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公开(公告)号：US11957303B2
公开(公告)日：2024-04-16
申请号：US18102934
申请日：2023-01-30
Applicant: KARL STORZ SE & Co. KG
Inventor： Andreas Heni , Markus Kupferschmid , Daniel Ulmschneider , Jonas Forster
CPC classification number: A61B1/0008 , A61B1/012 , A61B1/05 , A61B1/128 , F28F13/00 , H05K7/2039 , F28F2013/008 , F28F2280/10
Abstract: An apparatus configured for heat dissipation that includes a heat source, a heat sink and a heat conducting element. The heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that: a) a first cross-sectional area between the heat source and the heat conducting element and/or a second cross-sectional area between the heat conducting element of the heat sink increases, and/or b) a length of the heat conducting path shortens. Further, a video endoscope having such an apparatus and a use of such an apparatus is provided.
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公开(公告)号：US20230172431A1
公开(公告)日：2023-06-08
申请号：US18102934
申请日：2023-01-30
Applicant: KARL STORZ SE & Co. KG
Inventor： Andreas HENI , Markus KUPFERSCHMID , Daniel ULMSCHNEIDER , Jonas FORSTER
CPC classification number: A61B1/0008 , A61B1/012 , A61B1/05 , A61B1/128 , F28F13/00 , H05K7/2039 , F28F2013/008 , F28F2280/10
Abstract: An apparatus for heat dissipation is provided comprising a heat source, a heat sink and a heat conducting element, wherein the heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and wherein the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that a) a first cross-sectional area between the heat source and the heat conducting element and/or a second cross-sectional area between the heat conducting element of the heat sink increases, and/or b) a length of the heat conducting path shortens. Further, a video endoscope having such an apparatus and a use of such an apparatus are disclosed.
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公开(公告)号：US20190195132A1
公开(公告)日：2019-06-27
申请号：US16328743
申请日：2017-08-28
Applicant: Unison Industries, LLC
Inventor： Gordon Tajiri , Michael Thomas Kenworthy , Yanzhe Yang , Dattu GV Jonnalagadda , Elizabeth Diane Turner
CPC classification number: F02C7/18 , F05D2260/213 , F05D2270/42 , F05D2300/505 , F28D1/0246 , F28D2021/0021 , F28D2021/0026 , F28F3/048 , F28F7/02 , F28F2255/02 , F28F2255/04 , F28F2280/10 , F28F2280/105 , Y02T50/672 , Y02T50/675
Abstract: A fan casing assembly, connection assembly and method for moving a fan casing cooler. The fan casing assembly for the turbine engine can include an annular fan casing with a peripheral wall having a flow path defined through the casing. A fan casing cooler can mount along the peripheral wall in order to confront a cooling fluid flow within the flow path in order to cool a fluid through the fan casing cooler.
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公开(公告)号：US10054375B2
公开(公告)日：2018-08-21
申请号：US15182635
申请日：2016-06-15
Applicant: Mellanox Technologies Ltd.
Inventor： Tom David
CPC classification number: F28F5/00 , F28D2021/0029 , F28F13/00 , F28F2013/008 , F28F2280/10 , H01L23/367 , H01L23/3675 , H01L23/40
Abstract: A cooling apparatus includes first and second wedges, a solid thermal interface material (TIM) and a flexible force-exerting element. The first wedge has a first flat surface and a first diagonal surface. The first flat surface is configured to dissipate heat from an electronic device. The second wedge has a second flat surface and a second diagonal surface. The second diagonal surface faces the first diagonal surface, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto. The TIM is disposed between the first and second diagonal surfaces, and is configured to transfer heat between the first and second wedges. The force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink.
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公开(公告)号：US20170363371A1
公开(公告)日：2017-12-21
申请号：US15182635
申请日：2016-06-15
Applicant: Mellanox Technologies Ltd.
Inventor： Tom David
IPC: F28F5/00 , H01L23/40 , F28F13/00 , H01L23/367 , F28D21/00
CPC classification number: F28F5/00 , F28D2021/0029 , F28F13/00 , F28F2013/008 , F28F2280/10 , H01L23/367 , H01L23/3675 , H01L23/40
Abstract: A cooling apparatus includes first and second wedges, a solid thermal interface material (TIM) and a flexible force-exerting element. The first wedge has a first flat surface and a first diagonal surface. The first flat surface is configured to dissipate heat from an electronic device. The second wedge has a second flat surface and a second diagonal surface. The second diagonal surface faces the first diagonal surface, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto. The TIM is disposed between the first and second diagonal surfaces, and is configured to transfer heat between the first and second wedges. The force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink.
