not through the base window. An aluminum electrode layer is formed on the polycrystal silicon layer and patterned to form an electrode wiring pattern. Subsequently, the polysilicon layer is removed in exposed areas utilizing the aluminum electrode layer as a mask.

    摘要翻译: 公开了一种制造半导体器件的简化方法,其中在硅衬底上形成基极区域,并且杂质扩散到基极区域中。 去除存在于硅氧烷衬底上的任何绝缘膜,将基底和均匀的二氧化硅膜涂覆在其上。 在二氧化硅膜中形成发射极扩散窗,基极窗,集电极电极窗和电阻电极窗,并在二氧化硅膜和电极窗上沉积均匀的多晶硅膜。 杂质通过多晶硅膜在发射极和收集器窗口扩散,但不通过基底窗口扩散。 在多晶硅层上形成铝电极层并图案化以形成电极布线图案。 随后,利用铝电极层作为掩模,在曝光区域中去除多晶硅层。

    Semiconductor device having a lateral transistor
    4.
    发明授权
    Semiconductor device having a lateral transistor 失效
    具有横向晶体管的半导体器件

    公开(公告)号:US3667006A

    公开(公告)日:1972-05-30

    申请号:US3667006D

    申请日:1970-02-19

    申请人: PHILIPS CORP

    摘要: The invention relates to a semiconductor device having a substrate of the one conductivity type on which an epitaxial layer divided into islands of the opposite conductivity type is provided and in which at least one island comprises a lateral transistor and a buried layer of the opposite conductivity type. In order to obtain both a small vertical emitter injection and a high collector-base breakdown voltage, the emitter zone has a larger thickness than the collector zone and, in contrast with the collector zone, the emitter zone reaches up to the buried layer. No additional manufacturing step is necessary for the manufacture.

    摘要翻译: 本发明涉及一种具有一种导电类型的衬底的半导体器件,在该衬底上设置有分为相反导电类型的岛的外延层,其中至少一个岛包括横向晶体管和相反导电类型的掩埋层 。 为了获得小的垂直发射体注入和高的集电极 - 基极击穿电压,发射极区域具有比集电极区域更大的厚度,并且与集电极区域相反,发射极区域直到埋层。 不需要额外的制造步骤来制造。

    Method of making a bipolar transistor with double diffused isolation
regions
    6.
    发明授权
    Method of making a bipolar transistor with double diffused isolation regions 失效
    制造具有双扩散隔离区域的双极晶体管的方法

    公开(公告)号:US4780425A

    公开(公告)日:1988-10-25

    申请号:US119668

    申请日:1987-11-12

    申请人: Teruo Tabata

    发明人: Teruo Tabata

    摘要: The present invention relates to a semiconductor device and a method of producing the same. According to this method, a lower diffusion layer of a double isolation diffusion area is attached to a surface of a substrate, an epitaxial layer being formed on the lower diffusion layer, the lower diffusion layer being largely outdiffused upwardly in the epitaxial layer and simultaneously an element diffusion area being deeply diffused from a surface of the epitaxial layer, and then an upper diffusion layer of the double isolation diffusion area being shallowly diffused from the surface of the epitaxial layer. Thus, the lateral expansion of the upper diffusion layer of the double isolation diffusion area can be suppressed and the integrated extent can be improved. On the other hand, in a semiconductor device of the present invention, the above described double isolation diffusion area is formed and a collector area, a base area and an emitter area are formed all over the width of the epitaxial layer (the base area and the emitter area are formed by a double diffusion). In addition, it includes a vertical type transistor whose fluctuation of a width of the base area is reduced, so that the transition frequency f.sub.T and current gain h.sub.FE of this transistor are increased.

    摘要翻译: 半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法。 根据该方法,将双重隔离扩散区域的下部扩散层附着在基板的表面,外延层形成在下部扩散层上,下部扩散层在外延层中大大向外扩散,同时 元件扩散区域从外延层的表面深度扩散,然后双重隔离扩散区域的上扩散层从外延层的表面浅扩散。 因此,可以抑制双重隔离扩散区域的上扩散层的横向膨胀,并且可以提高一体化程度。 另一方面,在本发明的半导体装置中,形成上述双重隔离扩散区域,并且在外延层的整个宽度(基底面积和宽度)上形成集电极区域,基极区域和发射极区域 发射极区域由双扩散形成)。 此外,它包括垂直型晶体管,其基极区域的宽度的波动减小,使得该晶体管的跃迁频率fT和电流增益hFE增加。

    Method of manufacturing an integrated circuit having a transistor isolated by the collector region
    9.
    发明授权
    Method of manufacturing an integrated circuit having a transistor isolated by the collector region 失效
    制造集电区隔离晶体管的集成电路的方法

    公开(公告)号:US3735481A

    公开(公告)日:1973-05-29

    申请号:US3735481D

    申请日:1971-02-25

    申请人: HITACHI LTD

    发明人: MAKIMOTO T

    摘要: A method of manufacturing a semiconductor integrated circuit in which a P type semiconductor layer is epitaxially grown in the surface of a P type semiconductor substrate containing N buried layers therein, the P type layer is divided into a plurality of electrically isolated portions by N type regions which are formed by diffusing a donor impurity into the surface of said P type semiconductor layer towards the N type buried layers, the divided P type semiconductor portions forming individually diodes and transistors with the N type regions connected to said buried layers as their structural elements.

    摘要翻译: 一种制造半导体集成电路的方法,其中P型半导体层在其中包含N +掩埋层的P型半导体衬底的表面中外延生长,P型层被分成多个电隔离部分 N +型区域,其通过将施主杂质扩散到所述P型半导体层的表面朝向N +型掩埋层而形成,分割的P型半导体部分分别形成二极管和具有N + 连接到所述埋层的类型区域作为其结构元件。

    Method of forming improved contacts from polysilicon to siliconor other
polysilicon layers
    10.
    发明授权
    Method of forming improved contacts from polysilicon to siliconor other polysilicon layers 失效
    形成从多晶硅到其它多晶硅层的改善的接触的方法

    公开(公告)号:US5801087A

    公开(公告)日:1998-09-01

    申请号:US582310

    申请日:1996-01-03

    摘要: The method of the present invention introduces a method of forming conductively doped contacts on a supporting substrate in a semiconductor device that minimizes the lateral out-diffusion of the conductive dopants and also provides for a low resistive contact by the steps of: preparing a conductive area to accept contact formation; forming a phosphorus insitu doped polysilicon layer over the conductive area; forming an arsenic insitu doped polysilicon layer over the phosphorus insitu doped polysilicon layer, wherein the two insitu doped polysilicon layers are deposited one after another in separate deposition steps; and annealing the layers at a temperature range of approximately 900.degree.-1100.degree. C. thereby, resulting in sufficient thermal treatment to allow phosphorus atoms to break up a first interfacial silicon dioxide layer formed between the conductive area and the phosphorus insitu doped polysilicon layer.

    摘要翻译: 本发明的方法引入了一种在半导体器件中的支撑衬底上形成导电掺杂触点的方法,其使导电掺杂剂的侧向向外扩散最小化,并且还通过以下步骤提供低电阻接触:制备导电区域 接受接触形成; 在所述导电区域上形成磷原位掺杂多晶硅层; 在磷原位掺杂多晶硅层上形成砷原位掺杂的多晶硅层,其中两个本征掺杂的多晶硅层在不同的沉积步骤中依次沉积; 并在约900℃-1100℃的温度范围内对层进行退火,从而进行足够的热处理以使磷原子分解形成在导电区域和磷原位掺杂多晶硅层之间的第一界面二氧化硅层。