公开(公告)号：US20160118346A1

公开(公告)日：2016-04-28

申请号：US14893005

申请日：2013-05-20

Applicant: MEIKO ELECTRONICS CO., LTD.

Inventor： Mitsuaki Toda ,  Tohru Matsumoto ,  Ryoichi Shimizu

IPC: H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L23/5389 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3107 ,  H01L23/5384 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2402 ,  H01L2224/24247 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/75745 ,  H01L2224/82001 ,  H01L2224/8201 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82986 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3641 ,  H05K1/188 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/40252 ,  H01L2924/40501 ,  H01L2924/403 ,  H01L2924/07802 ,  H01L2924/00014

Abstract: A device embedded substrate includes: an insulating layer; a first metal layer and a second metal layer that are formed such that the insulating layer is sandwiched therebetween; a device that is embedded in the insulating layer, and in which a connection terminal non-formation surface where a connection terminal is not formed is located on a side close to the first metal layer; an adhesive layer that is located on the connection terminal non-formation surface of the device; and a conductive via that electrically connects the second metal layer and the connection terminal of the device, wherein an area of the adhesive layer on a surface side in contact with the device is smaller than an area of the connection terminal non-formation surface of the device.

Abstract translation: 一种器件嵌入式衬底包括：绝缘层; 形成为使得绝缘层夹在其间的第一金属层和第二金属层; 嵌入在绝缘层中并且其中未形成连接端子的连接端子非形成表面的器件位于靠近第一金属层的一侧; 位于装置的连接端子非形成表面上的粘合剂层; 以及电连接所述第二金属层和所述装置的连接端子的导电孔，其中，与所述装置接触的表面侧的所述粘合剂层的面积小于所述装置的所述连接端子非形成面的面积 设备。

公开(公告)号：US20070108585A1

公开(公告)日：2007-05-17

申请号：US11595206

申请日：2006-11-10

Applicant: Mark Pavier ,  Andrew Sawle ,  Martin Standing

Inventor： Mark Pavier ,  Andrew Sawle ,  Martin Standing

IPC: H01L23/48

CPC classification number: H01L23/043 ,  H01L21/56 ,  H01L23/142 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/37 ,  H01L24/83 ,  H01L24/97 ,  H01L25/07 ,  H01L2224/0346 ,  H01L2224/0508 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/73153 ,  H01L2224/73267 ,  H01L2224/83815 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/40252 ,  H01L2924/403 ,  H01L2924/40407 ,  H01L2224/82 ,  H01L2224/83

Abstract: A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.

Abstract translation: 一种半导体封装，其包括半导体管芯，管芯周围的绝缘体，以及耦合到管芯的电极的一致的导电焊盘。

公开(公告)号：US06683416B1

公开(公告)日：2004-01-27

申请号：US10126268

申请日：2002-04-19

Applicant: Toyoharu Oohata ,  Katsuhiro Tomoda

Inventor： Toyoharu Oohata ,  Katsuhiro Tomoda

IPC: G09G310

CPC classification number: H01L33/0079 ,  H01L21/2007 ,  H01L24/24 ,  H01L24/45 ,  H01L24/82 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/24 ,  H01L2221/68368 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/24225 ,  H01L2224/45 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/40252 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A method of transferring multiple devices arrayed on a first substrate to a second substrate is provided. The devices on the first substrate are covered with a release agent, and a portion of the release agent, positioned on a device to be transferred is selectively removed. The first substrate is placed on a second substrate in such a manner that the devices arrayed on the first substrate face an adhesive layer previously provided on the second substrate. Only the device from which the release agent has been removed, is irradiated with a laser beam from a back side of the first substrate. The second substrate is then peeled from the first substrate, whereby only the device to be transferred is certainly, efficiently, and accurately transferred from the first substrate to the second substrate.

Abstract translation: 提供了将排列在第一衬底上的多个器件传送到第二衬底的方法。 第一基板上的装置被脱模剂覆盖，并且选择性地移除位于待转移装置上的一部分脱模剂。 第一衬底被放置在第二衬底上，使得排列在第一衬底上的器件面向预先设置在第二衬底上的粘合剂层。 只有脱模剂已经被去除的装置被从第一基板的背面用激光束照射。 然后，第二基板从第一基板剥离，由此只有待转印的装置肯定地，有效地并准确地从第一基板转移到第二基板。

公开(公告)号：US20170148692A1

公开(公告)日：2017-05-25

申请号：US15425582

申请日：2017-02-06

Applicant: Infineon Technologies Americas Corp.

