公开(公告)号：US20240151333A1

公开(公告)日：2024-05-09

申请号：US17983749

申请日：2022-11-09

申请人： JWS TECHNOLOGY CO., LTD.

发明人： Pang-Hung LIAO ,  Chih-Wei CHEN

IPC分类号： F16L21/00 ,  F28F1/00 ,  F28F3/02 ,  F28F21/08

CPC分类号： F16L21/00 ,  F28F1/00 ,  F28F3/02 ,  F28F21/081 ,  F28F2280/02

摘要： A connecting structure includes a vapor chamber, a heat pipe and a working fluid. The vapor chamber includes a half shell seat, a half shell cover and a first wick structure. The half shell cover is sealed with the half shell seat and a chamber is defined therebetween. The half shell cover has a through hole and an annular wall. The first wick structure is laid on an inner surface of the half shell cover and extended into the annular wall. The heat pipe includes a tube body and a second wick structure. The tube body has an opening and a flange. The heat pipe is upright connected to an outer periphery of the annular wall by the opening. The flange is closely attached to an outer surface of the half shell cover. The second wick structure contacts the first wick structure. The working fluid is disposed in the chamber.

公开(公告)号：US20190206763A1

公开(公告)日：2019-07-04

申请号：US16298443

申请日：2019-03-11

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Shoubiao XU ,  Shanjiu CHI ,  Wenhui ZENG

IPC分类号： H01L23/40 ,  F28F3/06

CPC分类号： H01L23/4006 ,  F28F3/06 ,  F28F2280/02 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H05K7/20

摘要： One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

公开(公告)号：US20180051941A1

公开(公告)日：2018-02-22

申请号：US15238365

申请日：2016-08-16

申请人： Hamilton Sundstrand Corporation

发明人： Donald E. Army ,  Frederick Peacos, III

IPC分类号： F28F9/26 ,  F28F9/00 ,  F28D9/00 ,  F28F9/02

CPC分类号： F28F9/26 ,  F28D9/0025 ,  F28D2021/0021 ,  F28F9/00 ,  F28F9/001 ,  F28F9/002 ,  F28F9/005 ,  F28F9/007 ,  F28F9/02 ,  F28F9/0219 ,  F28F9/0226 ,  F28F9/04 ,  F28F9/12 ,  F28F2230/00 ,  F28F2275/08 ,  F28F2275/20 ,  F28F2280/02 ,  F28F2280/08

摘要： A heat exchanger is having: a housing having a first housing inlet, a second housing inlet, a first housing outlet, and a second housing outlet; and a core assembly disposed within the housing and removably connected to the housing, the core assembly comprises: a first fluid passage fluidly connecting the first housing inlet to the first housing outlet and a second fluid passage fluidly connecting the second housing inlet to the second housing outlet. The first fluid passage is thermally connected to the second fluid passage.

公开(公告)号：US20180003135A1

公开(公告)日：2018-01-04

申请号：US15538794

申请日：2015-12-23

申请人： Valeo Autosystemy Sp. z o.o. ,  Valeo Systemes Thermiques

发明人： Adam Bedek ,  Benjamin Ferlay ,  Maciej Klusek

IPC分类号： F02M35/10 ,  F02M35/104 ,  F28F9/00 ,  F28F9/02 ,  F16J15/02

CPC分类号： F02M35/10268 ,  F02B29/045 ,  F02B29/0462 ,  F02B29/0475 ,  F02M35/104 ,  F16J15/025 ,  F28F9/001 ,  F28F9/0219 ,  F28F2230/00 ,  F28F2280/02 ,  F28F2280/06 ,  Y02T10/146

摘要： The invention concerns a seal (5) for sealing off the gap between a heat exchanger (1) and the inside wall of a groove (7) in a fluid channel for accommodating said heat exchanger [1], the seal (5) comprising at least one fixing member (51, 52) for fixing the seal (5) on at least part of the circumference of the heat exchanger (1) and at least a first (53) and second lip (54) adapted to contact opposite sides (71, 72) of the groove (7) to thereby seal off the gap between the heat exchanger (1) and the fluid channel and to fix said at least part of the circumference of the heat exchanger (1) inside the groove (7).

