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    Method for increasing contact area between a viscous liquid and a substrate
    1.
    发明授权
    Method for increasing contact area between a viscous liquid and a substrate 有权
    增加粘性液体和基材之间接触面积的方法

    公开(公告)号：US06291016B1

    公开(公告)日：2001-09-18

    申请号：US09324704

    申请日：1999-06-02

    申请人： William E. Donges ,  James C. Smith

    发明人： William E. Donges ,  James C. Smith

    IPC分类号： B05D312

    CPC分类号： B05C11/1034 ,  B05B7/066 ,  B05C5/0225 ,  B05C11/06 ,  Y10S239/21

    摘要： A method of assembling electronic components using a dispenser having a nozzle in fluid communication with a source of viscous liquid having a high surface tension and having an air discharge passage in fluid communication with a source of pressurized air. A droplet of the viscous liquid is dispensed from the nozzle onto a printed circuit board to form an initial contact area between the droplet and the printed circuit board and the high surface tension of the droplet causes the initial contact area to remain substantially constant. A burst of air is then discharged from the air discharge passage for impinging the droplet after the droplet contacts the printed circuit board, which increases the initial contact area between the droplet and the printed circuit board.

    摘要翻译： 一种使用具有喷嘴与具有高表面张力的粘性液体源流体连通并具有与加压空气源流体连通的排气通道的分配器组装电子部件的方法。 将粘性液体的小滴从喷嘴分配到印刷电路板上以形成液滴和印刷电路板之间的初始接触面积，并且液滴的高表面张力使初始接触面积保持基本恒定。 然后，在液滴与印刷电路板接触之后，从空气排出通道排出空气以冲击液滴，这增加了液滴和印刷电路板之间的初始接触面积。

    MATERIAL APPLICATION APPARATUS AND METHODS
    2.
    发明申请
    MATERIAL APPLICATION APPARATUS AND METHODS 有权
    材料应用装置及方法

    公开(公告)号：US20100175617A1

    公开(公告)日：2010-07-15

    申请号：US12729528

    申请日：2010-03-23

    申请人： William E. Donges ,  Vincent A. Prieto ,  Jeffrey J. Kruke ,  Randy R. Fidler ,  Timothy E. Wilson ,  Justin E. Hall ,  Jeffrey A. Wasko

    发明人： William E. Donges ,  Vincent A. Prieto ,  Jeffrey J. Kruke ,  Randy R. Fidler ,  Timothy E. Wilson ,  Justin E. Hall ,  Jeffrey A. Wasko

    IPC分类号： B05C5/00

    CPC分类号： C03B40/027

    摘要： Apparatus for spraying glass bottle mold bodies, such as blanks and rings in a molding machine, includes nozzles and spray guns mounted on a plate such that the nozzles are positioned to spray the mold bodies with a material such as a lubricant during normal operation of the machine and without shutting the machine down. The apparatus can be installed on an existing machine without changing the molding machine. Rings may be sprayed while in motion during normal machine operation. A nozzle is provided along with check valves to produce a tight conical spray pattern.

    摘要翻译： 用于在成型机中喷射玻璃瓶模具体（例如坯料和环）的装置包括安装在板上的喷嘴和喷枪，使得喷嘴定位成在模具的正常操作期间用诸如润滑剂的材料喷射模具体 机器并且不关闭机器。 该设备可以安装在现有的机器上，而不需要更换成型机。 在正常的机器操作期间，可以在运动中喷射环。 喷嘴与止回阀一起提供，以产生紧密的锥形喷雾图案。

    No-flow flux and underfill dispensing methods
    4.
    发明授权
    No-flow flux and underfill dispensing methods 失效
    无流量通量和底部填充分配方式

    公开(公告)号：US06234379B1

    公开(公告)日：2001-05-22

    申请号：US09514602

    申请日：2000-02-28

    申请人： William E. Donges

    发明人： William E. Donges

    IPC分类号： B23K120

    CPC分类号： H01L24/27 ,  B23K3/0623 ,  B23K3/082 ,  H01L21/4867 ,  H01L21/563 ,  H01L21/6715 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29015 ,  H01L2224/29034 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method for attaching a semiconductor die or flip chip to a substrate to form a printed circuit board. A dispensing apparatus is spaced away from a substrate so that the dispenser does not contact the substrate. Droplets of no-flow flux and underfill material are dispensed from the dispensing apparatus onto a substrate. A flip chip with an array of solder balls or bumps on its underside is push through the material until it contacts the substrate. The flip chip and the substrate are heated sufficiently to form mechanical and electrical connections therebetween. The method of the present invention can apply the no-flow flux and underfill material in a predetermined pattern. Furthermore, the predetermined pattern of droplets can be tailored to also include a desired topography. That is, the height of the no-flow flux and underfill material can vary relative to the substantially flat surface of the substrate.

