公开(公告)号：US20120067131A1

公开(公告)日：2012-03-22

申请号：US13258564

申请日：2010-03-12

Applicant: Thomas Moelkner ,  Wilhelm Frey

Inventor： Thomas Moelkner ,  Wilhelm Frey

IPC: G01L7/08

CPC classification number: G01L19/147 ,  G01L19/0672

Abstract: A construction concept for high-pressure sensors is provided, enabling simple and economical manufacture of reliable high-pressure sensors even for pressure ranges above 2200 bar. A high-pressure sensor of this kind encompasses a sensor element for pressure sensing and a connector piece for coupling the sensor element to a measured system, a diaphragm being embodied over a blind opening in the base element of the sensor element, a pressure conduit being embodied in the base element of the connector piece, and the sensor element being mounted on the connector piece in such a way that the diaphragm can be impinged upon, through the pressure conduit that opens into the blind opening, by a measured pressure. The blind opening in the base element of the sensor element is embodied, at least in one portion, in a manner tapering conically toward the diaphragm, and that end of the pressure conduit which faces toward the sensor element is tubular in shape. This tubular end of the pressure conduit is pressed into the blind opening so that the tube wall is pressed, at least in a circumferential region, sealingly against the side wall of the blind opening.

Abstract translation: 提供了一种高压传感器的结构概念，即使在2200 bar以上的压力范围内，也能实现可靠的高压传感器的简单经济的制造。 这种高压传感器包括用于压力检测的传感器元件和用于将传感器元件耦合到测量系统的连接器部件，隔膜被实施在传感器元件的基座元件中的盲孔上，压力导管 实施在连接器件的基座元件中，并且传感器元件以这样的方式安装在连接器片上，使得隔膜可以通过测量的压力撞击穿过通向盲孔的压力管道。 传感器元件的基部元件中的盲孔至少在一部分中以朝向隔膜的锥形锥形的方式被实施，并且面向传感器元件的压力导管的端部是管状的。 压力导管的该管状端部被压入盲孔中，使得管壁至少在周向区域中被密封地压靠在盲孔的侧壁上。

公开(公告)号：US07922849B2

公开(公告)日：2011-04-12

申请号：US11430267

申请日：2006-05-08

Applicant: Sebastian Sommer ,  Wilhelm Frey

Inventor： Sebastian Sommer ,  Wilhelm Frey

IPC: D04H3/14 ,  D01D5/22

CPC classification number: D04H3/005 ,  D04H3/02 ,  D04H3/14 ,  D04H3/147 ,  D04H3/16

Abstract: Process of manufacturing spun-bonded fabric, using naturally crimped filaments, whereby the filaments are passed through a stretching unit and finally through a diffusor. The filaments are thereupon layered on a layering device, as crimped filaments. The layered filaments together with the layering device are passed through a solidifying device in which the filaments are solidified by means of a fluid.

Abstract translation: 使用天然卷曲丝制造纺粘织物的方法，由此使细丝通过拉伸单元，最后通过扩散器。 然后将细丝层叠在分层装置上，如卷曲的长丝。 层叠的细丝与层叠装置一起通过固化装置，其中细丝通过流体固化。

公开(公告)号：US20090065928A1

公开(公告)日：2009-03-12

申请号：US12264774

申请日：2008-11-04

Applicant: Markus Lutz ,  Aaron Partidge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

Inventor： Markus Lutz ,  Aaron Partidge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

IPC: H01L23/12

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

Abstract translation: 机械结构设置在室中，其至少一部分由封装结构限定。 第一种方法提供了通道盖，其具有至少部分地设置在防静电通道的上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。 第二种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 该至少一个部分与机电装置分开制造，然后固定在机电装置上。 第三种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。 所述至少一个部分可以包括线球，螺柱，金属箔或焊料预制件。 一种器件包括衬底，封装结构和机械结构。 抗静电层设置在机械结构的至少一部分上。 在基板和封装结构中的至少一个中形成抗静电通道。 帽至少部分地具有设置在抗静电通道上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。

