公开(公告)号：US06365436B1

公开(公告)日：2002-04-02

申请号：US09712631

申请日：2000-11-14

申请人： Tony Faraci ,  Thomas H. Distefano ,  John W. Smith

发明人： Tony Faraci ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H01L2144

CPC分类号： H01L24/86 ,  H01L24/45 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/7965 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48

摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.

摘要翻译： 多个单独的半导体芯片（每个具有接触表面和在该表面上的接触）被布置成阵列，使得接触表面面对并限定阵列的第一表面。 具有端子的柔性介电片覆盖在半导体芯片的第一或接触支承表面上。 细长引线设置在电介质元件和半导体芯片之间。 每个引线具有连接到电介质元件上的端子的第一端，以及连接到阵列中的半导体芯片上的触点的第二端。 所有的引线通过相对于彼此移动介质元件和阵列而同时形成，以同时相对于所有第二端移位引线的所有第一端。 介电元件在形成步骤之后被细分，以便将电介质元件的一个区域连接到每个芯片，从而形成各自包括一个芯片或少量芯片的单元。

公开(公告)号：US6133639A

公开(公告)日：2000-10-17

申请号：US842313

申请日：1997-04-24

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174

摘要： A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The complaint interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

摘要翻译： 一种用于在半导体芯片和其支撑衬底之间提供平面和兼容接口以适应其间的热膨胀失配的方法和装置。 投诉界面由在相邻的焊盘之间限定通道的多个柔性焊盘构成。 垫通常在柔性膜芯片载体和芯片之间被压缩。 在通道内进一步布置柔顺填料以形成具有受控厚度的均匀包封层。

公开(公告)号：US5794330A

公开(公告)日：1998-08-18

申请号：US436649

申请日：1995-05-08

申请人： Thomas H. Distefano ,  John W. Smith, Jr.

发明人： Thomas H. Distefano ,  John W. Smith, Jr.

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/10 ,  H01L21/486 ,  H01L21/4885 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19042 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49208

摘要： A component for mounting semiconductor chips or other microelectronic units includes a flexible top sheet with an array of terminals on it, and with flexible leads extending downwardly from the terminals. A compliant dielectric support layer surrounds the leads, holding the lead tips in precise locations. The leads are desirably formed from wire such as gold wire, and have eutectic bonding alloy on their tips. The component can be laminated to a chip or other unit under heat and pressure to form a complete subassembly with no need for individual bonding to the contacts of the chip. The subassembly can be tested readily and provides compensation for thermal expansion.

公开(公告)号：US5632631A

公开(公告)日：1997-05-27

申请号：US306205

申请日：1994-09-14

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06744 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R3/00 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L24/81 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连以及可选的有效的冶金结合 接合材料。

公开(公告)号：US06205660B1

公开(公告)日：2001-03-27

申请号：US08845014

申请日：1997-04-22

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： H01R4300

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

摘要翻译： 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连和任选的有效的冶金结合 接合材料。

公开(公告)号：US6044548A

公开(公告)日：2000-04-04

申请号：US038366

申请日：1998-03-10

申请人： Thomas H. Distefano ,  John W. Smith, Jr.

发明人： Thomas H. Distefano ,  John W. Smith, Jr.

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/10 ,  H01L21/486 ,  H01L21/4885 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19042 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49208

摘要： A method of making connections to a microelectronic unit includes the steps of providing a connection component having a flexible dielectric top sheet, a plurality of terminals on the top sheet and a plurality of electrically conductive, elongated flexible leads connected to the terminals and extending side-by-side downwardly from the terminals away from the top sheet to bottom ends remote from the top sheet. The connection component is then engaged with a front surface of a microelectronic unit having an array of contacts thereon while subjecting the connection component and the microelectronic unit to heat and pressure so that bottom ends of the leads remote from the top sheet bond with the contacts on the microelectronic unit to form electrical connections therewith.