    摘要翻译： 一种用于将半导体管芯或倒装芯片附接到衬底以形成印刷电路板的方法。 分配装置与衬底间隔开，使得分配器不接触衬底。 无流动助焊剂和底部填充材料的液滴从分配装置分配到基底上。 具有其下侧的焊球或凸块阵列的倒装芯片推动穿过材料直到其接触基板。 倒装芯片和基板被充分加热以在它们之间形成机械和电连接。 本发明的方法可以以预定的模式应用无流动通量和底部填充材料。 此外，可以将预定图案的液滴定制成还包括所需的形貌。 也就是说，无流动通量和底部填充材料的高度可以相对于基底的基本上平坦的表面而变化。

    Coating apparatus with pattern width control
    5.
    发明授权
    Coating apparatus with pattern width control 失效
    涂装设备图案宽度控制

    公开(公告)号：US5316219A

    公开(公告)日：1994-05-31

    申请号：US910670

    申请日：1992-07-08

    申请人： Richard G. Christyson ,  William E. Donges ,  James J. Turner

    发明人： Richard G. Christyson ,  William E. Donges ,  James J. Turner

    IPC分类号： B05B12/00 ,  B05B13/04 ,  B05C5/00 ,  B05C13/00 ,  H05K3/00 ,  H05K3/28 ,  B05B1/04

    CPC分类号： B05B13/0431 ,  H05K3/0091

    摘要： An apparatus for manipulating a spray device having a spray nozzle relative to a target substrate, which apparatus includes drive mechanisms for moving the spray device in the X, Y and Z directions, and separate mechanisms for rotating the spray nozzle relative to the spray device and for tilting the spray nozzle relative to the spray device and including a pressure regulator to vary the width of the spray pattern as the spray device moves relative to the target substrate.

    摘要翻译： 一种用于操纵具有相对于目标衬底的喷嘴的喷射装置的装置，该装置包括用于在X，Y和Z方向上移动喷射装置的驱动机构，以及用于相对于喷雾装置旋转喷嘴的分离机构， 用于相对于喷雾装置倾斜喷嘴并且包括压力调节器以随着喷射装置相对于目标基板移动而改变喷射图案的宽度。

    Plug-in circuit board connector and keying assembly
    6.
    发明授权
    Plug-in circuit board connector and keying assembly 失效
    插入式电路板连接器和键控组件

    公开(公告)号：US4546414A

    公开(公告)日：1985-10-08

    申请号：US482281

    申请日：1983-04-12

    申请人： William E. Donges

    发明人： William E. Donges

    IPC分类号： H05K7/14 ,  H05K1/14

    CPC分类号： H05K7/1455

    摘要： A mainframe printed wiring board assembly for receiving plug-in circuit boards of two different types in connectors on the mainframe printed wiring board. Each connector is correct for only one of the two types of circuit board. The mainframe printed wiring board assembly includes a row of connectors of a first type and a row of connectors of a second type, with each connector in each row having an elongated slot adapted to receive a circuit board edge. The slots in the connectors in each row extend transversely to the direction of the row. A first elongated key element extends along the first row of connectors adjacent the connector ends. A second elongated key element extends along the second row of connectors, spaced apart from the connector ends. The two different types of plug-in circuit boards have, on their connector engaging edges, different contours to accommodate one or the other of the elongated key elements.

    摘要翻译： 一种主机印刷线路板组件，用于接收主机印刷线路板上连接器中两种不同类型的插入式电路板。 每个连接器只适用于两种类型的电路板中的一种。 主机印刷线路板组件包括一列第一类型的连接器和一排第二类连接器，每行中的每个连接器具有适于接收电路板边缘的细长槽。 每排中的连接器中的槽横向于行的方向延伸。 第一细长键元件沿着邻近连接器端部的第一排连接器延伸。 第二细长键元件沿着与连接器端部间隔开的第二排连接器延伸。 两种不同类型的插入式电路板在其连接器接合边缘上具有不同的轮廓以适应一个或另一个细长的键元件。

    Apparatus for applying a liquid coating with an improved spray nozzle
    8.
    发明授权
    Apparatus for applying a liquid coating with an improved spray nozzle 失效
    用改进的喷嘴施加液体涂层的装置

    公开(公告)号：US06325853B1

    公开(公告)日：2001-12-04

    申请号：US08878756

    申请日：1997-06-19

    申请人： Patrick Thomas Hogan ,  David M. Selestak ,  Richard Zakrajsek ,  William E. Donges ,  Chris Havlik ,  Greg Harrell ,  Zygmunt Carl Omilion ,  Kevin Fox

    发明人： Patrick Thomas Hogan ,  David M. Selestak ,  Richard Zakrajsek ,  William E. Donges ,  Chris Havlik ,  Greg Harrell ,  Zygmunt Carl Omilion ,  Kevin Fox

    IPC分类号： B05C500

    CPC分类号： B05B7/10 ,  B05B7/0861 ,  B05B7/12 ,  B05B7/2489 ,  B05C5/02 ,  H05K3/0091 ,  H05K2203/081 ,  H05K2203/1366 ,  H05K2203/1509 ,  Y10S118/02