公开(公告)号：US07176540B2

公开(公告)日：2007-02-13

申请号：US10817346

申请日：2004-04-02

Applicant: Wilhelm Frey ,  Christoph Duenn

Inventor： Wilhelm Frey ,  Christoph Duenn

IPC: H01L21/00

CPC classification number: B81B3/0072

Abstract: A method for producing micromechanical structures, in which a functional layer is deposited onto a sacrificial layer, and the sacrificial layer is removed again for the production of at least one mechanical functional element, which is characterized by a surface barrier layer, with which the functional layer begins on the sacrificial layer, and which has a different state from the remaining functional layer, is also removed at least to a considerable part, or, on the functional layer, one layer or a plurality of layers having at least approximately the same properties with respect to stress in the layer or layers such as the surface barrier layer is (are) applied. Additionally, a micromechanical structure having a functional layer in which the functional layer is constructed in such a way that the stresses are neutralized or no stress gradient appears.

Abstract translation: 一种用于生产微机械结构的方法，其中功能层沉积在牺牲层上，并且牺牲层被再次去除以产生至少一个机械功能元件，其特征在于表面阻挡层，功能层 在牺牲层上开始并且与剩余功能层具有不同状态的层在至少相当大的部分也被去除，或者在功能层上，具有至少大致相同性质的一层或多层 相对于施加了表面阻挡层的层或层的应力。 另外，具有功能层的微机械结构，其中功能层被构造成使得应力被中和或没有出现应力梯度。

公开(公告)号：US06901800B2

公开(公告)日：2005-06-07

申请号：US10946404

申请日：2004-09-20

Applicant: Andreas Niendorf ,  Wilhelm Frey ,  Zhiyu Pan

Inventor： Andreas Niendorf ,  Wilhelm Frey ,  Zhiyu Pan

IPC: G01P15/08 ,  G01P15/18 ,  G01Q10/00 ,  G01Q20/04

CPC classification number: G01P15/0894 ,  G01P15/0888 ,  G01P15/18

Abstract: A sensor arrangement for measuring a displacement of a proof mass using a tunneling current includes a proof mass body suspended by micro-mechanical beams to permit a mass body movement, at least one integrated electrode tip arranged to be integrated with the proof mass body, and at least one external electrode tip arranged externally to the proof mass body and suspended by micro-mechanical beams to permit an external electrode movement, the at least one external electrode tip further arranged to be in a close proximity to the at least one integrated electrode tip to permit a flow of the tunneling current between the at least one external electrode tip and the at least one integrated electrode tip, in which the displacement of the proof mass causes a change in the tunneling current.

公开(公告)号：US20050035289A1

公开(公告)日：2005-02-17

申请号：US10946404

申请日：2004-09-20

Applicant: Andreas Niendorf ,  Wilhelm Frey ,  Zhiyu Pan

Inventor： Andreas Niendorf ,  Wilhelm Frey ,  Zhiyu Pan

IPC: G01P15/08 ,  G01P15/18 ,  G01Q10/00 ,  G01Q20/04 ,  H01J37/244 ,  G01B7/14 ,  G01B15/00

CPC classification number: G01P15/0894 ,  G01P15/0888 ,  G01P15/18

Abstract: A sensor arrangement for measuring a displacement of a proof mass using a tunneling current includes a proof mass body suspended by micro-mechanical beams to permit a mass body movement, at least one integrated electrode tip arranged to be integrated with the proof mass body, and at least one external electrode tip arranged externally to the proof mass body and suspended by micro-mechanical beams to permit an external electrode movement, the at least one external electrode tip further arranged to be in a close proximity to the at least one integrated electrode tip to permit a flow of the tunneling current between the at least one external electrode tip and the at least one integrated electrode tip, in which the displacement of the proof mass causes a change in the tunneling current.

公开(公告)号：US06808640B2

公开(公告)日：2004-10-26

申请号：US10077422

申请日：2002-02-14

Applicant: Frank Fischer ,  Wilhelm Frey

Inventor： Frank Fischer ,  Wilhelm Frey

IPC: B81C100

CPC classification number: B81B3/0008 ,  B81B3/0086 ,  B81B2201/0235 ,  B81C2201/112

Abstract: A method for manufacturing a micromechanical part, having a plurality of components that move with respect to one another, from a substrate, with a conductive coating being applied to at least one facing surface of the plurality of components that move with respect to one another.

