公开(公告)号：US11843364B2

公开(公告)日：2023-12-12

申请号：US17535868

申请日：2021-11-26

Applicant: II-VI Delaware, Inc ,  University of South Florida

Inventor： Wen-Qing Xu ,  Di Lan ,  Jing Wang ,  Weiqi Li ,  Xu Han ,  Chao Liu ,  Elgin Eissler ,  Giovanni Barbarossa

IPC: H03H9/17 ,  H03H9/13 ,  H03H9/02

CPC classification number: H03H9/171 ,  H03H9/02102 ,  H03H9/02228 ,  H03H9/02275 ,  H03H9/02338 ,  H03H9/02448 ,  H03H9/13 ,  H03H9/175

Abstract: An acoustic resonator includes a piezoelectric stack including a piezoelectric layer having a top surface and a bottom surface, a top electrode layer disposed above the top surface, and a bottom electrode layer disposed below the bottom surface. A number of acoustic wave reflectors are disposed on a side of the bottom electrode layer opposite the piezoelectric layer. Each acoustic wave reflector includes a high acoustic impedance layer and may include a low acoustic impedance layer. The acoustic resonator may include a tether that extends laterally to a stacking direction of the layers of the piezoelectric stack. A supporting structure may be coupled to the tether opposite the acoustic resonator for anchoring the acoustic resonator. A mirror, one or more phononic crystals, or both may be positioned on proximate the tether opposite the acoustic resonator to avoid resonant waves from exiting the acoustic resonator in use.

公开(公告)号：US20180183404A1

公开(公告)日：2018-06-28

申请号：US15850453

申请日：2017-12-21

Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives ,  Safran Electronics & Defense

Inventor： Guillaume Jourdan ,  Guillaume Lehee

IPC: H03H9/02 ,  H03H9/24 ,  H03H3/007

CPC classification number: H03H9/02448 ,  B81B3/0045 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  G01P15/003 ,  G01P15/0802 ,  G01P2015/0882 ,  H03H3/0072 ,  H03H9/02338 ,  H03H9/2452 ,  H03H2009/02307

Abstract: Microelectronic structure comprising a mobile mass mechanically linked to a first and to a second mechanical element by first and second mechanical linking device respectively, a polarisation source for the second mechanical linking device. The second mechanical linking means comprises two linking elements and a thermal reservoir placed between the linking elements, where at least one of the linking elements is made of piezoresistive material, where at least one of the first and second linking elements exhibit thermoelasticity properties. The thermal reservoir exhibits a thermal capacity which is different from those of the linking elements. The second linking device and the mobile mass are arranged relative to each other such that displacement of the mobile mass applies a mechanical stress to the second linking means.

公开(公告)号：US20180048286A1

公开(公告)日：2018-02-15

申请号：US15723344

申请日：2017-10-03

Applicant: Murata Manufacturing Co, Ltd.

Inventor： YUICHI GOTO ,  Wakana Hirota

IPC: H03H9/17

CPC classification number: H03H9/172 ,  H03H3/0072 ,  H03H9/02338 ,  H03H9/0595 ,  H03H9/1057 ,  H03H9/178 ,  H03H9/2489 ,  H03H2009/155

Abstract: A resonance device is provided having a resonator with opposing upper and lower lids. The resonator includes a base, and multiple vibration arms that are connected to a front end of the base so as to extend away from the base. Moreover, a frame surrounds a periphery of the base portion and the vibration arms and one or more holding arms connect the base to the frame. The base, the vibration arms, and the holding arm include a substrate and a temperature characteristics correction layer laminated on the substrate and having a material with a coefficient of thermal expansion different from that of the substrate. The base, the vibration arms, and the holding arm are formed integrally with the substrate and the temperature characteristics correction layer.

公开(公告)号：US09866200B2

公开(公告)日：2018-01-09

申请号：US14883400

申请日：2015-10-14

Applicant: Microchip Technology Incorporated

Inventor： Wan-Thai Hsu ,  John Ryan Clark

IPC: H03H9/24 ,  H03H9/02

CPC classification number: H03H9/2431 ,  B81B2201/0271 ,  H03H9/02244 ,  H03H9/02259 ,  H03H9/02338 ,  H03H9/2452 ,  H03H2009/02251 ,  H03H2009/02283 ,  H03H2009/02307 ,  H03H2009/0233 ,  H03H2009/02346 ,  H03H2009/02496

Abstract: A multiple coil spring MEMS resonator includes a center anchor and a resonator body including two or more coil springs extending in a spiral pattern from the center anchor to an outer closed ring. Each pair of coil springs originates from opposing points on the center anchor and extends in the spiral pattern to opposing points on the outer ring. The number of coil springs, the length and the width of the coil springs and the weight of the outer ring are selected to realize a desired resonant frequency.

