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    Resonator electrode shields
    1.
    发明授权
    Resonator electrode shields 有权
    谐振器电极屏蔽

    公开(公告)号：US08749315B2

    公开(公告)日：2014-06-10

    申请号：US13561862

    申请日：2012-07-30

    Applicant: David Raymond Pedersen ,  Aaron Partridge ,  Thor Juneau

    Inventor： David Raymond Pedersen ,  Aaron Partridge ,  Thor Juneau

    IPC: H03B5/30

    CPC classification number: H03H9/2405 ,  H03H3/0072 ,  H03H9/02259 ,  H03H9/02433 ,  H03H9/2457 ,  H03H9/2468 ,  H03H2009/02456 ,  H03H2009/02496

    Abstract: A MEMS resonator system that reduces interference signals arising from undesired capacitive coupling between different system elements. The system, in one embodiment, includes a MEMS resonator, electrodes, and at least one resonator electrode shield. In certain embodiments, the resonator electrode shield ensures that the resonator electrodes interact with either one or more shunting nodes or the active elements of the MEMS resonator by preventing or reducing, among other things, capacitive coupling between the resonator electrodes and the support and auxiliary elements of the MEMS resonator structure. By reducing the deleterious effects of interfering signals using one or more resonator electrode shields, a simpler, lower interference, and more efficient system relative to prior art approaches is presented.

    Abstract translation: 一种MEMS谐振器系统，其减少由不同系统元件之间的不期望的电容耦合引起的干扰信号。 在一个实施例中，该系统包括MEMS谐振器，电极和至少一个谐振器电极屏蔽。 在某些实施例中，谐振器电极屏蔽件通过防止或减少谐振器电极与支撑和辅助元件之间的电容耦合，确保谐振器电极与一个或多个分流节点或MEMS谐振器的有源元件相互作用 的MEMS谐振器结构。 通过使用一个或多个谐振器电极屏蔽减少干扰信号的有害影响，提出了相对于现有技术方法的更简单，更低干扰和更有效的系统。

    Lever mechanisms for anti-phase mode isolation in MEMS tuning-fork structures
    4.
    发明授权
    Lever mechanisms for anti-phase mode isolation in MEMS tuning-fork structures 有权
    用于MEMS音叉结构中的反相模式隔离的杠杆机构

    公开(公告)号：US09217756B2

    公开(公告)日：2015-12-22

    申请号：US13840362

    申请日：2013-03-15

    Applicant: The Regents of the University of California

    Inventor： Brenton R. Simon ,  Alexander A. Trusov ,  Andrei M. Shkel

    IPC: G01C19/56 ,  G01C19/5621 ,  G01P15/097 ,  H03H9/24 ,  H03H9/02

    CPC classification number: G01P15/097 ,  G01C19/5621 ,  H03H9/2463 ,  H03H9/2468 ,  H03H2009/02496

    Abstract: A MEMS resonator includes two resonating masses having an anti-phase and in-phase resonance mode, each mode having a resonance frequency, and an anti-phase resonance levering system coupled to the two resonating masses to stiffen and/or dampen the in-phase resonance mode while leaving the anti-phase resonance mode compliant. This effectively raises the in-phase resonance frequency above the anti-phase resonance frequency, and potentially creates a large frequency separation between the two resonance modes. This reduces the energy transfer between the two modes, allowing for robustness to external acceleration, because the in-phase mode is of a higher frequency. The anti-phase resonance levering system is disposed between the two resonating masses as an internal levering mechanism, or is disposed around the two resonating masses as an external levering mechanism.

    Abstract translation: MEMS谐振器包括具有反相和同相谐振模式的两个谐振块，每个模式具有谐振频率，以及耦合到两个谐振块的反相谐振杠杆系统以加固和/或抑制同相 同时保持反相谐振模式的兼容性。 这有效地提高了高于反相谐振频率的同相谐振频率，并且潜在地在两个谐振模式之间产生大的频率间隔。 这降低了两种模式之间的能量传递，从而允许对外部加速度的鲁棒性，因为同相模式具有较高的频率。 反相谐振杠杆系统设置在作为内部杠杆机构的两个谐振块之间，或者作为外部杠杆机构设置在两个谐振块周围。

    In-plane mechanically coupled microelectromechanical tuning fork resonators
    5.
    发明授权
    In-plane mechanically coupled microelectromechanical tuning fork resonators 有权
    平面机械耦合微机电音叉谐振器

    公开(公告)号：US07319372B2

    公开(公告)日：2008-01-15

    申请号：US11182299

    申请日：2005-07-15

    Applicant: Zhiyu Pan ,  Rob Norris Candler ,  Markus Lutz ,  Aaron Partridge ,  Volker Materna ,  Gary Yama ,  Wilhelm Frey

    Inventor： Zhiyu Pan ,  Rob Norris Candler ,  Markus Lutz ,  Aaron Partridge ,  Volker Materna ,  Gary Yama ,  Wilhelm Frey

    IPC: H03H9/50 ,  H03H9/21

    CPC classification number: H03H9/505 ,  H03H9/0023 ,  H03H9/02338 ,  H03H9/2468 ,  H03H2009/02496

    Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.