公开(公告)号：US09809380B2

公开(公告)日：2017-11-07

申请号：US14104681

申请日：2013-12-12

申请人： Savannah River Nuclear Solutions, LLC

发明人： David A. Tamburello ,  Matthew R. Kesterson ,  Bruce J. Hardy

IPC分类号： B65D88/74 ,  F17C13/00 ,  F28F13/12

CPC分类号： B65D88/744 ,  B65D88/748 ,  F17C13/00 ,  F17C2209/22 ,  F17C2221/012 ,  F17C2227/0309 ,  F17C2227/0341 ,  F17C2227/0379 ,  F17C2270/0178 ,  F17C2270/05 ,  F28F13/12 ,  F28F2255/02 ,  F28F2275/20 ,  F28F2280/02 ,  Y02E60/321 ,  Y10T29/4935

摘要： Vessel assemblies, heat transfer units for prefabricated vessels, and methods for heat transfer prefabricated vessel are provided. A heat transfer unit includes a central rod, and a plurality of peripheral rods surrounding the central rod and connected to the central rod. The plurality of peripheral rods are movable between a first collapsed position and a second bowed position, wherein in the second bowed position a midpoint of each of the plurality of peripheral rods is spaced from the central rod relative to in the first position. The heat transfer unit further includes a heat transfer element connected to one of the plurality of peripheral rods.

公开(公告)号：US20170265331A1

公开(公告)日：2017-09-14

申请号：US15067371

申请日：2016-03-11

申请人： Enzo Technology Corp.

发明人： Kuo-An Robert Liang

IPC分类号： H05K7/20 ,  F28F9/007 ,  F28F3/02

CPC分类号： H05K7/20409 ,  F28D2021/0029 ,  F28F3/02 ,  F28F9/0075 ,  F28F2280/02 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/467 ,  H01L2023/4081 ,  H01L2023/4087

摘要： A retainer for detachably coupling a heat absorbing/dissipating device to a heat source is disclosed. The retainer can include one or more cooling fins to enable the retainer to dissipate heat along with the heat dissipating device. The cooling fins on the retainer can be wedge-shaped or airfoil-shaped, among other things, to increase, direct, and smooth airflow over the retainer, the heat source, and the heat dissipating device. The heat dissipating device can include a heat sink with multiple cooling fins. The cooling fins on the retainer can have substantially the same geometric pattern as the cooling fins on the heat sink.

公开(公告)号：US09720465B2

公开(公告)日：2017-08-01

申请号：US14768903

申请日：2014-12-04

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE CHATANI ELECTRONICS CO., LTD.

发明人： Yingli Meng

IPC分类号： G06F1/20 ,  H05K7/20 ,  F28F13/06 ,  F28F3/02 ,  F28D15/02 ,  F28D21/00 ,  F28F13/00

CPC分类号： G06F1/203 ,  F28D15/0266 ,  F28D2021/0029 ,  F28F3/02 ,  F28F13/06 ,  F28F2013/006 ,  F28F2250/08 ,  F28F2280/02 ,  H05K7/20172 ,  H05K7/2039

摘要： A heat dissipation apparatus and a portable device are provided. The heat dissipation apparatus includes at least two heat sinks, which are connected to each other by a heat conductive tube; and a fan fixed onto one of the at least two heat sinks; the fan has an inlet vent and at least two outlet vents, the respective outlet vents have different discharging directions, a detachable shield plate is disposed at each of the outlet vents, a respective one of the outlet vents discharges an airflow outside when a respective one of the shield plates is drawn out.

公开(公告)号：US20170030659A1

公开(公告)日：2017-02-02

申请号：US14811117

申请日：2015-07-28

申请人： Caterpillar Inc.