Inventor： Mark Pavier ,  Andrew N. Sawle ,  Martin Standing

IPC: H01L23/043 ,  H01L23/31 ,  H01L23/492 ,  H01L23/373 ,  H01L23/498 ,  H01L21/56 ,  H01L23/495 ,  H01L23/367 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L23/043 ,  H01L21/56 ,  H01L23/142 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/37 ,  H01L24/83 ,  H01L24/97 ,  H01L25/07 ,  H01L2224/0346 ,  H01L2224/0508 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/73153 ,  H01L2224/73267 ,  H01L2224/83815 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/40252 ,  H01L2924/403 ,  H01L2924/40407 ,  H01L2224/82 ,  H01L2224/83

Abstract: A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.

公开(公告)号：US20040256367A1

公开(公告)日：2004-12-23

申请号：US10816794

申请日：2004-04-02

Applicant: Medtronic, Inc.

Inventor： David A. Ruben

IPC: B23K031/00 ,  B23K031/02

CPC classification number: H01L24/85 ,  B23K26/22 ,  B23K26/40 ,  B23K2101/32 ,  B23K2101/38 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/26 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45655 ,  H01L2224/45669 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78318 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85214 ,  H01L2224/85238 ,  H01L2924/01002 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/40252 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/206

Abstract: An apparatus and method are provided for using laser energy in an automated bonding machine to effect laser welding of ribbons and other connectors, particularly conductive ribbons in microelectronic circuits. The apparatus and method allow bonding and connection of microelectronic circuits with discrete heating avoiding heat damage to peripheral microelectronic components. The apparatus and method also allow bonding of flexible materials and low-resistance materials, and are less dependant on substrate and terminal stability in comparison to existing bonding methods. The bonding method leads to decreased apparatus wear in comparison to existing bonding methods.

Abstract translation: 提供了一种在自动焊接机中使用激光能量来实现丝带和其它连接器，特别是微电子电路中的导电带的激光焊接的装置和方法。 该装置和方法允许微电子电路与分立加热的结合和连接，避免对外围微电子部件的热损伤。 该装置和方法还允许柔性材料和低电阻材料的结合，并且与现有的结合方法相比较，其对衬底和端子稳定性的依赖性较小。 与现有的接合方法相比，接合方法导致设备磨损降低。

公开(公告)号：US06717100B2

公开(公告)日：2004-04-06

申请号：US10280965

申请日：2002-10-25

Applicant: David A. Ruben

Inventor： David A. Ruben

IPC: B23K2620

CPC classification number: H01L24/85 ,  B23K26/22 ,  B23K26/40 ,  B23K2101/32 ,  B23K2101/38 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/26 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45655 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/40252 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0002

Abstract: An apparatus and method are provided for using laser energy in an automated bonding machine to effect laser welding of ribbons and other connectors, particularly conductive ribbons in microelectronic circuits. The apparatus and method allow bonding and connection of microelectronic circuits with discrete heating avoiding heat damage to peripheral microelectronic components. The apparatus and method also allow bonding of flexible materials and low-resistance materials, and are less dependant on substrate and terminal stability in comparison to existing bonding methods. The bonding method leads to decreased apparatus wear in comparison to existing bonding methods.

Abstract translation: 提供了一种在自动焊接机中使用激光能量来实现丝带和其它连接器，特别是微电子电路中的导电带的激光焊接的装置和方法。 该装置和方法允许微电子电路与分立加热的结合和连接，避免对外围微电子部件的热损伤。 该装置和方法还允许柔性材料和低电阻材料的结合，并且与现有的结合方法相比较，其对衬底和端子稳定性的依赖性较小。 与现有的接合方法相比，接合方法导致设备磨损降低。

公开(公告)号：US09780054B2

公开(公告)日：2017-10-03

申请号：US14529881

申请日：2014-10-31

Applicant: INTEL CORPORATION

Inventor： John S. Guzek ,  Javier Soto Gonzalez ,  Nicholas R. Watts ,  Ravi K Nalla

