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公开(公告)号:US12095447B1
公开(公告)日:2024-09-17
申请号:US16591717
申请日:2019-10-03
申请人: SiTime Corporation
发明人: Charles I. Grosjean , Ginel C. Hill , Paul M. Hagelin , Renata Melamud Berger , Aaron Partridge , Markus Lutz
CPC分类号: H03H9/2457 , B81C1/0069 , H03H3/0072 , H03H3/0076 , H03H9/1057 , B81C2201/0164 , B81C2201/0171
摘要: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.
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公开(公告)号:US20240154598A1
公开(公告)日:2024-05-09
申请号:US18550628
申请日:2022-03-10
发明人: Guoqiang WU , Wen CHEN , Jinzhao HAN , Zhihong FENG
CPC分类号: H03H9/02433 , H03H3/0072 , H03H9/1057 , H03H9/2463 , H03B5/32
摘要: The present disclosure relates to a micro electro mechanical system (MEMS) resonator. An example MEMS resonator includes a substrate, a barrier layer, a conducting layer, a dielectric isolation layer, a harmonic oscillator, a first electrical isolation structure, and a first conducting structure. The substrate and the barrier layer are combined to form a cavity, and a junction between the substrate and the barrier layer includes the conducting layer. The dielectric isolation layer is included between the conducting layer and the barrier layer. The harmonic oscillator is connected to the conducting layer and is suspended in the cavity. The conducting layer is connected to a first conducting structure that is outside the barrier layer, and a first electrical isolation structure is included between the first conducting structure and the barrier layer. The barrier layer and the dielectric isolation layer are configured to isolate the first electrical isolation structure from the cavity.
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公开(公告)号:US20230231538A1
公开(公告)日:2023-07-20
申请号:US18002391
申请日:2021-07-01
申请人: KYOCERA Tikitin Oy
发明人: Aarne OJA
CPC分类号: H03H9/2452 , H03H3/0072 , H03H9/02393
摘要: A MEMS (microelectromechanical system) resonator includes a first layer of single-crystalline silicon, a second layer of single-crystalline silicon, and a piezoelectric layer in between said first layer of single-crystalline silicon and the second layer of single-crystalline silicon. A manufacturing method of the MEMS resonator includes at least one of the interfaces between the single-crystalline silicon layers and the piezoelectric layer be made by wafer bonding.
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公开(公告)号:US20180248533A1
公开(公告)日:2018-08-30
申请号:US15966733
申请日:2018-04-30
申请人: Robert Bosch GmbH
发明人: Markus Lutz , Aaron Partridge
CPC分类号: H03H3/0072 , H03H3/0076 , H03H3/0077 , H03H9/2447 , H03H9/2457 , H03H9/2463 , H03H2009/02299 , H03H2009/0233 , H03H2009/02496 , Y10T29/49016
摘要: A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.
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公开(公告)号:US20180248532A1
公开(公告)日:2018-08-30
申请号:US15966644
申请日:2018-04-30
申请人: Robert Bosch GmbH
发明人: Markus Lutz , Aaron Partridge
CPC分类号: H03H3/0072 , H03H3/0076 , H03H3/0077 , H03H9/2447 , H03H9/2457 , H03H9/2463 , H03H2009/02299 , H03H2009/0233 , H03H2009/02496 , Y10T29/49016
摘要: A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.
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公开(公告)号:US20180219529A1
公开(公告)日:2018-08-02
申请号:US15872265
申请日:2018-01-16
CPC分类号: H03H9/205 , B81B3/0086 , B81B2201/0271 , B81B2207/07 , H03H3/0072 , H03H3/0075 , H03H9/171 , H03H9/2436 , H03H2009/155 , H03H2009/241
摘要: Micromachined microelectromechanical systems (MEMS) based resonators offer integration with other MEMS devices and electronics. Whilst piezoelectric film bulk acoustic resonators (FBAR) generally exhibit high electromechanical transduction efficiencies and low signal transmission losses they also suffer from low quality factors and limited resonance frequencies. In contrast electrostatic FBARs can yield high quality factors and resonance frequencies but suffer from increased fabrication complexity. lower electromechanical transduction efficiency and significant signal transmission loss. Accordingly, it would be beneficial to overcome these limitations by reducing fabrication complexity via a single metal electrode layer topping the resonator structure and supporting relatively low complexity/low resolution commercial MEMS fabrication processes by removing the fabrication requirement for narrow transduction gaps. Beneficially, embodiments of the invention provide MEMS circuits with electrostatic tuning and provide resonator designs combining the advantages of piezoelectric actuation and bulk-mode resonators.