发明人： Joseph Kennedy

IPC分类号： F28F1/20 ,  F28F9/26 ,  B23P15/26 ,  F28F3/04

CPC分类号： F28F1/20 ,  B23P15/26 ,  B60K11/04 ,  F01P11/04 ,  F28D1/05366 ,  F28D2021/0094 ,  F28F1/025 ,  F28F1/126 ,  F28F3/04 ,  F28F9/14 ,  F28F9/165 ,  F28F9/262 ,  F28F2280/02

摘要： A tube-and-fin assembly with improved removal feature is provided. The tube-and-fin assembly includes a tube including an elongated body having flattened sides, a cylindrical top end and a cylindrical bottom end for attachment to a coolant manifold, and a plurality of fins which are disposed as a unitary part of a corrugated sheet affixed to either side of the tube, where the bottom end includes a bottom bead and a top bead.

摘要翻译： 提供了具有改进的去除特征的管 - 翅片组件。 管翅组件包括管，其包括具有扁平侧面的细长主体，圆柱形顶端和用于附接到冷却剂歧管的圆柱形底端，以及多个翅片，其布置为波纹片的整体部分 固定在管的任一侧，其中底端包括底部胎圈和顶部胎圈。

公开(公告)号：US20170023305A1

公开(公告)日：2017-01-26

申请号：US14805565

申请日：2015-07-22

申请人： General Electric Company

发明人： Pallab KARMAKAR ,  Rajeshwar SRIPADA

IPC分类号： F28D7/00

CPC分类号： F22B1/1846 ,  F28D7/0041 ,  F28D7/06 ,  F28D7/1669 ,  F28F9/0229 ,  F28F2280/02

摘要： A modular heat exchanger assembly for a steam generator includes a first fluid inlet conduit configured and disposed to be connected to a source of a first fluid, and a tube sheet coupled to the first fluid inlet conduit. The tube sheet includes a first surface and an opposing, second surface. A plurality of platen tubes extends from the second surface of the tube sheet. The plurality of platen tubes is configured and disposed to carry a second fluid in a heat exchange relationship with the first fluid in a heat exchange vessel. The modular heat exchanger assembly is configured and disposed to be selectively and readily removable from the heat exchange vessel.

摘要翻译： 用于蒸汽发生器的模块化热交换器组件包括被配置和设置成连接到第一流体源的第一流体入口导管和联接到第一流体入口导管的管板。 管板包括第一表面和相对的第二表面。 多个压板管从管板的第二表面延伸。 多个压板管被配置和设置成在热交换容器中携带与第一流体的热交换关系的第二流体。 模块化热交换器组件被配置和设置成选择性地且容易地从热交换容器移除。

公开(公告)号：US09464851B2

公开(公告)日：2016-10-11

申请号：US13992035

申请日：2010-12-09

申请人： Franco Provenziani

发明人： Franco Provenziani

IPC分类号： F28D21/00 ,  F28F1/00 ,  F25B39/02 ,  F28D7/00 ,  F28D7/16

CPC分类号： F28F1/00 ,  F25B39/02 ,  F25B2339/0242 ,  F28D7/0066 ,  F28D7/0075 ,  F28D7/16 ,  F28D21/0017 ,  F28D2021/0071 ,  F28F2280/02

摘要： A flooded heat exchanger of is described. The flooded heat exchanger has a primary tube bundle inside which a first operating fluid flows, a skirt surrounding the primary tube bundle and receiving a second operating fluid which flows over the primary tube bundle, and one or more extractable units, each in turn having a secondary tube bundle which receives an auxiliary operating fluid, and a secondary tube plate for performing a removable connection to the flooded heat exchanger.

摘要翻译： 描述了淹水式热交换器。 淹水式热交换器具有主管束，第一工作流体在其中流动，围绕主管束的裙部并且接收流过主管束的第二工作流体，以及一个或多个可抽出单元，每个可抽出单元依次具有 接收辅助操作流体的二次管束，以及用于执行到淹没式热交换器的可移除连接的次级管板。