    Abstract translation: 这里描述和示出了许多发明，以及这些发明的许多方面和实施例。 在一个方面，本发明涉及一种包括机械耦合以提供例如差分信号输出的多个平面内振动微机电谐振器（例如，2或4个谐振器）的谐振器结构。 在一个实施例中，本发明包括四个通常形状的微机电音叉谐振器（例如，具有两个或更多个矩形或正方形形状的叉的音叉谐振器）。 每个谐振器机械耦合到该架构的另一谐振器。 例如，该架构的每个谐振器在其中一个侧面的一侧或拐角上机械耦合到另一个谐振器。 以这种方式，所有谐振器在被感应时以相同的频率振动。

    RESONANCE DEVICE AND MANUFACTURING METHOD
    6.
    发明公开
    RESONANCE DEVICE AND MANUFACTURING METHOD 审中-公开

    公开(公告)号：US20230353122A1

    公开(公告)日：2023-11-02

    申请号：US18350987

    申请日：2023-07-12

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Fumiya ENDOU ,  Masakazu FUKUMITSU

    IPC: H03H9/24 ,  H03H9/10 ,  H03H3/02 ,  H03H9/17 ,  H03H9/125

    CPC classification number: H03H9/2468 ,  H03H9/1057 ,  H03H3/02 ,  H03H9/17 ,  H03H9/125

    Abstract: A method of manufacturing a resonance device includes preparing a resonance device and adjusting a frequency of the resonator. The resonance device includes a lower lid, an upper lid joined to the lower lid, and a resonator with vibration arms that vibrate in bending vibration in an interior space between the lower and upper lids. The adjusting of the frequency of the resonator includes vibrating the vibration arms in bending vibration and thereby causing respective ends of the arms to strike the lower lid at an impact speed of 3.5×103 μm/sec or more. The ends of the vibration arms are made of silicon oxide, and the lower lid is made of silicon.

    Resonator electrode shields
    9.
    发明授权
    Resonator electrode shields 有权
    谐振器电极屏蔽

    公开(公告)号：US09252740B1

    公开(公告)日：2016-02-02

    申请号：US14300114

    申请日：2014-06-09

    Applicant: SiTime Corporation

    Inventor： David Raymond Pedersen ,  Aaron Partridge ,  Thor Juneau

    IPC: H03H9/02 ,  H03H9/24

    CPC classification number: H03H9/2405 ,  H03H3/0072 ,  H03H9/02259 ,  H03H9/02433 ,  H03H9/2457 ,  H03H9/2468 ,  H03H2009/02456 ,  H03H2009/02496

    Abstract: A MEMS resonator system that reduces interference signals arising from undesired capacitive coupling between different system elements. The system, in one embodiment, includes a MEMS resonator, electrodes, and at least one resonator electrode shield. In certain embodiments, the resonator electrode shield ensures that the resonator electrodes interact with either one or more shunting nodes or the active elements of the MEMS resonator by preventing or reducing, among other things, capacitive coupling between the resonator electrodes and the support and auxiliary elements of the MEMS resonator structure. By reducing the deleterious effects of interfering signals using one or more resonator electrode shields, a simpler, lower interference, and more efficient system relative to prior art approaches is presented.

    Abstract translation: 一种MEMS谐振器系统，其减少由不同系统元件之间的不期望的电容耦合引起的干扰信号。 在一个实施例中，该系统包括MEMS谐振器，电极和至少一个谐振器电极屏蔽。 在某些实施例中，谐振器电极屏蔽件通过防止或减少谐振器电极与支撑和辅助元件之间的电容耦合，确保谐振器电极与一个或多个分流节点或MEMS谐振器的有源元件相互作用 的MEMS谐振器结构。 通过使用一个或多个谐振器电极屏蔽减少干扰信号的有害影响，提出了相对于现有技术方法的更简单，更低干扰和更有效的系统。

    CAPACITIVE MEMS SENSOR DEVICES
    10.
    发明申请
    CAPACITIVE MEMS SENSOR DEVICES 有权
    电容式MEMS传感器器件

    公开(公告)号：US20140239979A1

    公开(公告)日：2014-08-28

    申请号：US13779160

    申请日：2013-02-27

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： IRA OAKTREE WYGANT ,  PETER B. JOHNSON

    IPC: G01R27/26

    CPC classification number: G01P15/125 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/036 ,  H02N1/006 ,  H03H3/0072 ,  H03H9/1057 ,  H03H9/2468 ,  H03H9/2489 ,  H04R19/005 ,  Y10T29/49165

    Abstract: A packaged capacitive MEMS sensor device includes at least one capacitive MEMS sensor element with at least one capacitive MEMS sensor cell including a first substrate having a thick and a thin dielectric region. A second substrate with a membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a MEMS cavity. The membrane layer provides a fixed electrode and a released MEMS electrode over the MEMS cavity. A first through-substrate via (TSV) extends through a top side of the MEMS electrode and a second TSV through a top side of the fixed electrode. A metal cap is on top of the first TSV and second TSV. A third substrate including an inner cavity and outer protruding portions framing the inner cavity is bonded to the thick dielectric regions. The third substrate together with the first substrate seals the MEMS electrode.

    Abstract translation: 封装的电容MEMS传感器装置包括至少一个电容式MEMS传感器元件，其具有至少一个电容式MEMS传感器单元，该电容式MEMS传感器单元包括具有厚和薄电介质区域的第一基板 具有膜层的第二衬底被结合到厚电介质区域和薄介电区域上以提供MEMS空腔。 膜层在MEMS腔体上提供固定电极和释放的MEMS电极。 第一穿通基板通孔（TSV）延伸穿过MEMS电极的顶侧，通过固定电极的顶侧延伸穿过第二TSV。 金属帽位于第一TSV和第二TSV的顶部。 包括内腔和构成内腔的外突出部分的第三基板被接合到厚电介质区域。 第三衬底与第一衬底一起密封MEMS电极。

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