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公开(公告)号:US09948273B1
公开(公告)日:2018-04-17
申请号:US15387375
申请日:2016-12-21
申请人: SiTime Coporation
CPC分类号: H03H9/02448 , H01L41/22 , H01L41/253 , H02N1/00 , H03B5/30 , H03B5/32 , H03H3/0072 , H03H3/0073 , H03H3/0076 , H03H9/02244 , H03H9/02433 , H03H9/125 , H03H9/21 , H03H9/2405 , H03H9/2468 , H03H9/2484 , H03H2009/02251 , H03H2009/02283 , H03H2009/02291 , H03H2009/02299 , H03H2009/02322 , H03H2009/0233 , H03H2009/02496 , H03H2009/155 , Y10T29/42 , Y10T29/49002 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908
摘要: A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.
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公开(公告)号:US20180083599A1
公开(公告)日:2018-03-22
申请号:US15703704
申请日:2017-09-13
CPC分类号: H03H9/2431 , H03H3/0072 , H03H9/02244 , H03H9/462 , H03H9/505 , H03H2009/02496 , H04B10/506 , H04B10/508 , H04B10/614 , H04B10/63 , H04J14/02 , H04J14/06
摘要: A signal processing apparatus, being configured for transmitting and receiving coherent parallel optical signals, comprises a transmitter apparatus including a first single soliton micro-resonator device and a modulator device, wherein the first single soliton micro-resonator device is adapted for creating a single soliton providing a first frequency comb, wherein the first frequency comb provides a plurality of equidistant optical carriers with a frequency spacing corresponding to a free spectral range of the first single soliton micro-resonator device, and the modulator device is adapted for modulating the optical carriers according to data to be transmitted, and a receiver apparatus including a coherent receiver device with a plurality of coherent receivers and a local oscillator device providing a plurality of reference optical signals, wherein the coherent receiver device and the local oscillator device are arranged for coherently detecting the transmitted modulated optical carriers, wherein the signal processing apparatus further includes at least one second single soliton micro-resonator device having a free spectral range being equal or approximated to the free spectral range of the first single soliton micro-resonator device and being adapted for creating at least one single soliton providing at least one second frequency comb, wherein the at least one second frequency comb provides at least one of additional optical carriers and the reference optical signals. Furthermore, a signal processing method, including transmitting and receiving coherent parallel optical signals via a communication channel is described.
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公开(公告)号:US20170345676A1
公开(公告)日:2017-11-30
申请号:US15440233
申请日:2017-02-23
发明人: Kezia Cheng
IPC分类号: H01L21/48 , H01L21/52 , H01L23/053 , H01L23/66
CPC分类号: H01L23/053 , H01L21/4803 , H01L21/6835 , H01L24/16 , H01L24/32 , H01L24/48 , H01L25/0655 , H01L2221/68318 , H01L2221/68345 , H01L2221/68363 , H01L2221/68381 , H01L2224/04042 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/97 , H01L2924/16251 , H01L2924/1679 , H03H3/0072 , H03H3/02 , H03H3/08 , H03H9/1007 , H03H9/1057 , H03H9/1064 , H01L2224/85 , H01L2224/83 , H01L2224/81
摘要: According to various aspects and embodiments, a system and method for packaging an electronic device is disclosed. One example of the method comprises depositing a layer of temporary bonding material onto a surface of a first substrate, depositing a layer of structure material onto a surface of the layer of temporary bonding material, masking at least a portion of the structure material to define an unmasked portion and a masked portion of the structure material, exposing the unmasked portion of the structure material to a source of light, removing the masked portion of the structure material, bonding at least a portion of a surface of a second substrate to the unmasked portion of the structure material, and removing the first substrate from the unmasked portion of the structure material.
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公开(公告)号:US09800222B2
公开(公告)日:2017-10-24
申请号:US14728805
申请日:2015-06-02
申请人: Robert Bosch GmbH
发明人: Markus Lutz , Aaron Partridge
CPC分类号: H03H3/0072 , H03H3/0076 , H03H3/0077 , H03H9/2447 , H03H9/2457 , H03H9/2463 , H03H2009/02299 , H03H2009/0233 , H03H2009/02496 , Y10T29/49016
摘要: A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.
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