    摘要： Apparatus and methods for spray coating selected areas of a circuit board with a liquid coating material without coating regions of the circuit board to be left uncoated. In one mode of operation, a bead of liquid coating material dispensed from an elongated nozzle tip is atomized by directing jets of air pressurized against the bead to form a conical, swirling spray pattern which is sprayed on selected areas of a circuit board. In a second mode of operation, the non-atomized bead of liquid coating material dispensed through the elongated nozzle tip is applied on selected areas of the circuit board. In a third mode of operation, jets of pressurized air are directed against the bead of liquid coating material to create a soft swirl pattern, without atomizing the bead of coating material. In a second embodiment of the invention, the bead of liquid coating material is dispensed from a nozzle without the elongated nozzle tip.

    摘要翻译： 用液体涂覆材料喷涂电路板的选定区域的装置和方法，而不涂覆电路板的未被涂覆的区域。 在一种操作模式中，从细长的喷嘴尖端分配的液体涂层材料的珠子通过将喷射的空气引导到凸缘上而被雾化，以形成喷射在电路板的选定区域上的圆锥形的旋转喷雾图案。 在第二操作模式中，通过细长喷嘴尖端分配的液体涂覆材料的非雾化珠被施加在电路板的选定区域上。 在第三种操作模式中，加压空气的喷嘴被引导到液体涂覆材料的珠粒上以产生柔软的漩涡图案，而不会使涂层材料的珠粒雾化。 在本发明的第二实施例中，液体涂层材料的珠粒从喷嘴分配而没有细长的喷嘴尖端。

    Method and apparatus for dispensing liquid material
    9.
    发明授权
    Method and apparatus for dispensing liquid material 失效
    用于分配液体材料的方法和装置

    公开(公告)号：US06261367B1

    公开(公告)日：2001-07-17

    申请号：US09307949

    申请日：1999-05-10

    申请人： William E. Donges

    发明人： William E. Donges

    IPC分类号： B05B102

    CPC分类号： B05C11/1034 ,  B05C5/0225 ,  H05K13/0469

    摘要： A liquid material dispensing system includes a nozzle tip that is adapted to dispense droplets of liquid material that expand in flight toward a substrate. The droplets elongate in orthogonal directions in a plane that is substantially transverse to the direction of travel of the droplets toward the substrate. Preferably, each droplet elongates in pattern width and in pattern length during its flight toward the substrate. The elongated droplets impact the substrate and contact adjacent droplets to form a generally rectangular layer of liquid material within a predetermined area on the substrate. Methods for forming a generally rectangular layer of liquid material on a substrate are also disclosed.

    摘要翻译： 液体材料分配系统包括喷嘴头，其适于分配在飞行中朝向基底膨胀的液体材料的液滴。 液滴在正交方向上在基本上横向于液滴朝向基底的行进方向的平面中伸长。 优选地，每个液滴在其朝向基板的飞行过程中以图案宽度和图案长度延长。 细长的液滴冲击衬底并接触相邻的液滴，以在衬底上的预定区域内形成大致矩形的液体材料层。 还公开了在基底上形成大致矩形的液体材料层的方法。

    Material application apparatus and methods
    10.
    发明授权
    Material application apparatus and methods 有权
    材料应用设备和方法

    公开(公告)号：US08186181B2

    公开(公告)日：2012-05-29

    申请号：US12729528

    申请日：2010-03-23

    申请人： William E. Donges ,  Vincent Prieto ,  Jeffrey J. Kruke ,  Randy R. Fidler ,  Timothy E. Wilson ,  Justin E. Hall ,  Jeffrey A. Wasko

    发明人： William E. Donges ,  Vincent Prieto ,  Jeffrey J. Kruke ,  Randy R. Fidler ,  Timothy E. Wilson ,  Justin E. Hall ,  Jeffrey A. Wasko

    IPC分类号： C03B40/027 ,  C03B40/02

    CPC分类号： C03B40/027

    摘要： Apparatus for spraying glass bottle mold bodies, such as blanks and rings in a molding machine, includes nozzles and spray guns mounted on a plate such that the nozzles are positioned to spray the mold bodies with a material such as a lubricant during normal operation of the machine and without shutting the machine down. The apparatus can be installed on an existing machine without changing the molding machine. Rings may be sprayed while in motion during normal machine operation. A nozzle is provided along with check valves to produce a tight conical spray pattern.

    摘要翻译： 用于在成型机中喷射玻璃瓶模具体（例如坯料和环）的装置包括安装在板上的喷嘴和喷枪，使得喷嘴定位成在模具的正常操作期间用诸如润滑剂的材料喷射模具体 机器并且不关闭机器。 该设备可以安装在现有的机器上，而不需要更换成型机。 在正常的机器操作期间，可以在运动中喷射环。 喷嘴与止回阀一起提供，以产生紧密的锥形喷雾图案。