公开(公告)号：US20180108634A1

公开(公告)日：2018-04-19

申请号：US15294594

申请日：2016-10-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wen-Long LU ,  Yuan-Feng Chiang ,  Chi-Chang Lee ,  Chung-Hsi Wu

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/17 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/33 ,  H01L2224/1705 ,  H01L2224/175 ,  H01L2224/33104 ,  H01L2224/335

摘要： A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first main body, at least one first columnar portion and at least one first conductive layer. The first columnar portion protrudes from a bottom surface of the first main body. The first conductive layer is disposed on a side surface of the first columnar portion. The second semiconductor device includes a second main body, at least one second columnar portion and at least one second conductive layer. The second columnar portion protrudes from a top surface of the second main body. The second conductive layer is disposed on a side surface of the second columnar portion. The first conductive layer is electrically coupled to the second conductive layer.

公开(公告)号：US11876063B2

公开(公告)日：2024-01-16

申请号：US17462330

申请日：2021-08-31

申请人： NANYA TECHNOLOGY CORPORATION

发明人： Shing-Yih Shih

IPC分类号： H01L23/00

CPC分类号： H01L24/06 ,  H01L24/05 ,  H01L2224/02372 ,  H01L2224/05093 ,  H01L2224/32012 ,  H01L2224/33104

摘要： A semiconductor package structure includes a first semiconductor wafer including a first bonding pad. The semiconductor package structure also includes a second semiconductor wafer including a second bonding pad and a third bonding pad. The second bonding pad and the third bonding pad are bonded to the first bonding pad of the first semiconductor wafer. The semiconductor package structure further includes a first via penetrating through the second semiconductor wafer to physically contact the first bonding pad of the first semiconductor wafer. A portion of the first via is disposed between the second bonding pad and the third bonding pad.

公开(公告)号：US20230361027A1

公开(公告)日：2023-11-09

申请号：US17819381

申请日：2022-08-12

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chin-Yi Lin ,  Jie Chen ,  Sheng-Han Tsai ,  Yuan Sheng Chiu ,  Chou-Jui Hsu ,  Yu Kuei Yeh ,  Tsung-Shu Lin

IPC分类号： H01L23/528 ,  H01L23/532 ,  H01L23/00

CPC分类号： H01L23/528 ,  H01L23/53209 ,  H01L24/27 ,  H01L24/33 ,  H01L2224/33104

摘要： A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.

公开(公告)号：US20240047394A1

公开(公告)日：2024-02-08

申请号：US18381911

申请日：2023-10-19

申请人： NANYA TECHNOLOGY CORPORATION

发明人： SHING-YIH SHIH

IPC分类号： H01L23/00

CPC分类号： H01L24/06 ,  H01L24/05 ,  H01L2224/33104 ,  H01L2224/05093 ,  H01L2224/32012 ,  H01L2224/02372

摘要： A semiconductor package structure includes a first semiconductor wafer including a first bonding pad. The semiconductor package structure also includes a second semiconductor wafer including a second bonding pad and a third bonding pad. The second bonding pad and the third bonding pad are bonded to the first bonding pad of the first semiconductor wafer. The semiconductor package structure further includes a first via penetrating through the second semiconductor wafer to physically contact the first bonding pad of the first semiconductor wafer. A portion of the first via is disposed between the second bonding pad and the third bonding pad.

公开(公告)号：US20110089462A1

公开(公告)日：2011-04-21

申请号：US12674804

申请日：2008-08-29

申请人： David Van Heerden ,  Timothy Ryan Rude ,  Ramzi Vincent

发明人： David Van Heerden ,  Timothy Ryan Rude ,  Ramzi Vincent

IPC分类号： H01L33/48 ,  H01L21/60 ,  H01L31/00

CPC分类号： H01L24/83 ,  H01L24/33 ,  H01L31/02002 ,  H01L33/62 ,  H01L2224/33104 ,  H01L2224/335 ,  H01L2224/80359 ,  H01L2224/83024 ,  H01L2224/83095 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0278 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00

摘要： A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.