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/498 ,  H01L23/538 ,  H01L25/03 ,  H01L25/10 ,  H05K1/18 ,  H01L21/768 ,  H01L25/07 ,  H01L23/31 ,  H01L25/11 ,  H05K3/46

CPC classification number: H01L24/11 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/315 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/26 ,  H01L24/27 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/074 ,  H01L25/105 ,  H01L25/117 ,  H01L2221/68345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/11831 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/26 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/821 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2224/92132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/40252 ,  H01L2924/40407 ,  H01L2924/40501 ,  H05K1/185 ,  H05K3/4682 ,  H05K2201/10477 ,  H05K2203/0152 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.

公开(公告)号：US09633951B2

公开(公告)日：2017-04-25

申请号：US11595206

申请日：2006-11-10

Applicant: Mark Pavier ,  Andrew N. Sawle ,  Martin Standing

Inventor： Mark Pavier ,  Andrew N. Sawle ,  Martin Standing

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/538 ,  H01L23/31 ,  H01L23/367 ,  H01L23/433 ,  H01L23/492 ,  H01L23/00 ,  H01L23/14

CPC classification number: H01L23/043 ,  H01L21/56 ,  H01L23/142 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/37 ,  H01L24/83 ,  H01L24/97 ,  H01L25/07 ,  H01L2224/0346 ,  H01L2224/0508 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/73153 ,  H01L2224/73267 ,  H01L2224/83815 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/40252 ,  H01L2924/403 ,  H01L2924/40407 ,  H01L2224/82 ,  H01L2224/83

Abstract: A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.

公开(公告)号：US20150050781A1

公开(公告)日：2015-02-19

申请号：US14529881

申请日：2014-10-31

Applicant: John S. Guzek ,  Javier Soto Gonzalez ,  Nicholas R. Watts ,  Ravi K Nalla

Inventor： John S. Guzek ,  Javier Soto Gonzalez ,  Nicholas R. Watts ,  Ravi K Nalla

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L24/11 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/315 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/26 ,  H01L24/27 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/074 ,  H01L25/105 ,  H01L25/117 ,  H01L2221/68345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/11831 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/26 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/821 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2224/92132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/40252 ,  H01L2924/40407 ,  H01L2924/40501 ,  H05K1/185 ,  H05K3/4682 ,  H05K2201/10477 ,  H05K2203/0152 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.

Abstract translation: 本发明的实施例描述了具有嵌入式管芯的半导体封装。 该半导体封装包括一个包含嵌入式裸片的无芯基板。 半导体封装提供管芯堆叠或封装堆叠功能。 此外，本发明的实施例描述了一种使组装成本最小化的半导体封装的制造方法。

公开(公告)号：US20040012337A1

公开(公告)日：2004-01-22

申请号：US10126268

申请日：2002-04-19

Inventor： Toyoharu Oohata ,  Katsuhiro Tomoda

IPC: G09G003/10

CPC classification number: H01L33/0079 ,  H01L21/2007 ,  H01L24/24 ,  H01L24/45 ,  H01L24/82 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/24 ,  H01L2221/68368 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/24225 ,  H01L2224/45 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/40252 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A method of transferring multiple devices arrayed on a first substrate to a second substrate is provided. The devices on the first substrate are covered with a release agent, and a portion of the release agent, positioned on a device to be transferred is selectively removed. The first substrate is placed on a second substrate in such a manner that the devices arrayed on the first substrate face an adhesive layer previously provided on the second substrate. Only the device from which the release agent has been removed, is irradiated with a laser beam from a back side of the first substrate. The second substrate is then peeled from the first substrate, whereby only the device to be transferred is certainly, efficiently, and accurately transferred from the first substrate to the second substrate.

Abstract translation: 提供了将排列在第一衬底上的多个器件传送到第二衬底的方法。 第一基板上的装置被脱模剂覆盖，并且选择性地移除位于待转移装置上的一部分脱模剂。 第一衬底被放置在第二衬底上，使得排列在第一衬底上的器件面向预先设置在第二衬底上的粘合剂层。 只有脱模剂已经被去除的装置被从第一基板的背面用激光束照射。 然后，第二基板从第一基板剥离，由此只有待转印的装置肯定地，有效地并准确地从第一基板转移到第二基板。