- 专利标题： SEMICONDUCTOR PACKAGE, INTERPOSER AND SEMICONDUCTOR PROCESS FOR MANUFACTURING THE SAME
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申请号： US15294594申请日： 2016-10-14
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公开(公告)号： US20180108634A1公开(公告)日： 2018-04-19
- 发明人: Wen-Long LU , Yuan-Feng Chiang , Chi-Chang Lee , Chung-Hsi Wu
- 申请人： Advanced Semiconductor Engineering, Inc.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/498
摘要：
A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first main body, at least one first columnar portion and at least one first conductive layer. The first columnar portion protrudes from a bottom surface of the first main body. The first conductive layer is disposed on a side surface of the first columnar portion. The second semiconductor device includes a second main body, at least one second columnar portion and at least one second conductive layer. The second columnar portion protrudes from a top surface of the second main body. The second conductive layer is disposed on a side surface of the second columnar portion. The first conductive layer is electrically coupled to the second conductive layer.
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