Abstract translation: 一种用于制造具有多个相对于彼此移动的部件的微机械部件的方法，其中导电涂层被施加到相对于彼此移动的多个部件的至少一个相对表面。

公开(公告)号：US06790699B2

公开(公告)日：2004-09-14

申请号：US10193351

申请日：2002-07-10

Applicant: Heinz-Georg Vossenberg ,  Wilhelm Frey

Inventor： Heinz-Georg Vossenberg ,  Wilhelm Frey

IPC: H01L2100

CPC classification number: B81C1/00801 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81C1/00246 ,  B81C2203/0136 ,  B81C2203/0735

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a substrate, depositing a monocrystalline sacrificial layer onto the substrate, depositing a monocrystalline function layer onto the sacrificial layer, and removing at least part of the sacrificial layer after the function layer depositing step.

Abstract translation: 一种用于制造半导体器件的方法包括以下步骤：提供衬底，在衬底上沉积单晶牺牲层，在牺牲层上沉积单晶功能层，以及在功能层沉积步骤之后移除牺牲层的至少一部分。

公开(公告)号：US06672732B1

公开(公告)日：2004-01-06

申请号：US10070054

申请日：2002-07-17

Applicant: Andreas Niendorf ,  Wilhelm Frey ,  Karsten Funk

Inventor： Andreas Niendorf ,  Wilhelm Frey ,  Karsten Funk

IPC: G02B7182

CPC classification number: G02B26/0841

Abstract: A vibrating microdevice, such as a vibrating micromirror, includes a vibrating structure which is connected to a supporting body via at least one spring structure in an at least a largely floating manner, the spring structure including at least one torsion-spring element defining a torsion axis and permitting a torsional vibration about the torsion axis to be induced in the vibrating structure, the spring structure also including at least one converter structure, which at least partially converts forces acting at least largely perpendicularly to the torsion axis on the torsion spring element into forces acting at least partially parallelly to the torsion axis on the torsion-spring element.

Abstract translation: 振动微型装置，例如振动微镜，包括振动结构，所述振动结构经由至少一个弹簧结构以至少大体上浮动的方式连接到支撑体，所述弹簧结构包括至少一个限定扭转的扭簧元件 所述弹簧结构还包括至少一个转换器结构，所述至少一个转换器结构至少部分地将至少大部分地垂直于所述扭转轴线上的力作用力转换成所述扭转弹簧元件上的扭转轴线 至少部分地平行于扭转弹簧元件上的扭转轴线作用的力。

公开(公告)号：US06655834B1

公开(公告)日：2003-12-02

申请号：US09613131

申请日：2000-07-10

Applicant: Wilhelm Frey ,  Karsten Funk

Inventor： Wilhelm Frey ,  Karsten Funk

IPC: G01K702

CPC classification number: H01L35/32 ,  B81B2201/0278 ,  B81B2203/0127 ,  B81B2207/07 ,  B81C1/00246 ,  B81C2203/0735 ,  G01J5/20

Abstract: A sensor, in particular thermal sensor, having a silicon element and a largely self-supporting membrane layer equipped with at least one sensor element, is proposed. The membrane layer is furthermore spaced away from the silicon element by way of at least one contact column and is at least largely supported thereby. The contact column moreover makes electrical contact to the sensor element. Also proposed is a method for manufacturing a largely self-supporting membrane, a polymer layer first being deposited on a base element, patterned, and equipped with at least one cutout. The cutout is subsequently filled with a filler material, and a membrane layer is applied onto the polymer layer. Lastly, the polymer layer is removed again. The proposed method for manufacturing a largely self-supporting membrane layer is suitable in particular for constructing a sensor, in particular a thermal sensor or a thermal sensor array.

Abstract translation: 提出了一种具有硅元件和大部分自支撑膜层的传感器，特别是热传感器，其具有至少一个传感器元件。 膜层还通过至少一个接触柱与硅元件隔开，并且至少大部分被支撑。 接触柱还与传感器元件电接触。 还提出了一种用于制造大部分自支撑膜的方法，首先沉积在基底元件上的聚合物层被图案化并且装备有至少一个切口。 切口随后填充有填充材料，并且将膜层施加到聚合物层上。 最后，再次除去聚合物层。 所提出的用于制造大部分自支撑膜层的方法特别适用于构造传感器，特别是热传感器或热传感器阵列。