摘要翻译： 制造与微电子单元的连接的方法包括以下步骤：提供具有柔性电介质顶片的连接部件，顶片上的多个端子和连接到端子的多个导电细长柔性引线， 从端子向上离开顶片到远离顶片的底端。 然后，连接部件与具有触点阵列的微电子单元的前表面接合，同时对连接部件和微电子单元进行加热和压力，使得远离顶片的引线的底端与触点接合在一起 微电子单元与其形成电连接。

公开(公告)号：US5929517A

公开(公告)日：1999-07-27

申请号：US365749

申请日：1994-12-29

申请人： Thomas H. Distefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

发明人： Thomas H. Distefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/04 ,  H05K13/04

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/50 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49146

摘要： Semiconductor chip packages and methods of fabricating the same. The package includes a thermally conductive protective structure having an indentation open to a front side and a flange surface at least partially surrounding the indentation and facing to the front of the structure. A chip is disposed in the indentation so that the front surface of the chip, with contacts thereon, faces toward the front of the structure. A flexible dielectric film having terminals thereon is placed on the flange surface, and a compliant material is disposed between the film and the flange surface. The terminals on the film are connected to the contacts on the chip. The individual terminals on the film are movable with respect to the protective structure, which facilitates mounting and compensation for thermal expansion.

摘要翻译： 半导体芯片封装及其制造方法。 该封装包括导热保护结构，其具有向前侧开口的凹口和至少部分地围绕凹口并面向结构前部的凸缘表面。 芯片设置在凹陷中，使得具有触点的芯片的前表面朝向结构的前部。 其上具有端子的柔性电介质膜放置在凸缘表面上，并且柔性材料设置在膜和凸缘表面之间。 胶片上的端子连接到芯片上的触点。 胶片上的各个端子相对于保护结构是可移动的，这有助于热膨胀的安装和补偿。

公开(公告)号：US06202297B1

公开(公告)日：2001-03-20

申请号：US09079336

申请日：1998-05-14

申请人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

发明人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H05K330

CPC分类号： H05K7/1084 ,  H01R12/714 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

摘要： A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.

摘要翻译： 具有凸起引线的微电子器件的连接器和用于制造和使用连接器的方法。 电介质基板具有从前表面向上延伸的多个柱。 柱可以以每组在其间限定间隙的柱组的排列布置。 大体层状接触从每个顶部延伸。 凸块引线各自插入在相应的间隙内，从而使其接触，当其继续插入时，触头抵靠凸起引线。 通常，当凸块引线插入到间隙中时，触头的远端部分向下偏转朝向基板并向外远离间隙的中心。

公开(公告)号：US5934914A

公开(公告)日：1999-08-10

申请号：US845016

申请日：1997-04-22

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06744 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R3/00 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L24/81 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

公开(公告)号：US5776796A

公开(公告)日：1998-07-07

申请号：US726697

申请日：1996-10-07

申请人： Thomas H. Distefano ,  John W. Smith ,  Joseph Fjelstad ,  Craig S. Mitchell ,  Konstantine Karavakis

发明人： Thomas H. Distefano ,  John W. Smith ,  Joseph Fjelstad ,  Craig S. Mitchell ,  Konstantine Karavakis

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/50 ,  H01L24/97 ,  H01L2224/11003 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042

摘要： A method of encapsulating a semiconductor device. The encapsulation method includes a semiconductor chip package assembly having a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has conductive leads thereon, the leads being electrically connected to terminals on a first end and bonded to respective chip contacts on a second end. Typically, the spacer layer is comprised of a compliant or elastomeric material. A protective layer is attached on a bottom surface of the substrate so as to cover the terminals on the substrate. A flowable, curable encapsulant material is deposited around a periphery of the semiconductor chip after the attachment of the protective layer so as to encapsulate the leads. The encapsulant material is then cured. Typically, this encapsulation method is performed on a plurality of chip assemblies simultaneously.

摘要翻译： 一种封装半导体器件的方法。 封装方法包括：半导体芯片封装组件，其具有在片状基板的顶表面和半导体芯片的接触支承表面之间的间隔层，其中，所述基板在其上具有导电引线，所述引线电连接到 第一端并且在第二端上结合到各个芯片触点。 通常，间隔层由顺应性或弹性体材料构成。 保护层附着在基板的底面，以覆盖基板上的端子。 在安装保护层以便封装引线之后，可流动的可固化的密封剂材料围绕半导体芯片的周边沉积。 然后固化密封材料。 通常，这种封装方法同时在多个芯片组件上执行。