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    Ovenized MEMS
    4.
    发明授权
    Ovenized MEMS 有权

    公开(公告)号：US11374535B2

    公开(公告)日：2022-06-28

    申请号：US16699270

    申请日：2019-11-29

    Applicant: SiTime Corporation

    Inventor： Carl Arft ,  Aaron Partridge ,  Markus Lutz ,  Charles I. Grosjean

    IPC: H03B5/04 ,  H03B5/30 ,  H01L23/31 ,  H01L23/34 ,  B81B3/00 ,  H01L23/00

    Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

    OVENIZED MEMS
    5.
    发明申请
    OVENIZED MEMS 审中-公开

    公开(公告)号：US20200186084A1

    公开(公告)日：2020-06-11

    申请号：US16699270

    申请日：2019-11-29

    Applicant: SiTime Corporation

    Inventor： Carl Arft ,  Aaron Partridge ,  Markus Lutz ,  Charles I. Grosjean

    IPC: H03B5/04 ,  H01L23/31 ,  H01L23/34 ,  H01L23/00 ,  B81B3/00 ,  H03B5/30

    Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

    Resonator electrode shields
    9.
    发明授权
    Resonator electrode shields 有权
    谐振器电极屏蔽

    公开(公告)号：US09252740B1

    公开(公告)日：2016-02-02

    申请号：US14300114

    申请日：2014-06-09

    Applicant: SiTime Corporation

    Inventor： David Raymond Pedersen ,  Aaron Partridge ,  Thor Juneau

    IPC: H03H9/02 ,  H03H9/24

    CPC classification number: H03H9/2405 ,  H03H3/0072 ,  H03H9/02259 ,  H03H9/02433 ,  H03H9/2457 ,  H03H9/2468 ,  H03H2009/02456 ,  H03H2009/02496

    Abstract: A MEMS resonator system that reduces interference signals arising from undesired capacitive coupling between different system elements. The system, in one embodiment, includes a MEMS resonator, electrodes, and at least one resonator electrode shield. In certain embodiments, the resonator electrode shield ensures that the resonator electrodes interact with either one or more shunting nodes or the active elements of the MEMS resonator by preventing or reducing, among other things, capacitive coupling between the resonator electrodes and the support and auxiliary elements of the MEMS resonator structure. By reducing the deleterious effects of interfering signals using one or more resonator electrode shields, a simpler, lower interference, and more efficient system relative to prior art approaches is presented.

    Abstract translation: 一种MEMS谐振器系统，其减少由不同系统元件之间的不期望的电容耦合引起的干扰信号。 在一个实施例中，该系统包括MEMS谐振器，电极和至少一个谐振器电极屏蔽。 在某些实施例中，谐振器电极屏蔽件通过防止或减少谐振器电极与支撑和辅助元件之间的电容耦合，确保谐振器电极与一个或多个分流节点或MEMS谐振器的有源元件相互作用 的MEMS谐振器结构。 通过使用一个或多个谐振器电极屏蔽减少干扰信号的有害影响，提出了相对于现有技术方法的更简单，更低干扰和更有效的系统。

    LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
    10.
    发明申请
    LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM 有权
    低剖面堆叠式MEMS谐振器系统

    公开(公告)号：US20150123220A1

    公开(公告)日：2015-05-07

    申请号：US14597825

    申请日：2015-01-15

    Applicant: SiTime Corporation

    Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

    Abstract translation: 用于微机电系统（MEMS）谐振器系统的薄型封装结构包括电引线，其在封装结构的横截面轮廓内的相应的第一和第二高度处具有内部和外部电接触表面，并且模具安装表面 第一和第二高度之间的中间高度。 谐振器控制芯片安装到电引线的管芯安装表面，使得谐振器控制芯片的至少一部分设置在第一和第二高度之间并且引线接合到电气的内部电接触表面 铅。 MEMS谐振器芯片以堆叠的管芯配置安装到谐振器控制芯片，并且电机的谐振器芯片，谐振器控制芯片和内部电接触和管芯安装表面被封装在暴露外部的封装外壳内 电气引线的电接触表面在包装结构的外表面。

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