公开(公告)号：US20170214384A1

公开(公告)日：2017-07-27

申请号：US15087354

申请日：2016-03-31

Applicant: RF Micro Devices, Inc.

Inventor： Kushal Bhattacharjee

IPC: H03H9/13 ,  H03H9/15 ,  H03H9/02 ,  H03H9/00

CPC classification number: H03H9/02228 ,  H03H3/0072 ,  H03H3/0077 ,  H03H3/02 ,  H03H3/08 ,  H03H9/0009 ,  H03H9/02244 ,  H03H9/02259 ,  H03H9/02275 ,  H03H9/02338 ,  H03H9/02787 ,  H03H9/0296 ,  H03H9/0538 ,  H03H9/13 ,  H03H9/131 ,  H03H9/145 ,  H03H9/14564 ,  H03H9/15 ,  H03H9/17 ,  H03H9/25 ,  H03H2003/027 ,  H03H2009/02165 ,  H03H2009/02496 ,  H03H2009/155

Abstract: A micro-electrical-mechanical system (MEMS) guided wave device includes a plurality of electrodes arranged below a piezoelectric layer (e.g., either embedded in a slow wave propagation layer or supported by a suspended portion of the piezoelectric layer) and configured for transduction of a lateral acoustic wave in the piezoelectric layer. The piezoelectric layer permits one or more additions or modifications to be made thereto, such as trimming (thinning) of selective areas, addition of loading materials, sandwiching of piezoelectric layer regions between electrodes to yield capacitive elements or non-linear elastic convolvers, addition of sensing materials, and addition of functional layers providing mixed domain signal processing utility.

公开(公告)号：US09634227B1

公开(公告)日：2017-04-25

申请号：US14199103

申请日：2014-03-06

Applicant: Sand 9, Inc.

Inventor： Florian Thalmayr ,  Jan H. Kuypers

IPC: H01L41/053

CPC classification number: H03H9/02338 ,  H03H2009/155 ,  H03H2009/241

Abstract: Suppression of spurious modes of vibration for resonators and related apparatus and methods. A device may include a MEMS resonating structure, a substrate, and anchors between the MEMS resonating structure and the substrate. The MEMS resonating structure may have at least one main eigenmode of vibration and at least one spurious eigenmode of vibration. The anchors may be configured to suppress the response of the at least one spurious mode of vibration.

公开(公告)号：US09331602B2

公开(公告)日：2016-05-03

申请号：US14513594

申请日：2014-10-14

Applicant: Seiko Epson Corporation

Inventor： Kazuyuki Nagata ,  Ryuji Kihara

IPC: H03B5/30 ,  H01L41/053 ,  H01L41/083 ,  H03H9/24 ,  H02N1/00 ,  H01L41/09 ,  H03H9/02

CPC classification number: H02N1/006 ,  H01L41/053 ,  H01L41/083 ,  H01L41/0913 ,  H03B5/30 ,  H03H9/02338 ,  H03H9/2405 ,  H03H9/2447 ,  H03H2009/02283

Abstract: A MEMS vibrator includes: a substrate; a base portion which is disposed on the substrate; and a plurality of vibration portions which extends in a direction that intersects with a normal line of the substrate from the base portion. In a planar view, when a length of the vibration portion in a direction in which the vibration portion extends from the base portion is L, and a length of the vibration portion in a direction that intersects with a direction in which the vibration portion extends from the base portion is W, a dimension ratio (L/W) of the vibration portion satisfies a relationship in which 0.2≦(L/W)≦7.0.