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Patent Agency Ranking
公开(公告)号：US20170261271A1
公开(公告)日：2017-09-14
申请号：US15470877
申请日：2017-03-27
Applicant: Fab Tek Logic, LLC
Inventor： Gordon B. Fanberg , Robert A. Fransen
CPC classification number: F28F1/30 , F28F2215/14 , F28F2280/02 , F28F2280/10 , F28F2280/105 , Y10T29/49378
Abstract: A removable heatsink assembly adapted to removably receive a pipe. The removable heatsink assembly includes a first plurality of fins and a second plurality of fins having collar flanges sized to receive a pipe. The fins are received on first and second spacer rods, respectively and are hingedly connected by a hinge rod such that the first and second plurality of fins are pivotally movable about the hinge rod between an open position and a closed position. In the open position, the first and second plurality of fins are positionable over the pipe. In the closed position, the collar flanges of the first and second plurality of fins substantially surround the pipe. A fin clamp secures the first and second plurality of fins together in the closed position about the pipe.
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公开(公告)号：US09655281B2
公开(公告)日：2017-05-16
申请号：US14751488
申请日：2015-06-26
Applicant: Seagate Technology LLC
Inventor： Laurence A. Harvilchuck , Alex Carl Worrall
CPC classification number: H05K7/20627 , F16L37/146 , F16L37/18 , F16L37/32 , F28F3/12 , F28F9/0075 , F28F9/02 , F28F9/0219 , F28F9/0275 , F28F2280/10 , G06F1/20 , G06F2200/201 , H05K7/20636 , H05K7/20781
Abstract: Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate.
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公开(公告)号：US20140124169A1
公开(公告)日：2014-05-08
申请号：US13667834
申请日：2012-11-02
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Daniel P. Kelaher , William M. Megarity , John P. Scavuzzo
IPC: F28F9/00
CPC classification number: H05K7/20727 , F28F2280/10
Abstract: A method and apparatus of cooling electronic components when replacing a cooling device in an information technology system are disclosed. The apparatus may include first and second cooling device trays that may be slidably mounted within an information technology system. The cooling device trays may include one or more cooling devices that are movably mounted to the cooling device trays. The apparatus may pivot one or more of the cooling devices when a pivot member contacts a fixed member with the chassis.
Abstract translation: 公开了在更换信息技术系统中的冷却装置时冷却电子部件的方法和装置。 该装置可以包括可滑动地安装在信息技术系统内的第一和第二冷却装置托盘。 冷却装置托盘可以包括可移动地安装到冷却装置托盘的一个或多个冷却装置。 当枢转构件与底盘接触固定构件时，该装置可枢转一个或多个冷却装置。
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公开(公告)号：US20140093430A1
公开(公告)日：2014-04-03
申请号：US13632945
申请日：2012-10-01
Applicant: Cepheid
Inventor： Ronald Chang , Douglas Dority
IPC: G01N21/75
CPC classification number: G01N21/75 , B01J19/0093 , B01J2219/00783 , B01J2219/0081 , B01J2219/00822 , B01J2219/00828 , B01J2219/00833 , B01J2219/00871 , B01J2219/00873 , B01J2219/00961 , B01J2219/0097 , B01J2219/00986 , B01L3/505 , B01L3/508 , B01L7/52 , B01L2300/042 , B01L2300/0809 , B01L2300/0858 , B01L2300/168 , B01L2300/1805 , F28D2021/0077 , F28F3/12 , F28F21/04 , F28F2280/10 , G01N21/0303 , G01N21/0332 , G01N2035/00326
Abstract: A reaction vessel having a reaction chamber for holding a sample is fabricated by producing a housing having a rigid frame defining the minor walls of the chamber. The housing also defines a port for introducing fluid into the chamber. At least one sheet or film is attached to the rigid frame to form at least one major wall of the chamber. In preferred embodiments, two sheets or films are attached to opposite sides of the rigid frame to form two opposing major walls of the chamber, the major walls being connected to each other by the minor walls.
Abstract translation: 具有用于保持样品的反应室的反应容器通过制造具有限定室的小壁的刚性框架的壳体来制造。 壳体还限定了用于将流体引入腔室的端口。 至少一个片或薄膜连接到刚性框架以形成腔室的至少一个主壁。 在优选实施例中，两个片或膜连接到刚性框架的相对侧面以形成腔室的两个相对的主壁，主壁通过次壁彼此连接。
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公开(公告)号：US07411791B2
公开(公告)日：2008-08-12
申请号：US11446970
申请日：2006-06-06
Applicant: Chien-Lung Chang , Fen-Ying Li , Kuo-Hsun Huang
Inventor： Chien-Lung Chang , Fen-Ying Li , Kuo-Hsun Huang
CPC classification number: H01L23/427 , F28D15/0266 , F28F1/20 , F28F1/30 , F28F2215/10 , F28F2215/14 , F28F2280/10 , H01L23/467 , H01L2924/0002 , H01L2924/00
Abstract: An extendable heat dissipation apparatus includes a base, an extendable heat dissipation member and a connecting element. A normal fin is formed on the base, and the connecting element integrates the extendable heat dissipation member in the apparatus with the base. The extendable heat dissipation member can be extendable to an extending location and can also be stored in a storing location with respect to the base.
Abstract translation: 可扩展散热装置包括基座，可延伸散热构件和连接元件。 在基座上形成正常的翅片，连接件将装置中的可延伸散热构件与底座相结合。 可扩展散热构件可以延伸到延伸位置，并且还可以相对于基座存储在存储位置。
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