摘要翻译： 一种用于将LED组件（71）或其它电子封装（31）接合到包含散热器（52）的基板PCB的方法，所述基板PCB利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔（51） 电子封装31和支撑基板PCB上的相关接触焊盘（55）。 通过在反应性多层箔（51）中引发放热反应以及施加压力，在触头（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 在电子封装（31），与电子封装（31）相关联的热敏元件（35）或其他支撑衬底（31）之间，在触点32,34和接触焊盘（55）之间获得良好的导电和导热接合， PCB。

公开(公告)号：US11764121B2

公开(公告)日：2023-09-19

申请号：US17929871

申请日：2022-09-06

申请人： Samsung Electronics Co., Ltd.

发明人： Keun-ho Choi

IPC分类号： H01L23/31 ,  H01L23/00

CPC分类号： H01L23/3128 ,  H01L24/05 ,  H01L24/32 ,  H01L24/33 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0556 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33104 ,  H01L2224/491 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06506

摘要： Provided is a stacked semiconductor package including a package base substrate including a plurality of signal wires and at least one power wire, wherein a plurality of top surface connecting pads and a plurality of bottom surface connecting pads are on a top surface and a bottom surface of the package base substrate, respectively; and a plurality of semiconductor chips that are sequentially stacked on the package base substrate and are electrically connected to the top surface connecting pads, the plurality of semiconductor chips including a first semiconductor chip that is a bottommost semiconductor chip, and a second semiconductor chip that is on the first semiconductor chip, wherein the signal wires are arranged apart from a portion of the package base substrate, the first portion that overlaps a first edge of the first semiconductor chip, the first edge overlapping the second semiconductor chip in a vertical direction.

公开(公告)号：US09947635B1

公开(公告)日：2018-04-17

申请号：US15294594

申请日：2016-10-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wen-Long Lu ,  Yuan-Feng Chiang ,  Chi-Chang Lee ,  Chung-Hsi Wu

IPC分类号： H01L23/02 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L24/17 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/33 ,  H01L2224/1705 ,  H01L2224/175 ,  H01L2224/33104 ,  H01L2224/335

摘要： A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first main body, at least one first columnar portion and at least one first conductive layer. The first columnar portion protrudes from a bottom surface of the first main body. The first conductive layer is disposed on a side surface of the first columnar portion. The second semiconductor device includes a second main body, at least one second columnar portion and at least one second conductive layer. The second columnar portion protrudes from a top surface of the second main body. The second conductive layer is disposed on a side surface of the second columnar portion. The first conductive layer is electrically coupled to the second conductive layer.

公开(公告)号：US08882301B2

公开(公告)日：2014-11-11

申请号：US12674804

申请日：2008-08-29

申请人： David Van Heerden ,  Ramzi Vincent ,  Timothy Ryan Rude

发明人： David Van Heerden ,  Ramzi Vincent ,  Timothy Ryan Rude

IPC分类号： F21V29/00 ,  H01L33/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L24/33 ,  H01L31/02002 ,  H01L33/62 ,  H01L2224/33104 ,  H01L2224/335 ,  H01L2224/80359 ,  H01L2224/83024 ,  H01L2224/83095 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0278 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y02P70/613 ,  Y10S362/80 ,  H01L2924/00

摘要： A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.

摘要翻译： 一种用于将LED组件（71）或其它电子封装（31）接合到包含散热器（52）的基板PCB的方法，所述基板PCB利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔（51） 电子封装31和支撑基板PCB上的相关接触焊盘（55）。 通过在反应性多层箔（51）中引发放热反应以及施加压力，在触头（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 在电子封装（31），与电子封装（31）相关联的热敏元件（35）或其他支撑衬底（31）之间，在触点32,34和接触焊盘（55）之间获得良好的导电和导热接合， PCB。