Abstract translation: MEMS振动器包括：基板; 设置在基板上的基部; 以及多个振动部，其从与所述基部的法线相交的方向延伸。 在平面图中，当振动部从基部延伸的方向的振动部的长度为L时，振动部的长度与振动部从该基部延伸的方向相交的方向的长度 基部为W，振动部的尺寸比（L / W）满足0.2≤nlE;（L / W）＆nlE; 7.0的关系。

公开(公告)号：US09312789B2

公开(公告)日：2016-04-12

申请号：US14513628

申请日：2014-10-14

Applicant: Seiko Epson Corporation

Inventor： Ryuji Kihara

IPC: H01L41/053 ,  H03B5/32 ,  H03H9/05 ,  H03H9/24 ,  H02N1/00 ,  H01L41/09 ,  H03H9/02

CPC classification number: H02N1/006 ,  H01L41/053 ,  H01L41/0913 ,  H03B5/32 ,  H03H9/02338 ,  H03H9/05 ,  H03H9/2405 ,  H03H9/2447 ,  H03H2009/02283

Abstract: A MEMS vibrator includes: a substrate; a base portion which is disposed on the substrate; and a plurality of vibration portions which extend in directions different from each other from the base portion. The MEMS vibrator has a curved surface between the adjacent vibration portions.

Abstract translation: MEMS振动器包括：基板; 设置在基板上的基部; 以及沿与所述基部相互不同的方向延伸的多个振动部。 MEMS振动器在相邻振动部分之间具有弯曲表面。

公开(公告)号：US20140145793A1

公开(公告)日：2014-05-29

申请号：US13808562

申请日：2011-07-04

Applicant: Office National D'Etudes Et De Recherches Aerospatiales (Onera)

Inventor： Michael Bahriz ,  Olivier Le Traon

IPC: H03B5/30

CPC classification number: H03H9/2405 ,  H03H9/02338 ,  H03H9/02433 ,  H03H9/2452 ,  H03H2009/0244 ,  H03H2009/02503

Abstract: The device (10) comprises a cylindrical resonator (R) vibrating in extension-compression along its longitudinal axis (Δ) and having a vibration node (N) in its mid-plane (π), the vibration naturally generating radial extension/compression deformations, and a mechanical decoupling module comprising a hollow cylinder (2) surrounding the resonator and a membrane (1) positioned in the aforementioned mid-plane and rigidly connected to the cylindrical surface of the resonator and to the internal cylindrical surface of the hollow cylinder. The hollow cylinder vibrates in extension/compression in antiphase with the vibration of the resonator, enabling the effects of the radial deformations of the hollow cylinder and of the resonator to compensate each other in an area (ZF) located on the external surface of the hollow cylinder close to the mid-plane.

Abstract translation: 装置（10）包括沿着其纵向轴线（＆Dgr）在延伸压缩中振动并且在其中间平面（＆Pgr）中具有振动节点（N））的圆柱形谐振器（R），所述振动自然产生径向延伸/ 压缩变形，以及包括围绕谐振器的中空圆柱体（2）和位于上述中间平面中并且刚性地连接到谐振器的圆柱形表面的膜（1）的机械解耦模块以及中空的圆柱形表面 圆筒。 中空圆柱体在谐振器的振动下以反相方向在延伸/压缩中振动，使得中空圆柱体和谐振器的径向变形的作用可以在位于中空部分的外表面上的区域（ZF）中彼此补偿 气缸靠近中平面。

公开(公告)号：US20140103778A1

公开(公告)日：2014-04-17

申请号：US14047302

申请日：2013-10-07

Applicant: Seiko Epson Corporation

Inventor： Shogo INABA ,  Masahiro FUJII

IPC: H02N1/00

CPC classification number: H02N1/006 ,  B81B3/0013 ,  B81B2201/0271 ,  H03H3/0072 ,  H03H9/02338 ,  H03H9/2452 ,  H03H2009/02291 ,  H03H2009/02472 ,  Y10T29/49124

Abstract: A MEMS vibrator includes a wafer substrate, a fixed lower electrode (first electrode) disposed on a principal surface of the wafer substrate, a support member whose one end is fixed to the wafer substrate, and a movable upper electrode (second electrode) joined to the other end of the support member and having a region overlapping the fixed lower electrode with a gap. The support member has a reinforcing region where the thickness of the support member in a thickness direction of the wafer substrate is larger than the thickness of the movable upper electrode in the thickness direction of the wafer substrate.

Abstract translation: MEMS振子包括晶片基板，设置在晶片基板的主表面上的固定下电极（第一电极），一端固定在晶片基板上的支撑部件和可动上电极（第二电极） 支撑构件的另一端并具有与固定的下电极重叠的区域，具有间隙。 支撑构件具有加强区域，其中支撑构件在晶片衬底的厚度方向上的厚度大于可移动上电极在晶片衬底的厚度方向上的厚度。